MSC1157 OKI | Alldatasheet
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¡ Semiconductor MSC1157 ¡ Semiconductor MSC1157 Speaker Drive Amplifier GENERAL DESCRIPTION The MSC1157, designed specifically to operate at a low voltage with low current consumption, is a power amplifier developed for driving a speaker for a voice IC. The voltage gains can be adjusted over a range of up to ten. The differential output can directly drive a speaker without any output coupling capacitors. The MSC 1157, because of its ability to stand by, is ideally suitable for portable equipment applications powered by a battery.
FEATURES
- Low voltage operation : 2.0 to 6.0 V (Single power supply)
- Low current dissipation Operating current : 1.6mA without load (typ.)
- Standby function : Current dissipation less than 1 mA in standby
- High output current : 350mA peak
- Differential outputs : A speaker can be directly connected between differential outputs.
- Adjustable gain : Gain can be adjusted by use of an external resistor.
- Package options: 8-pin plastic DIP (DIP8-P-300-2.54) (Product name : MSC1157RS) 8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name : MSC1157MS-K) Chip BLOCK DIAGRAM VR AIN GND SP SP VCC 20 kW 100 kW 5 kW 5 kW 52 kW50 kW VCC VCC LogicSEL STBY E2D0048-39-22 This version: Feb. 1999 Previous version: May. 1997
¡ Semiconductor MSC1157 PIN CONFIGURATION (TOP VIEW) VR AIN SP GND SEL STBY SP V CC 8-Pin Plastic DIP or 8-Pin Plastic SOP PIN DESCRIPTIONS Symbol Type Description VCC — Power supply pin. GND — Ground pin. AIN I Signal input pin for analog signal inputs, etc. Digital input pins. Setting these pins configures the standby status. See the table below for how to set the pins. STBY, SEL I VR O SP O Speaker output pin. This pin outputs a negative phase with respect to the input signal. SP O Speaker output pin. This pin outputs a positive phase with respect to the input signal. SEL STBY Status
0 Operation
0 Standby
Applying a clock between 32kHz and 4MHz to either the STBY or the SEL pin leads the IC to operation status regardless of the status set at the other pin. Applying clocks to both of the pins at the same time may cause malfunction. Refer to the section, RECOMMENDED OPERATING CONDITIONS since clock frequencies are changed by setting the SEL pin. Bias output pin for internal circuits. This pin is at GND potential during standby. Connecting a capacitor between VR and the GND pin reduces the pop-up noise at power on and improves the ripple elimination ratio. Pin 7, 8
¡ Semiconductor MSC1157 Parameter Symbol Power Supply Voltage V CC Load Impedance (*2) RL Peak Load Current I O-P "H" Input Voltage V IH "L" Input Voltage V IL STBY Operating Frequency (*3) f STBY Operating Temperature Top Condition For STBY and SEL pins SEL = "L" At clock input VCC ³ 2.4 V UnitMin. Max. 2.0 6.0 V 8.0 — W — 350 mA 0.7 V CC —V — 0.3 V CC V 32 k 4.096 M Hz –20 +70 °C SEL = "H" At clock input VCC ³ 2.4 V 32 k 1 M ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Remark Power Supply Voltage V CC Ta=25°C –0.3 to +6.5 V V CC Input Voltage V IN Ta=25°C –0.3 to V CC+0.3 V STBY AIN, SEL Maximum Output Current I OMAX Ta=25°C (*1) ±400 mA SP, SP Power Dissipation P D Ta=25°C 470 mW DIP type 400 mW SOP type Storage Temperature TSTG — –55 to +150 °C Junction Temperature TjMAX — 125 °C Chip *1 Avoid shorting the output pins (SP and SP) to VCC or GND because the IC may be damaged. RECOMMENDED OPERATING CONDITIONS *2 A speaker of 8 W (standard) or more should be used. *3 The input of clocks may cause a little noise in output waveforms. It is recommended to input the DC voltage to inprove voice quality.
¡ Semiconductor MSC1157
ELECTRICAL CHARACTERISTICS
*4 The typical value of the output voltage in no signal state is determined from the following equation. VO = (VCC – 0.67) 50 kW + 52 kW 50 kW Parameter Symbol Condition Unit Max.Typ.Min. AIN Input Resistance R IN —k W262014 AV1 AIN®SP 14.491413.44 Voltage Gain A V2 SP®SP dB +1.580–1.94 AV3 AIN®(Between SP-SP) 20.51 2019.46 POUT1 VCC=3 V, f=1 kHz mW—178100RL=8 W, THD³10%Output Power POUT2 VCC=6 V, f=1 kHz mW—440300RL=32 W, THD³10% THD1 VCC=3 V, RL=8 W %—1.2—f=1 kHz, POUT=45 mWTotal Harmonic Distortion THD2 VCC=6 V, RL=32 W %—0.37—f=1 kHz, POUT=125 mW Ripple Elimination Ratio RR f=1 kHz, C2=4.7 mFd B —4330 VO VOutput DC Voltage (*4) Output Offset Voltage DVO Between SP-SP mV±30—— VOH AIN=VCC or GND V—VCC–1 .04VCC–1 .15Output "H" Voltage IOUT=–100 mA VOL AIN=VCC or GND V0.30.17—IOUT=100 mA STBY, SEL Input Current I IH VI=VCC mA±0.1—— IIL VI=GND mA±0.1—— VR Equivalent Resistance R VR kW322518 Circuit Current During Operation ICC VCC=6 V, RL=¥ mA2.41.61.1 Circuit Current During Standby I CCS — mA1.0—— Output "L" Voltage Unless otherwise specified, Ta=25°C, VCC=2 to 6 V VCC=2 V 0.77 0.650.53 VCC=6 V 2.73 2.612.49 In no signal state
¡ Semiconductor MSC1157 APPLICATION CIRCUIT SEL VCC STBY AIN VR SP SP Standby Select Input Standby Input Audio Input C4 C3 Speaker GND
- If parasitic capacitance of 60pF or more exists between GND and the speaker output pin SP or SP, oscillation may occur. Implement the circuit mount design so as to be less than 60pF.
