MSM64424-XXXMS-K

MSM64422 OKI | Alldatasheet

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Technical content

¡ Semiconductor MSM64422/64424 ¡ Semiconductor MSM64422/64424 Built-in 256/512-Bit EEPROM and LCD Driver 4-Bit Microcontroller GENERAL DESCRIPTION The MSM64422/64424 is a low power 4-bit microcontroller using OKI original CPU core nX-4/ 20. Integrated into a single chip are 64/128 nibbles of EEPROM, PWM generation circuit, 8-bit timer counter, 8-bit synchronous serial port, time base counter, low voltage detection circuit, watchdog timer, 4-bit input port, one or two input-output port(s). For the oscillator circuit, it is possible to choose from the crystal oscillation circuit or the 3-pin RC oscillation circuit (resistor R and capacitor C are externally connected). Most suitable for small-sized security systems such as the key-less entry.

FEATURES

• Operating range CPU operating voltage : 2.5 to 5.5V (crystal oscillation mode) : 1.7 to 5.5V (RC oscillation mode) EEPROM write voltage : 2.2 to 5.5V Operating frequencies : fmax = 2.4 MHz (crystal oscillation mode) : fmax = 1.2 MHz (RC oscillation mode) Operating temperature : Ta=–40 to +85°C
• Memory space <MSM64422> ROM (program memory) : 2048 bytes RAM (data memory) : 64 nibbles EEPROM : 64 nibbles (Number of data rewriting cycles to EEPROM: 10,000) (EEPROM data retaining years: 10 Years) <MSM64424> ROM (program memory) : 4096 bytes RAM (data memory) : 128 nibbles EEPROM : 128 nibbles (Number of data rewriting cycles to EEPROM: 10,000) (EEPROM data retaining years: 10 Years)
• Functions PWM generation circuit (each pulse width, and pulse period is set by a 4-bit counter) 8-bit timer counter (automatic reload timer) 8-bit synchronous serial port Standby functions Low voltage detection circuit built in. Watchdog timer
• Interrupt sources : internal 5 sources : external 1 source Preliminary E2E0039-27-Y3 This version: Jan. 1998 Previous version: Mar. 1996

¡ Semiconductor MSM64422/64424

• I/O Port Input port : 1 port ¥ 4 bits Input-output port : 1 port ¥ 4 bits (MSM64422) 2 ports ¥ 4 bits (MSM64424) (Two of them provide 10mA sink current when VDD ≥ 2.5V)
• Package Options: <MSM64422> 16-pin plastic SOP (SOP16-P-300-1.27-K) (Product name: MSM64422-¥¥¥MS-K) <MSM64424> 20-pin plastic SSOP (SSOP20-P-250-0.95-K) (Product name: MSM64424-¥¥¥MS-K) 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM64424-¥¥¥GS-K)
• MTP Version The MTP version MSM64Q424 (24-pin plastic SOP only) using EEPROM in place of the internal program memory is available. <MSM64Q424> 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM64Q424-N GS-K)

¡ Semiconductor MSM64422/64424 BLOCK DIAGRAM Time base counter OSC/XT clock generation Watchdog timer EEPROM 64N Interrupt control CPU core (nX-4/20) ROM 2Kbytes RAM 64N PWN generation circuit 8-bit timer counter 8-bit synchronous serial port Low voltage detection circuit PORT1 PORT0 P1.0-P1.3 P0.0-P0.3 OSC0/XT OSC1/XT OSC2 VDD GND TEST RESET Databus *SIN *SOUT*SCLK *PWM Note: * means the secondary function for each port. MSM64422 Block Diagram Time base counter OSC/XT clock generation Watchdog timer EEPROM 128N Interrupt control CPU core (nX-4/20) ROM 4Kbytes RAM 128N PWN generation circuit 8-bit timer counter 8-bit synchronous serial port Low voltage detection circuit PORT1 PORT0 P1.0- P1.3 P0.0- P0.3 OSC0/XT OSC1/XT OSC2 VDD GND TEST RESET PORT2 P2.0- P2.3 Databus *SIN *SOUT*SCLK *PWM Note: * means the secondary function for each port. MSM64424 Block Diagram

