MSM5052 OKI | Alldatasheet

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Technical content

¡ Semiconductor GENERAL DESCRIPTION The MSM5052 is a low-power microcontroller manufactured in complementary metal-oxide semiconductor technology. Integrated into a single chip are ROM, RAM, crystal oscillator, voltage doubler, timer, LCD driver, input port, output port, and thermistor-based temperature measuring circuit. Using an on-chip ROM reduces power consumption. The MSM5052 is widely used in electronic products requiring low-power operation, for example, thermometer and clinical thermometer.

FEATURES

  • Low power consumption
  • Internal ROM : 1280 ¥ 14 bits
  • Internal RAM : 62 ¥ 4 bits
  • I/O port Input port : 2 ports ¥ 4 bits Output port : 1 port ¥ 4 bits 1 port ¥ 1 bit
  • 4 ¥ 4 key matrix input is available by using K1 to K4 and M1 to M4
  • 26 LCD drivers (1/2 duty, 1/2 bias, 52 segments)
  • 42 instructions
  • Minimum instruction execution time : 122.1 ms (Display instruction cycle: 244.2 ms)
  • 1.5 V operating voltage (Built-in LCD drive voltage doubler)
  • Buzzer function
  • Built-in thermistor-based temperature measuring circuit
  • Crystal oscillator : 32.768 kHz
  • Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM5052-¥¥¥GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM5052-¥¥¥GS-2K) 80-pin plastic QFP (QFP80-P-1420-0.80-BK): (Product name : MSM5052-¥¥¥GS-BK) Chip (Chip size 4.77 mm ¥ 4.36 mm) : (Product name : MSM5052-¥¥¥) ¥¥¥ indicates a code number. ¡ Semiconductor MSM5052 Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller E2E0008-38-94 This version: Sep. 1998 Previous version: Mar. 1996

¡ Semiconductor BLOCK DIAGRAM BUZZER DRIVER OUTPUT PORT (M1-M4) INPUT PORT (K1-K4) INPUT PORT (S1-S4) TIMING GENERATOR ALU ACC DIN0 to DIN3 DOUT0 to DOUT3 A6 to A4 A3 to A0 DATA RAM 62 ¥ 4 bits MPX MPX PRO- GRAM COUN- TER DOUT13 to DOUT0 to A10 PROGRAM ROM 1280 ¥ 14 bits INSTRUC -TION DECODER DISPLAY LATCH and DRIVER VDD VSS1VSS2 VCP VCM RESET T1 T2 T3 T4 T5 BD M1 to M4 K1 to K4 S1 to S4 XT SEGMENT OUT 1 to SEGMENT OUT 26 MPX C Z XT OUTPUT PORT LD FMT REGISTER COM 1 COM 2 P REGISTER COUNTER RC OSCILLATOR OSC TH OSC R OSC C OSC IN MPX

¡ Semiconductor PIN CONFIGURATION (TOP VIEW) SEG4 SEG6 SEG8 SEG9 SEG10 SEG12 SEG13 SEG14 SEG15 SEG18 SEG20 SEG21 SEG22 SEG23 NC OSC TH OSC R OSC IN OSC C LD NC VSS1 VSS2 BD VDD COM1 SEG1 SEG2 SEG3 VCM VCP RESET VDD XT NC XT COM2 SEG25 SEG24 NC: No-connection pin 56-Pin Plastic QFP Note: SEG5, SEG7, SEG11, SEG16, SEG17, SEG19, and SEG26 are not connected to package pins.

¡ Semiconductor VSS1 VSS2 VDD BD NC NC NC NC COM1 SEG1 SEG2 NC NC OSC TH NC OSC R NC OSC IN NC OSC C NC NC LD NC NC NC SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 NC SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 NC VCM NC VCP RESET VDD NC NC XT NC XT COM2 SEG26 NC: No-connection pin 80-Pin Plastic QFP PIN CONFIGURATION (TOP VIEW) (continued)

¡ Semiconductor PAD CONFIGURATION Pad Layout SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG1 COM1 SEG2 SEG3 BD VSS2 VSS1 VDD SEG26 COM2 XT NC XT SEG25 SEG24 VDD RESET VCP VCM LD K2 K3 OSC C OSC IN OSC R OSC TH Chip size 4.77 ¥ 4.36 (mm)

