MSM64162 OKI | Alldatasheet

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¡ Semiconductor MSM64162 ¡ Semiconductor MSM64162 4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver GENERAL DESCRIPTION The MSM64162 is a low power 4-bit microcontroller that employs Oki's original CPU core nX- 4/20. The MSM64162 has 2-channel RC oscillation type A/D converter, LCD driver for up to 80 segments, and buzzer output port. It is best suited for applications such as low power, high precision thermometers and hygrometers.

FEATURES

  • Operating range Operating frequencies : 32.768 kHz, 400 kHz Operating voltage : 1.25 to 1.7 V (1.5 V spec.) 2.0 to 3.5 V (3 V spec.) 2.2 to 3.5 V (3 V spec., 1/2 duty) Operating temperature : –40 to +85 °C
  • Memory space Internal program memory : 2016 bytes Internal data memory : 128 nibbles
  • Minimum instruction execution time : 7.5 ms @ 400 kHz 91.6 ms @ 32.768 kHz
  • RC oscillation type A/D converter : 2 channels
  • LCD driver : 24 outputs; duty ratio switchable by software (1) At 1/4 duty and 1/3 bias : 80 segments (max) (2) At 1/3 duty and 1/3 bias : 63 segments (max) (3) At 1/2 duty and 1/2 bias : 44 segments (max)
  • Buzzer driver : 1 output (4 output modes selectable)
  • Capture circuit : 2 channels
  • Watchdog timer
  • Clock : 32.768 kHz crystal oscillator and 400 kHz RC oscillator (with an external resistor) CPU clock : 32.768 kHz/400 kHz (switchable by software) Time base clock : 32.768 kHz
  • Power supply voltage : 1.5 V/3 V (selectable by mask option)
  • I/O port Input-output port : 2 ports ´ 4 bits Input port : 1 port ´ 4 bits Output port : 1 port ´ 4 bits (8 out of the 24 LCD driver outputs can be used as output-only ports by mask option.)
  • Interrupt sources External interrupt : 2 sources Internal interrupt : 7 sources
  • Battery check circuit : 1 (incorporated into the input-only port) E2E0033-38-93 This version: Sep. 1998 Previous version: Mar. 1996

¡ Semiconductor MSM64162

  • Package options: 64-pin plastic QFP (QFP64-P-1420-1.00-BK) : (Product name : MSM64162-´´´GS-BK) 80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64162-´´´GS-BK-F) Chip : (Product name : MSM64162- ´´´) ´´´ indicates a code number.

¡ Semiconductor MSM64162 BLOCK DIAGRAM TR2 TR0 PCM C ALU BA H L XY ROM 2016B RAM 128N (8) INT ADCBD ROMRSPTIMING CONTROLLER VR 2CLK (4) PCL PCH TR1 A11 to A8 DB7 to DB0 (8) VSSL XT XT OSC1 OSC2 (4) (4) A7 to A0 IR DECODER IR INTC P3.3 P3.2 P3.1 P3.0 PORT3 INT WDT P2.3 P2.2 P2.1 P2.0 PORT2 INT INT BC P1.3 P1.2 P1.1 P1.0 PORT1 P0.3 P0.2 P0.1 P0.0 PORT0 INT CAPR PORT ADDRESS DB7 to DB0 TBC INT5 BIAS VSS1 RSTGRESET TSTTST1 TST2 LCD L23 VSS2 VSS3 VDD BSR HALT MIEF CPU CORE: nX-4/20 BD RT1 RS1 CS1 IN1 RT0 CRT0 RS0 CS0 IN0

¡ Semiconductor MSM64162 PIN CONFIGURATION (TOP VIEW) 64-Pin Plastic QFP L18/P5.2 L17/P5.1 L16/P5.0 L15 L14 L13 L12 L11 L10 TST2 TST1 RESET XT XT OSC2 OSC1 VDD L23/P6.3 L22/P6.2 L21/P6.1 L20/P6.0 L19/P5.3 P0.0 P0.1 P0.2 P0.3 RT0 CRT0 RS0 CS0 IN0 IN1 CS1 RS1 RT1 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 BD P1.0 P1.1 P1.2 P1.3 V SS1 VSS2 VSSL VSS3

¡ Semiconductor MSM64162 PIN CONFIGURATION (TOP VIEW) (continued) 80-Pin Plastic QFP Notes: 1. Pins marked as (NC) are no-connection pins which are left open. 2. VDD should be supplied from pin 74. Pin 32 is internally connected to V DD. C141 C242 L043 L144 L245 L346 L447 L548 L649 L750 L851 L952 (NC)53 L1054 L1155 L1256 L1357 L1458 (NC)59 L1560 L16/P5.061 L17/P5.162 L18/P5.263 L19/P5.364 VSS3 40 VSSL 39 (NC) 38 VSS2 37 VSS1 36 P1.3 35 P1.2 34 (NC) 33 (VDD) 32 P1.1 31 (NC) 30 P1.0 29 (NC) 28 BD 27 P3.3 26 P3.2 25 (NC) P3.1 (NC) P3.0 P2.3 P2.2 P2.1 P2.0 RT1 RS1 (NC) CS1 IN1 IN0 CS0 RS0 CRT0 (NC) RT0 P0.3 P0.2 P0.1 P0.0 TST2 L20/P6.0 L21/P6.1 (NC) L22/P6.2 L23/P6.3 (NC) OSC1 OSC2 (NC) V DD (NC) XT XT (NC) RESET TST1