¡ Semiconductor MSM64422/64424 P0.2/XI2 P0.3/XI3 VDD TEST RESET GND P1.0/PWM P1.1/SIN P0.1/XI1 P0.0/XI0 OSC2 OSC1/XT OSC0/XT NC P1.3/SCLK P1.2/SOUT P0.2/XI2 P0.3/XI3 VDD TEST RESET GND P2.0 P2.1 P1.0/PWM P1.1/SIN P0.1/XI1 P0.0/XI0 OSC2 OSC1/XT OSC0/XT NC P2.3 P2.2 P1.3/SCLK P1.2/SOUT P0.2/XI2 NC P0.3/XI3 VDD TEST RESET GND P2.0 P2.1 P1.0/PWM NC P1.1/SIN P0.1/XI1 NC P0.0/XI0 OSC2 OSC1/XT OSC0/XT PGM P2.3 P2.2 P1.3/SCLK NC P1.2/SOUT P0.2/XI2 NC P0.3/XI3 VDD TEST RESET GND P2.0 P2.1 P1.0/PWM NC P1.1/SIN P0.1/XI1 NC P0.0/XI0 OSC2 OSC1/XT OSC0/XT NC P2.3 P2.2 P1.3/SCLK NC P1.2/SOUT PIN CONFIGURATION (TOP VIEW) MSM64424 (20-Pin Plastic SSOP) MSM64424 (24-Pin Plastic SOP) MSM64Q424 (24-Pin Plastic SOP) MSM64422 (16-Pin Plastic SOP) NC: No-connection pin

¡ Semiconductor MSM64422/64424 PIN CONFIGURATIONS Basic Functions Function Symbol Type

Description

Pin (5V) Power Supply GND Pin (0V) Test TEST I Input pin for IC test A system reset input pin. When this pin changes to "L" level from "H", the internal condition is initialized, and with the level change to "H" from "L", the command execution is started from the address 000H. Reset RESET I P0.0/XI0 I 4-bit input port (P0). Each bit can be configured to be a pull-down resistor input or high impedance input. As the secondary function, an external interrupt is allocated to each pin. P0.1/XI1 I P0.2/XI2 I P0.3/XI3 I P1.0/PWM I/O 4-bit input/output port (P1). At the time of input mode, each bit can be configured to be a pull-down resistor input or high impedance input. At the time of output mode, each bit can be configured to be an Nch open drain output or CMOS output. As the secondary function, it becomes an input-output pin that is related to serial port and PWM output. P1.1/SIN I/O P1.2/SOUT I/O P1.3/SCLK I/O Port* P2.0 I/O 4-bit input-output port (P2). At the time of input mode, each bit can be configured to be a pull-down resistor input or high impedance input. At the time of output mode, each bit can be configured to be an Nch open drain output or CMOS output. P2.1 I/O P2.2 I/O P2.3 I/O OSC0/XT I Pins for connectiong an oscillator or RC (capacitor C, resistor R is externally connected). Oscillation OSC1/XT O OSC2 O Pin for setting a EEPROM write/read mode. The device enters a EEPROM write/read mode, when a logic "1" is input to this pin to release a reset. This pin is left open in a normal operating mode. PGM PGM I/O The P2.0-2.3 pins are only built into MSM64424.

¡ Semiconductor MSM64422/64424 Secondary Functions Functions Symbol Type P0.0/XI0 This is an input pin for external interrupt. Interrupt by level change is possible. Each bit can be configured to be an interrupt disable or enable by the port 0 interrupt enable register. P0.1/XI1 P0.2/XI2 I P0.3/XI3 PWM P1.1/SIN I Receive data input pin of the serial port. Serial port P1.2/SOUT O P1.3/SCLK I/O External Interrupt P1.0/PWM O PWM output waveform pin Transmit data output pin of the serial port. Synchronous clock input-output pin for the serial port.

¡ Semiconductor MSM64422/64424 MEMORY MAPS Program Memory The program memory is a memory area for the program data, the interrupt area, the CZP area, and the start address area. The data length is 8 bits. For the MSM64422 addresses 0 to 2047 are assigned to the program memory. For the MSM64424 address 0 to 4095 are assigned to the program memory. Program area Interrupt area CZP area Start address area 000H 12B 16B 2048B (4096B) 010H 020H 030H 7FFH (0FFFH) 8 bits Note : "B" means data length of 8 bits. Program Memory Address Space The address 000H is the instruction execution start address after system reset. The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of 1-byte call instruction and a maximum of eight commands can be held. The interrupt address from address 020H to 02FH is assigned the start address of interrupt subroutines.