¡ Semiconductor PIN DESCRIPTIONS Symbol

Description

Ground. VSS1 Power source (–1.5 V). VSS2 Power source for LCD driver (–3.0 V). This pin is connected to the VDD pin through a 0.1 mF capacitor. VCP, VCM Booster capacitor connection pins. VCP pin is connected to the VCM pin through a 0.1 mF capacitor. XT, XT Input and output pins of oscillator inverter. A 32.768 kHz crystal is connected to these pins. RESET Pin to clear internal logic, pulled down to VSS1. After power is turned on, the MSM5052 can be reset by this pin. BD Buzzer output. OSC TH, OSC R, OSC C, OSC IN Pins to RC oscillation circuit for temperature detection. These are the fundamental resistor, thermistor, and capacitor connection pins. T1 to T5 Pins to test internal logic. T1, T2, T4, and T5 are pulled down to VSS1. T3 is the output. Test pins are normally open.

¡ Semiconductor ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

Min. Typ. Max. Unit VSS1 Operating Voltage VSS1 VSS1 pin –1.65 –1.55 –1.25 V Power Supply Current 1 IDD1 Temperature sampling off (Refer to measuring circuit) 3.0 *1 mA Power Supply Current 2 IDD2 Temperature sampling on (Refer to measuring circuit) 100 *2 mA VOSC Within 10 seconds, VSS1 pin (Refer to measuring circuit) –1.45 V Output Current 1 COM IOM1 VOM1 = VSS1 ±0.2 V IOL1 VOL1 = –2.8 V Output Current 2 SEGMENT IOH2 –0.4 mA IOL2 0.4 Output Current 3 C, R, TH VOH3 = –0.4 V –400 VOL3 = –1.15 V 400 mA Output Current 4 M1-M4, LD VOH4 = –0.4 V mA VOL4 = –1.15 V Oscillation Start Voltage IOH1 VOH1 = –0.2 V mA (VDD = 0 V, VSS1 = –1.55 V, VSS2 = –3.0 V, C1 = 30 pF, Ta = 25°C) VOH2 = –0.2 V VOL2 = –2.8 V IOL3 IOH3 IOH4 IOL4 –100 –200 –50 VOH5 = –0.4 V IOH5 VOL5 = –1.15 V IOL5 VIN = 0 V IIH CD Output Current 5 BD Input Current S1-S4, K1-K4 Built-in CD Capacitance mA pF mA –0.2 VIN = –1.55 V IIL Parameter Symbol Condition Unit Rating Power Supply Voltage VSS1-VDD Ta = 25°C V –2.0 to +0.3 Input Voltage VIN Ta = 25°C V VSS1 – 0.3 to +0.3 Operating Temperature Top –20 to +75 Storage Temperature TSTG –55 to +125 *1 The typ. value varies depending on the application program. *2 The typ. value varies depending on the application program and RC thermistor to be used.

¡ Semiconductor Measuring circuit A XT VSS1 VDD V Crystal 32.768 kHz OSC TH VSS2 VCP VCM XT OSC R OSC C OSC IN : 20 pF : 0.1 mF : 3000 pF : 10 kW C2, C3 R1, R2 MSM5052

¡ Semiconductor VSS1 VDD RESET OSC TH OSC R COM1 SEGMENTS LCD MSM5052 OSC IN OSC C XT XT VCM : 33 kW : 20 kW : 40BT-5 COM2 LD BD HI LO Data Latch Alarm output Serial data Piezo VSS2 C/F VCP (CD = 25 pF) 32.768 kHz TH TH 40 kW ±10% at 25°C B = 3550 ±2% : 680 pF : 5 to 35 pF : 0.1 mF : 0.1 mF Thermometer one-second sampling Clock Thermometer 10-second sampling The highest temperature alarm The lowest temperature alarm APPLICATION CIRCUIT *1 Inner switch or pad on PCB *2 Bonding option

¡ Semiconductor (Unit : mm) PACKAGE DIMENSIONS Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP56-P-910-0.65-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Mirror finish

¡ Semiconductor (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP56-P-910-0.65-2K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP. Mirror finish

¡ Semiconductor (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). QFP80-P-1420-0.80-BK Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP. Mirror finish