¡ Semiconductor MSM64162 PAD CONFIGURATION Pad Layout Chip Size : 4.69 mm ´ 4.41 mm Chip Thickness : 350 mm (typ.) Coordinate Origin : Chip center Pad Hole Size : 110 mm ´ 110 mm Pad Size : 130 mm ´ 130 mm Minimum Pad Pitch : 180 mm Note: The chip substrate voltage is V DD. 1 2 3 4 5 6 78 9 1 0 1 1 1 2 1 31 41 51 61 71 8 3334353637383940414647484950 y x 4544 43 42

¡ Semiconductor MSM64162 Pad Coordinates Pad No. Y (µm)X (µm)Pad Name 1 –2042 –2168L0

27 V DD

30 RESET

31 TST1

–1714 Pad No. Y (µm)X (µm)Pad Name 33 2042 P0.0 34 P0.1 35 P0.2 36 P0.3

37 RT0

38 CRT0

39 RS0

40 CS0

41 IN0

46 P2.0 47 P2.1 48 P2.2 49 P2.3 50 P3.0 51 1829 P3.1 52 1563 P3.2 53 1382 P3.3 54 1017 BD 55 P1.0 56 P1.1 57 P1.2 58 P1.3 59 V SS1

60 V SS2

61 V SSL

62 V SS3

–1424 2168 328 –1134 1899 –844 1628 –353 –554 1364 –645316 1100 –826606 829 –1254896 565 –14351186 349 –16161476 141 –1796 –911 –1160 –1416 –1666 –1916 –21682168 L10 L11 L12 L13 L14 L15 L16/P5.0 L17/P5.1 L18/P5.2 L19/P5.3 L20/P6.0 L21/P6.1 L22/P6.2 L23/P6.3 2168 2168 2168 2168 2168 2168 2168 2168 2168 2168 –1918 –1669 –1426 –1170 –934 –727 –519 –312 –104 104 311 527 791 1062 1340 1618 1897 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2042 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 –2168 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042 2042

25 OSC1

26 OSC2

–264 2168 2168

32 TST2 17662168

43 CS1

44 RS1

45 RT1

–274 –482 –689 2042 2042 2042

42 IN1 –67 2042

¡ Semiconductor MSM64162 PIN DESCRIPTIONS The following tables describe the pin basic functions and secondary functions of the MSM64162. For pin, "64QFP" and "80QFP" denote 64-pin flat package and 80-pin flat package respectively. Basic Functions Function Symbol Pin Pad Type Description 27 27 — 0 V power supplyVDD 59 59 — Negative power supply (for 1.5 V spec.) Bias output for drivig LCD (–1.5 V) (for 3.0 V spec.)VSS1 60 60 — Negative power supply (for 3.0 V spec.) Bias output for driving LCD (–3.0 V) (for 1.5 V spec.)VSS2 Power Supply 62 62 — Bias output for driving LCD (–4.5 V).VSS3 63 63 — Pins for connecting a capacitor for generating LCD driving bias 64 64 —C2 61 61 — Negative power supply for internal logic (An internally generated constant voltage is present at this pin.) V SSL Oscillation 29 29 O Low-speed clock oscillation input and output pins: Connect to a crystal (32.768 kHz).XT 26 26 OOSC2 31 31 ITST1Test 32 32 ITST2 Reset 30 30 I System reset input pin. Setting this pin to "L" level puts this device into a reset state. Then, setting this pin to "H" level starts executing an instruction from address 000H. A pull-up resistor is internally connected to this pin. RESET Input pins for testing. A pull-up resistor is internally connected to these pins. 25 25 IOSC1 28 28 IXT High-speed clock oscillation input and output pins: Connect to an external resistor for oscillation (ROS). 64QFP 80QFP