¡ Semiconductor MSM64422/64424 Data Memory RAM, EEPROM and special function registers (SFRs) are assigned to the Data Memory Address Space. These Memory are located in a different address space from program memory. The data length of the Data Memory is 4 bits (1 nibble). The Data Memory uses two banks (256 nibbles/bank): one for the SFR and EEPROM areas using part of the bank 0 and the other for the RAM area, containing the stack in the bank 7. BANK7 BANK0 4 bits 4 bits RAM area Data/Stack area 128N 128N Inaccessible area EEPROM area SFR area HALT MIEF Other SFR area 124N 07FH 07EH 07DH 07CH 000H 000H 07FH 0FFH 1FFH 2FFH 3FFH 4FFH 5FFH 6FFH 7FFH Stack pointer EEPROM area 128N 128N 128N (MSM64424) (MSM64424) BANK0 0FFH 080H Data/Stack area 64N 64N (MSM64422) EEPROM area 64N 64N (MSM64422) Note : "N" means data length of 4 bits. Data Memory Address Space The Data Memory Address Space configuration is shown in the figure alove. The stack area is a data save area for subroutines and interrupts from the address 7FFH toward the lower-order addresses (64N max. for MSM64422, 128N max. for MSM64424) by subroutine call instruction. For the bank 0, the special function register area from the addresses from 000H to 07FH and 64 nibble EEPROM area from the addresses 080H to 0BFH for MSM64422 or 128 nibble EEPROM area from the addresses 080H to 0FFH for MSM64424 are assigned.

¡ Semiconductor MSM64422/64424 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Power Supply Voltage VDD –0.3 to 6 Interrupt Voltage VIN Ta=25°C –0.3 to VDD+0.3 V Output Voltage VOUT –0.3 to VDD+0.3 Storage Temperature TSTG –55 to +150 RECOMMENDED OPERATING CONDITIONS Parameter Symbol Range Unit Power Supply Voltage 1 (Crystal oscillation mode) 2.5 to 5.5 Power Supply Voltage 2 (RC oscillation mode) VDD 1.7 to 5.5 V Power Supply Voltage 3 (EEPROM write mode) 2.2 to 5.5 Operating Frequency 1 (Crystal oscillation mode) fOSC 0.5 to 2.4 MHz Operating Frequency 2 (RC oscillation mode) 0.1 to 1.2 MHz Operating Temperature Ta –40 to +85 RC Oscillation Resistance RC Oscillation Capacitance RC Oscillation Time Constant ROSC COSC C*R kW pF

¡ Semiconductor MSM64422/64424

ELECTRICAL CHARACTERISTICS

Min. Max. Unit VIH 0.7 ¥ VDD Input Voltage VIL 0.2 ¥ VDD V Input Current 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) IIH1 VIH=VDD mA IIL1 VIL=GND Input Current 2 (RESET) IIH2 VIH=VDD IIL2 VIL=GND – 200 – 50 mA Pull-down Resistance (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) VDD=2.5V RON VI=2.5V 200 kW VDD=2.5V Output Current 1 (P1.0, P1.1) IOH1 VO=VDD–0.5V – 0.5 mA IOL1 VDD=2.5V, VO=1.0V Static Current Consumption IDDS VDD=5.5V, fOSC=0Hz 0.3 VDD=5.5V, fOSC=0Hz 1.0 mA CPU in operation Dynamic Current Consumption IDD1 2.0 mA IDD2 4.0 mA VDD=2.5V Output Current 2 (P1.2, P1.3) (P2.0 to P2.3) IOH2 VO=VDD–0.5V – 0.5 mA IOL2 VDD=2.5V, VO=0.5V 0.5 During write to EEPROM VDD=5.0V fOSC=500kHz (Ta=–40 to +85°C) *1 No pull-down resistor during input state. *2 Ta=–40 to +50°C

¡ Semiconductor MSM64422/64424 (Unit : mm) PACKAGE DIMENSIONS Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SOP16-P-300-1.27-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin Cu alloy Solder plating 5 mm or more 0.21 TYP. Mirror finish

¡ Semiconductor MSM64422/64424 (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SSOP20-P-250-0.95-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.18 TYP. Mirror finish

¡ Semiconductor MSM64422/64424 (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SOP24-P-430-1.27-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP. Mirror finish