¡ Semiconductor MSM64162 Basic Functions (continued) Function Symbol Pin Pad Type Description 4-bit input port (P0): Selectable as pull-up resistor input, pull-down resistor input, or high impedance input by the port 01 control register (P01CON). As secondary functions, P0.0 to P0.3 are assigned external interrupt functions, P0.0 and P0.1 are assigned a capture trigger function, and P0.3 is assigned an analog comparator input for battery check. Ports 37 37 O Resistance temperature sensor connection pin (for channel 0)RT0 38 38 O A/D Converter Resistance/capacitance temperature sensor connection pin (for channel 0) 39 39 ORS0 Reference resistor connection pin (for channel 0) 40 40 OCS0 Reference capacitor connection pin (for channel 0) CRT0 P0.0 33 33 I P0.1 34 34 I P0.2 35 35 I P0.3 36 36 I 4-bit output port (P1): Selectable as NMOS open drain output or CMOS output by the port 01 control register (P01CON). P1.0 is a high current drive output port. P1.0 55 55 O P1.1 56 56 O P1.2 57 57 O P1.3 58 58 O 4-bit input-output port (P2): Following can be specified for each bit by the port 2 control registers 0 to 3 (P20CON to P23CON): (1) input or output, (2) pull-up/pull-down resistor input or high impedance input, and (3) NMOS open drain output or CMOS output. As secondary functions, P2.0 to P2.3 are assigned external interrupt functions. P2.0 46 46 I/O P2.1 47 47 I/O P2.2 48 48 I/O P2.3 49 49 I/O 4-bit input-output port (P3): Following can be specified for each bit by the port 3 control registers 0 to 3 (P30CON to P33CON): (1) input or output, (2) pull-up/pull-down resistor input or high impedance input, and (3) NMOS open drain output or CMOS output. As secondary functions, P3.0 to P3.3 are assigned external interrupt functions, P3.3 is assigned a function that monitors the RC oscillation clock for A/D converter. P3.0 50 50 I/O P3.1 51 51 I/O P3.2 52 52 I/O P3.3/MON 53 53 I/O 41 41 I Input pin for RC oscillator circuit (for channel 0)IN0 45 45 O Resistance temperature sensor connection pin (for channel 1) 44 44 ORS1 Reference resistor connection pin (for channel 1) 43 43 OCS1 Reference capacitor connection pin (for channel 1) RT1 54 54 O Output pin for the buzzer driverBDBuzzer 42 42 IIN1 Input pin for RC oscillator circuit (for channel 1) 64QFP 80QFP

¡ Semiconductor MSM64162 Basic Functions (continued) Function Symbol Pin Pad Type Description 1OL0 2OL1 3OL2 LCD segment and common signals output pins. 4OL3 5OL4 6OL5 7OL6 8OL7 9OL8

10 OL9

11 OL10

12 OL11

13 OL12

14 OL13

15 OL14

16 OL15

17 OL16/P5.0 18 OL17/P5.1 19 OL18/P5.2 20 OL19/P5.3 21 OL20/P6.0 22 OL21/P6.1 23 OL22/P6.2 24 OL23/P6.3 LCD segment and common signals output pins. Functions as output ports by mask option. LCD Driver 64QFP 80QFP

¡ Semiconductor MSM64162 Secondary Functions Function Symbol Pin Pad Type Description 33 IP0.0Capture Trigger 34P0.1 RC Oscillation Monitor 53 O Secondary function of P3.3: Monitor output pin for an RC oscillation clock for A/D converter and a 400 kHz RC oscillation clock for the system clock. P3.3 Secondary functions of P0.0 and P0.1: Capture circuit trigger input pins. External Interrupt 34 I Secondary functions of P0.0 to P0.3: Level-triggered external interrupt input pins. The change of input signal level causes an interrupt to occur. P0.1 36P0.3 35P0.2 33P0.0 Secondary functions of P2.0 to P2.3 and P3.0 to P3.3: Level-triggered external interrupt input pins. The change of input signal level causes an interrupt to occur. P2.1 49 IP2.3 48P2.2 46P2.0 51P3.1 53P3.3 52P3.2 50P3.0 Battery Check 36 I Secondary function of P0.3: Analog comparator input pin for battery check.P0.3 64QFP 80QFP

¡ Semiconductor MSM64162 MEMORY MAPS Program Memory 07FFH 07E0H 03EH 020H 010H 000H Start address CZP area Interrupt area Test program area 32 bytes 2016 bytes 8 bits Contents of interrupt area 03BH 038H 032H 02FH 02CH 029H 026H 023H 020H Watchdog interrupt External interrupt (0) External interrupt (1) ADC interrupt

256 Hz interrupt

32 Hz interrupt

16 Hz interrupt

1 Hz interrupt

4 Hz interrupt

Address 000H is the instruction execution start address by the system reset. The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of 1-byte call instruction. The start address of interrupt subroutine is assigned to the interrupt address from address 020H to 03DH. The user area has 2016 bytes of address 000H to address 07DFH. No program can be stored in the test program area.

¡ Semiconductor MSM64162 Data Memory The data memory area consists of 8 banks and each bank has 256 nibbles (256 ´ 4 bits). The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0. 7FFH BANK 7 Data RAM area 4 bits 780H 0FFH 080H 07FH 000H Unused area BANK 0 Data/Stack area (128 nibbles) Contents of 000H to 07FH SFR area 07FH 000H Inaccessible area Unused area 77FH 700H 100H Data Memory Map The data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call Instruction and 8 nibbles are used by an interrupt. The addresses 080H to 0FFH of BANK 0 and the addresses 700H to 77FH of BANK 7 are not assigned as the data memory, so access to these addresses has no effect. Moreover, it is impossible to access BANK 1 to BANK 6.

¡ Semiconductor MSM64162 ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.) Parameter Symbol Condition Rating Unit (VDD = 0 V) Power Supply Voltage 1 V SS1 Ta = 25°C –2.0 to +0.3 V Power Supply Voltage 2 V SS2 Ta = 25°C –4.0 to +0.3 V Power Supply Voltage 3 V SS3 Ta = 25°C –5.5 to +0.3 V Input Voltage 1 V IN1 VSS1 Input, Ta = 25°C V SS1 – 0.3 to +0.3 V Output Voltage 1 V OUT1 VSS1 Output, Ta = 25°C V SS1 – 0.3 to +0.3 V Output Voltage 2 V OUT2 VSS2 Output, Ta = 25°C V SS2 – 0.3 to +0.3 V Output Voltage 3 V OUT3 VSS3 Output, Ta = 25°C V SS3 – 0.3 to +0.3 V Storage Temperature T STG — –55 to +150 °C Power Supply Voltage 4 V SSL Ta = 25°C –2.0 to +0.3 V Input Voltage 2 V IN2 VSSL Input, Ta = 25°C V SSL – 0.3 to +0.3 V Output Voltage 4 V OUT4 VSSL Output, Ta = 25°C V SSL – 0.3 to +0.3 V RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.) Parameter Symbol Condition Range Unit (VDD = 0 V) —Operating Temperature Top –40 to +85 °C —External 400 kHz RC Oscillator Resistance ROS 250 to 500 k W —Crystal Oscillation Frequency fXT 30 to 35 kHz Operating Voltage VSS1 –1.7 to –1.25 V

¡ Semiconductor MSM64162 ELECTRICAL CHARACTERISTICS (1.5 V Spec.) DC Characteristics Parameter +100% –50% Symbol Condition Min. Typ. Max. Unit Measuring Circuit VSS2 Voltage V SS2 Ca, Cb, C12 = 0.1 mF –3.2 –3.0 –2.8 V VSS3 Voltage V SS3 Ca, Cb, C12 = 0.1 mF –4.7 –4.5 –4.3 V VSSL Voltage V SSL — –1.5 –1.3 –0.6 V Crystal Oscillation Start Voltage VSTA Oscillation start time: within 5 seconds — — –1.45 V Crystal Oscillation Hold Voltage VHOLD — — — –1.25 V Crystal Oscillation Stop Detection Time TSTOP — 0.1 — 1000 ms Internal Crystal Oscillator Capacitance CG — 1 01 52 0 p F External Crystal Oscillator Capacitance CGEX When external CG used 10 — 30 pF Internal Crystal Oscillator Capacitance CD — 1 01 52 0 p F Internal 400k RC Oscillator Capacitance COS — 8 12 16 pF 400k RC Oscillation Frequency fOSC External resistor ROS = 300 kW VSS1 = –1.25 to –1.7 V 80 220 350 kHz POR Generation Voltage VPOR1 When VSS1 is between VPOR1 and –1.5 V –0.4 — 0 V POR Non-generation Voltage VPOR2 No POR when VSS1 is between VPOR2 and –1.5 V –1.5 — –1.2 V +100% –50% (VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Battery Check Reference Voltage V RB Ta = 25°C –0.73 –0.63 –0.53 V VRB Temperature Variation DVRB — –2.0 — mV/°C— Notes: 1. "POR" denotes Power On Reset. 2. "T STOP" indicates that if the crystal oscillator stops over the value of T STOP, the system reset occurs.

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter Symbol Condition Min. Typ. Max. Unit Measuring Circuit Supply Current 1 I DD1 —2 5 mA Supply Current 2 I DD2 —51 5 mA Supply Current 3 I DD3 CPU in operating state (400k RC oscillation in operation) R OS = 300 kW —4 08 0 mA Supply Current 4 I DD4 CPU in halt state (400k RC oscillation halt), RC oscillator for A/D converter is in operating state — 150 230 mA (VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified) CPU in operating state (400k RC oscillation halt) CPU in halt state (400k RC oscillation halt) Ta = –40 to +40°C Ta = +40 to +85°C Ta = –40 to +40°C Ta = +40 to +85°C RT0 = 10 kW RT0 = 2 kW —23 0 mA —54 0 mA — 600 900 mA Supply Current 5 I DD5 Battery check circuit in operating state, CPU in operating state (400k RC oscillation halt) — 25 125 mA

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter (Pin Name) Symbol Condition Unit Measuring Circuit Output Current 1 (P1.0) IOH1 VOH1 = –0.5 V Min. Typ. Max. –2.1 –0.7 –0.2 mA IOL1 VOL1 = VSS1 + 0.5 V 1.0 3.0 9.0 mA Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) I IOL2 VOL2 = VSS1 + 0.5 V 0.2 0.7 2.1 mA Output Current 3 (BD) IOH3 VOH3 = –0.7 V –1.8 –0.6 –0.2 mA IOL3 VOL3 = VSS1 + 0.7 V 0.2 0.6 1.8 mA Output Current 4 (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOH4 VOH4 = –0.1 V –1.1 –0.6 –0.3 mA IOL4 VOL4 = VSS1 + 0.1 V 0.3 0.6 1.1 mA Output Current 5 (When L16 to L23 are configured as output ports) IOH5 VOH5 = –0.5 V –1.5 –0.5 –0.1 mA IOL5 VOL5 = VSS1 + 0.5 V 0.1 0.5 1.5 mA Output Current 6 (OSC2) IOH6 VOH6 = –0.5 V –2.1 –0.7 –0.2 mA IOL6 VOL6 = VSS1 + 0.5 V 0.2 0.7 2.1 mA IOH7 VOH7 = –0.2 V — — –4.0 mA IOMH7 VOMH7 = VSS1 + 0.2 V 4.0 — — mA IOMH7S VOMH7S = VSS1 – 0.2 V — — –4.0 mA IOML7 VOML7 = VSS2 + 0.2 V 4.0 — — mA IOML7S VOML7S = VSS2 – 0.2 V — — –4.0 mA IOL7 VOL7 = VSS3 + 0.2 V 4.0 — — mA Output Current 7 (L0 to L23) Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOOH VOH = VDD — — 0.3 mA IOOL VOL = VSS1 –0.3 — — mA VOH2 = –0.5 V (VDD level) (VSS1 level) (VSS1 level) (VSS2 level) (VSS2 level) (VSS3 level) (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified)

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter (Pin Name) Symbol Condition Unit Measuring Circuit Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) IIH1 VIH1 = VDD (when pulled down) Min. Typ. Max. 51 8 6 0 mA IIL1 VIL1 = VSS1 (when pulled up) –60 –18 –5 mA IIH1Z VIH1 = VDD (in a high impedance state) 0 — 1.0 mA IIL1Z VIL1 = VSS1 (in a high impedance state) –1.0 — 0 mA IIH2 VIH2 = VDD (when pulled down) 5 18 60 mA IIH2Z VIH2 = VDD (in a high impedance state) 0 — 1.0 mA IIL2Z VIL2 = VSS1 (in a high impedance state) –1.0 — 0 mA IIL3 VIL3 = VSS1 (when pulled up) –60 –22 –6 mA IIH3Z VIH3 = VDD (in a high impedance state) 0 — 1.0 mA IIL3Z VIL3 = VSS1 (in a high impedance state) –1.0 — 0 mA IIH4 VIH4 = VDD 0 — 1.0 mA IIL4 VIL4 = VSS1 –1.5 –0.75 –0.3 mA VIH1 — –0.3 — 0 V VIH2 — –0.3 — 0 V VIH3 — –0.3 — 0 V Input Current 2 (IN0, IN1) Input Current 3 (OSC1) Input Current 4 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2) (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified)

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter (Pin Name) Symbol Condition Unit Measuring Circuit Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Min. Typ. Max. DVT2 — 0.05 0.1 0.3 V CIN — — — 5.0 pF Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) DV T1 — 0.05 0.1 0.3 V (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified)

¡ Semiconductor MSM64162 Measuring circuit 1 Measuring circuit 2 VIH VIL (*1) VDD VSS1 VSS2 VSS3 (*2) A INPUT OUTPUT VSSL ROS Cl OSC1 OSC2 VSSL VDD VSS1 VSS2 VSS3 RT0 CS0 IN0 RT0 RI0 CS0 XT XT Crystal 32.768 kHz C12 CbCa V A V V Cl Ca, Cb, C12 ROS RT0 CS0 RI0 : 0.47 mF : 0.1 mF : 300 kW : 10 kW/2 kW : 820 pF : 10 kW

¡ Semiconductor MSM64162 Measuring circuit 3 VDD VSS1 VSS2 VSSL A (*3) INPUT OUTPUT VSS3 Measuring circuit 4 *1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins. VIH VIL (*3) VDD VSS1 VSS2 VSS3 INPUT OUTPUT VSSL Waveform Monitoring

¡ Semiconductor MSM64162 A/D Converter Characteristics * Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition. Parameter Symbol Condition Min. Typ. Max. Unit Measur- ing Circuit Resistor for Oscillation CS0, CT0, CS1 ³ 740 pF 2.0 kW Input Current Limiting Resistor Oscillation Frequency RS•RT Oscillation Frequency Ratio (*) RI0, RI1 fOSC1 fOSC2 fOSC3 Kf1 Kf2 Kf3 Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW 1.0 165 41.8 2.55 3.89 0.990 0.0561 221 52.2 3.04 4.18 1.0 0.0584 256 60.6 3.53 4.35 1.010 0.0637 kW kHz kHz RS0, RS1, RT0, RT0-1, RT1 kHz DD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified) Kfx = fOSCX (RS0–CS0 Oscillation) fOSCX (RT0–CS0 Oscillation) (x = 1, 2, 3) fOSCX (RT0-1–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation) fOSCX (RS1–CS1 Oscillation),,

¡ Semiconductor MSM64162 Measuring circuit 5 RT1 RS1 CS1 IN1 IN0 CS0 RS0 CRT0 RT0 P3.3 VSS1VSSLVDD RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 C l D. U. T. Frequency Measurement OSCX) (CROSC1) (CROSC0) RT1 RS1 CS1 RI1 RI0 CS0 RS0 CT0 RT0-1 RT0 Oscillation Mode Designation RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF C l = 0.1 mF

¡ Semiconductor MSM64162 ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.) Parameter Symbol Condition Range Unit Operating Temperature T op — –40 to +85 °C (VDD = 0 V) Using LCD driver with "duty 1/2" –3.5 to –2.2 Operating Voltage VSS2 Except using LCD driver with "duty 1/2" –3.5 to –2.0 V External 400 kHz RC Oscillator Resistance ROS — 90 to 500 k W Crystal Oscillation Frequency f XT — 30 to 66 kHz RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.) Parameter Symbol Condition Rating Unit (VDD = 0 V) Power Supply Voltage 1 V SS1 Ta = 25°C –2.0 to +0.3 V Power Supply Voltage 2 V SS2 Ta = 25°C –4.0 to +0.3 V Power Supply Voltage 3 V SS3 Ta = 25°C –5.5 to +0.3 V Input Voltage 1 V IN1 VSS2 Input, Ta = 25°C V SS2 – 0.3 to +0.3 V Output Voltage 1 V OUT1 VSS1 Output, Ta = 25°C V SS1 – 0.3 to +0.3 V Output Voltage 2 V OUT2 VSS2 Output, Ta = 25°C V SS2 – 0.3 to +0.3 V Output Voltage 3 V OUT3 VSS3 Output, Ta = 25°C V SSL – 0.3 to +0.3 V Storage Temperature T STG — –55 to +150 °C Power Supply Voltage 4 V SSL Ta = 25°C –4.0 to +0.3 V Input Voltage 2 V IN2 VSSL Input, Ta = 25°C V SSL – 0.3 to +0.3 V Output Voltage 4 V OUT4 VSSL Output, Ta = 25°C V SSL – 0.3 to +0.3 V

¡ Semiconductor MSM64162 ELECTRICAL CHARACTERISTICS (3.0 V Spec.) DC Characteristics Parameter +100% –50% Symbol Condition Min. Typ. Max. Unit Measuring Circuit VSS1 Voltage V SS1 Ca, Cb, C12 = 0.1 mF –1.7 –1.5 –1.3 V VSS3 Voltage V SS3 Ca, Cb, C12 = 0.1 mF –4.7 –4.5 –4.3 V VSSL Voltage V SSL — –1.9 –1.3 –0.6 V Crystal Oscillation Start Voltage VSTA Oscillation start time: within 5 seconds — — –2.0 V Crystal Oscillation Hold Voltage VHOLD — — — –2.0 V Crystal Oscillation Stop Detection Time TSTOP — 0.1 — 1000 ms Internal Crystal Oscillator Capacitance CG — 1 01 52 0 p F External Crystal Oscillator Capacitance CGEX When external CG used 10 — 30 pF Internal Crystal Oscillator Capacitance CD — 1 01 52 0 p F Internal 400k RC Oscillator Capacitance COS — 8 12 16 pF 400k RC Oscillation Frequency fOSC External resistor ROS = 100 kW VSS2 = –2.0 to –3.5 V 300 400 620 kHz POR Generation Voltage VPOR1 When VSS2 is between VPOR1 and –3.0 V –0.7 — 0 V POR Non-generation Voltage VPOR2 No POR when VSS2 is between VPOR2 and –3.0 V –3.0 — –2.0 V +100% –50% (VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified) Battery Check Reference Voltage V RB Ta = 25°C –0.73 –0.63 –0.53 V VRB Temperature Variation DVRB — –2.0 — mV/°C— Notes: 1. "POR" denotes Power On Reset. 2. "T STOP" indicates that if the crystal oscillator stops over the value of T STOP, the system reset occurs.

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter Symbol Condition Min. Typ. Max. Unit Measuring Circuit Supply Current 1 I DD1 — 1.5 4.5 mA Supply Current 2 I DD2 — 5.0 15 mA Supply Current 3 I DD3 CPU in operating state (400k RC oscillation in operation) R OS = 100kW — 220 450 mA Supply Current 4 I DD4 CPU in halt state (400k RC oscillation halt), RC oscillator for A/D converter is in operating state — 300 450 mA (VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified) CPU in operating state (400k RC oscillation halt) CPU in halt state (400k RC oscillation halt) Ta = –40 to +40°C Ta = +40 to +85°C Ta = –40 to +40°C Ta = +40 to +85°C RT0 = 10 kW RT0 = 2 kW — 1.5 30 mA — 5.0 40 mA — 1300 2000 mA Supply Current 5 I DD5 Battery check circuit in operating state, CPU in operating state (400k RC oscillation halt) — 55 150 mA

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter (Pin Name) Symbol Condition Unit Measuring Circuit Output Current 1 (P1.0) IOH1 VOH1 = –0.5 V Min. Typ. Max. –6.0 –2.0 –0.7 mA IOL1 VOL1 = VSS2 + 0.5 V 3.0 8.0 25 mA Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) I IOL2 VOL2 = VSS2 + 0.5 V 0.7 2.0 6.0 mA Output Current 3 (BD) IOH3 VOH3 = –0.7 V –6.0 –2.0 –0.7 mA IOL3 VOL3 = VSS2 + 0.7 V 0.7 2.0 6.0 mA Output Current 4 (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOH4 VOH4 = –0.1 V –2.5 –1.3 –0.7 mA IOL4 VOL4 = VSS2 + 0.1 V 0.7 1.3 2.5 mA Output Current 5 (When L16 to L23 are configured as output ports) IOH5 VOH5 = –0.5 V –1.5 –0.6 –0.15 mA Output Current 6 (OSC2) IOH6 VOH6 = –0.5 V –6.0 –2.0 –0.7 mA IOL6 VOL6 = VSS2 + 0.5 V 0.7 2.0 6.0 mA IOH7 VOH7 = –0.2 V — — –4.0 mA IOMH7 VOMH7 = VSS1 + 0.2 V 4.0 — — mA IOMH7S VOMH7S = VSS1 – 0.2 V — — –4.0 mA IOML7 VOML7 = VSS2 + 0.2 V 4.0 — — mA IOML7S VOML7S = VSS2 – 0.2 V — — –4.0 mA IOL7 VOL7 = VSS3 + 0.2 V 4.0 — — mA Output Current 7 (L0 to L23) Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOOH VOH = VDD — — 0.3 mA IOOL VOL = VSS2 –0.3 — — mA VOH2 = –0.5 V (VDD level) (VSS1 level) (VSS1 level) (VSS2 level) (VSS2 level) (VSS3 level) IOL5 VOL5 = VSS2 + 0.5 V 0.15 0.6 1.5 mA (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified)

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter (Pin Name) Symbol Condition Unit Measuring Circuit Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) IIH1 VIH1 = VDD (when pulled down) Min. Typ. Max. 30 90 300 mA IIL1 VIL1 = VSS2 (when pulled up) –300 –90 –30 mA IIH1Z VIH1 = VDD (in a high impedance state) 0 — 1.0 mA IIL1Z VIL1 = VSS2 (in a high impedance state) –1.0 — 0 mA IIH2 VIH2 = VDD (when pulled down) 30 90 300 mA IIH2Z VIH2 = VDD (in a high impedance state) 0 — 1.0 mA IIL2Z VIL2 = VSS2 (in a high impedance state) –1.0 — 0 mA IIL3 VIL3 = VSS2 (when pulled up) –300 –110 –10 mA IIH3Z VIH3 = VDD (in a high impedance state) 0 — 1.0 mA IIL3Z VIL3 = VSS2 (in a high impedance state) –1.0 — 0 mA IIH4 VIH4 = VDD 0 — 1.0 mA IIL4 VIL4 = VSS2 –3.0 –1.5 –0.75 mA VIH1 — –0.6 — 0 V VIH2 — –0.6 — 0 V VIH3 — –0.6 — 0 V Input Current 2 (IN0, IN1) Input Current 3 (OSC1) Input Current 4 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2) (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified)

¡ Semiconductor MSM64162 DC Characteristics (continued) Parameter (Pin Name) Symbol Condition Unit Measuring Circuit Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) Min. Typ. Max. DVT2 — 0.2 0.5 1.0 V CIN — — — 5.0 pF Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) DV T1 — 0.2 0.5 1.0 V (VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V, Ta = –40 to +85°C unless otherwise specified)

¡ Semiconductor MSM64162 Measuring circuit 1 Measuring circuit 2 VIH VIL (*1) VDD VSS1 VSS2 VSS3 A INPUT OUTPUT VSSL (*2) ROS Cl OSC1 OSC2 VSSL VDD VSS2 VSS1 VSS3 RT0 CS0 IN0 RT0 RI0 CS0 XT XT Crystal 32.768 kHz C12 CbCa V A V V Cl Ca, Cb, C12 ROS RT0 CS0 RI0 : 0.47 mF : 0.1 mF : 100 kW : 10 kW/2 kW : 820 pF : 10 kW

¡ Semiconductor MSM64162 Measuring circuit 3 VDD VSS1 VSS2 VSS3 A (*3) INPUT OUTPUT VSSL Measuring circuit 4 *1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins. VIH VIL (*3) VDD VSS1 VSS2 VSS3 INPUT OUTPUT VSSL Waveform Monitoring

¡ Semiconductor MSM64162 A/D Converter Characteristics Parameter Symbol Condition Min. Typ. Max. Unit Measur- ing Circuit Resistor for Oscillation CS0, CT0, CS1 ³ 740 pF 1.0 kW Input Current Limiting Resistor Oscillation Frequency RS•RT Oscillation Frequency Ratio(*) RI0, RI1 fOSC1 fOSC2 fOSC3 Kf1 Kf2 Kf3 Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW 1.0 200 46.5 2.79 4.115 0.990 0.0573 239 55.4 3.32 4.22 1.0 0.0616 277 64.3 3.85 4.326 1.010 0.0659 kW kHz kHz Kfx = fOSCX (RS0–CS0 Oscillation) fOSCX (RT0–CS0 Oscillation) (x = 1, 2, 3) RS0, RS1, RT0, RT0-1, RT1 kHz fOSCX (RT0-1–CS0 Oscillation) fOSCX (RS0–CS0 Oscillation) fOSCX (RT1–CS1 Oscillation) fOSCX (RS1–CS1 Oscillation),, (VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified) * Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.

¡ Semiconductor MSM64162 Measuring circuit 5 RT1 RS1 CS1 IN1 IN0 CS0 RS0 CRT0 RT0 P3.3 VSS2VSSLVDD RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 C l D. U. T. Frequency Measurement OSCX) (CROSC1) (CROSC0) RT1 RS1 CS1 RI1 RI0 CS0 RS0 CT0 RT0-1 RT0 Oscillation Mode Designation RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF C l = 0.47 mF

¡ Semiconductor MSM64162 FUNCTIONAL DESCRIPTION

  • A/D converter (ADC) The MSM64162 has a built-in 2-channel RC oscillation type A/D converter. The A/D converter is composed of a 2-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter), Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1 (ADCON0, ADCON1). By counting oscillation frequencies that vary depending on a resistor or capacitor connected to the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to corresponding digital values. By using a thermistor or humidity sensor as a resistance, a thermometer or a hygrometer can be constructed. By applying a separate sensor to each channel of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at two places.
  • LCD driver (LCD) The MSM64162 has a built-in LCD driver for 24 outputs. The LCD driver consists of 21 ´ 4-bit display registers (DSPR0-20), the Display Control Register (DSPCON), a 24-output LCD driver circuit, and a bias generation circuit (BIAS). There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the duty mode. A mask option can select either a common driver or a segment driver for each LCD driver pin. A mask option can also specify assignment of each bit of the display register to each segment. All the display registers must be selected by a mask option. L16 to L23 of the LCD driver can be configured to be output ports by a mask option. The relationship between the duty, the bias method, and the maximum segment number follows:
  • Buzzer driver (BD) The MSM64162 has a built-in buzzer driver with 2 buzzer output frequencies and 4 buzzer output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer Frequency Control Register (BFCON).
  • Capture circuit (CAPR) The MSM64162 captures 32 Hz to 256 Hz output of the time base counter at the falling of Port 0.0 or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to "H" level when the pull-down resistor input is chosen. The capture circuit is composed of the Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from the time base counter.
  • Watchdog timer (WDT) The MSM64162 has a built-in watchdog timer to detect CPU malfunction. The watchdog timer is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog timer control register (WDTCON) to reset WDTC.

¡ Semiconductor MSM64162

  • Clock generation circuit (2CLK) The clock generation circuit (2CLK) in the MSM64162 contains a 32.768 kHz crystal oscillation circuit, a 400 kHz RC oscillation circuit, and a clock control port. This circuit generates the system clock (CLK) and the time base clock (32.768 kHz). The system clock drives the CPU while the time base clock drives the time base counter and the buzzer driver. Via the contents of the frequency Control Register (FCON), the system clock can be switched between 32.768 kHz (the output of the crystal oscillation circuit) and 400 kHz (the output of the RC oscillation circuit). Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of an external resistor (R OS), operating power supply voltage (V DD), and ambient temperatures (Ta).
  • Time base counter (TBC) The MSM64162 has a built-in time base counter (TBC) that generates clocks to be supplied to internal peripheral circuits. The time base counter is composed of 15 binary counters. The count clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture circuit.
  • I/O port Input-output ports (P2, P3) (8 bits) : Pull-up (pull-down) resistor input or high- impedance input, CMOS output or NMOS open drain output: these can be specified for each bit; external 0 interrupt Input port (P0) (4 bits) : Pull-up (pull-down) resistor input or high- impedance input; external 1 interrupt Output port (P1) (4 bits) : CMOS output or NMOS open drain output
  • Interrupt (INTC) The MSM64162 has 9 interrupt sources (9 vector addresses), of which two are external interrupts from ports and seven are internal interrupts. Of the nine interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). The other eight interrupts are controlled by the master interrupt enable flag (MI) and the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU branches to a vector address corresponding to the interrupt source.
  • Battery check circuit (BC) The battery check circuit (BC) detects the level of the supply voltage by comparing the voltage generated by an external supply-voltage dividing resistor (RBLD) with the internal reference voltage (Vrb).

¡ Semiconductor MSM64162 APPLICATION CIRCUITS 1.5 V Spec. Application Circuit L23 L0OSC2 OSC1 XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 TST1 TST2 VSSL VSS1 VSS2 VSS3 VDD 1.5 V C12 Cb Cl ROS Crystal 32.768 kHz Switch matrix (4 ´ 4) RT1 RS1 CS1 RI1 RS0 RT0 Buzzer OSC monitor IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P3.3 MSM64162-xxx (1.5 V spec.) L C D Ca RI0 CS0

  • Temperature measurement by two thermistors
  • C G of crystal oscillator : Internal

¡ Semiconductor MSM64162 RT1 RS1 CS1 RI1 L23 L0OSC2 OSC1 XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3 TST1 TST2 V SSL VSS1 VSS2 VSS3 VDD 3 V C12 Cb Ca Cl ROS Crystal 32.768 kHz CGEX RI0 RT0 RBLD Buzzer OSC monitor IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P3.3 P3.1 MSM64162-xxx (3.0 V spec.) L C D CS0RS0

  • Temperature measurement by two thermistors
  • Battery check circuit is used
  • C GEX of crystal oscillator : External Switch matrix (4 ´ 4) APPLICATION CIRCUITS (continued) 3.0 V Spec. Application Circuit

¡ Semiconductor MSM64162 (Unit : mm) PACKAGE DIMENSIONS Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP64-P-1420-1.00-BK Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.25 TYP. Mirror finish

¡ Semiconductor MSM64162 (Unit : mm) QFP80-P-1420-0.80-BK Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP. Mirror finish Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).