- C1 is the AC coupling capacitor. Cutoff frequency fc on the low frequency side is determined by the following equation. Choose a value of C1 according to the bandwidth. fc = 2 ´ p ´ C1 ´ 20k 1 (Hz)
- Choose a value of C2 that is 80 to 100 times as large as that of C1.
- When the standby function is not used, connect the pins STBY and SEL to VCC or GND.
- It is recommended that the capacitor C4 (approximately 0.1mF) having better high frequency characteristics and the capacitor C3 (approximately 10mF) be placed between the pins VCC and GND.
¡ Semiconductor MSC1157 GAIN ADJUSTMENT 1. Gain Adjustment Using Input Resistance (This approach allows gain adjustment with fewer external components)
- Cutoff frequency fc on the low frequency side is determined from the equation: fc = 2 ´ p ´ C1 ´ (R1 + 20k) 1 (Hz)..
- Voltage gain AV1 is determined from the equation: 2. Gain Adjustment Using Feedback Resistance (This approach has the advantage over the above approach (less noise approach), but the number of components is increased) SEL VCC STBY AIN VR SP SP Standby Select Input Standby Input Audio Input Speaker C1 R1 GND
- Cutoff frequency fc on the low frequency side is determined from the equation: fc = 2 ´ p ´ C1 ´ Zin 1 (Hz).. Zin = R2 + 120k
- Voltage gain AV1 is determined from the equation: AV1 = 5 (V/V).. 20k R11 + R2 6 ´ R1+ SEL VCC STBY AIN VR SP SP Standby Select Input Standby Input Audio Input Speaker C1 R1 GND AV1 = R1 + 20k 100k (V/V)..
¡ Semiconductor MSC1157 OPERATING CHARACTERISTICS 123 4567 Maxiumum Output Amplitude vs. Voltage Supply Maximum Output Amplitude VOM [V] Supply Voltage VCC [V] RL=64W RL=32W RL=16W RL=8W RL=¥ 1000 800 600 400 200 0 100 200 300 400 500 600 VCC=6.0V VCC=4.5V VCC=3.0V Power Dissipation vs. Output Power Power Dissipation PD [mW] Output Power POUT [mW] RL=8W 1000 800 600 400 200 0 100 200 300 400 500 600 VCC=6.0V VCC=4.5V VCC=3.0V Power Dissipation vs. Output Power Power Dissipation PD [mW] Output Power POUT [mW] RL=16W 1000 800 600 400 200 0 100 200 300 400 500 600 Power Dissipation vs. Output Power Power Dissipation PD [mW] Output Power POUT [mW] VCC=6.0V VCC=4.5V VCC=3.0V RL=32W 1000 800 600 400 200 0 100 200 300 400 500 600 VCC=6.0V VCC=4.5VVCC=3.0V Power Dissipation vs. Output Power Power Dissipation PD [mW] Output Power POUT [mW] RL=64W 800 700 600 500 400 300 200 100 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Power Dissipation vs. Ambient Temperature Power Dissipation PD [mW] Ambient Temperature Ta [°C] SOP DIP
¡ Semiconductor MSC1157 0 1 Circuit Current vs. Voltage Supply Circuit Current ICC [A] Supply Voltage VCC [V] 5E-4 1E-3 1.5E-3 2E-3 234567 10000 100 VR Rise Time vs. Capacitor Value (C2) VR Rise Time (0 to 90%) [ms] Capacitor C2 [mF] 1000 100 0.1 1010.11E-2 Output Voltage vs. Load Current Output "L" Voltage VOL [V] Load Current IOUT [mA] 1.6 1.2 0.8 0.4 350 VCC=6.0V VCC=3.0V VCC=2.0V 1.8 1.4 0.6 0.2 300250200150100500 SP Output -0.4 -0.8 -1.2 -1.6 350 VCC=6.0V VCC=3.0V VCC=2.0V -0.2 -0.6 -1.4 -1.8 300250200150100500 Output Voltage vs. Load Current Output "H" Voltage VOH (VCC-VO) [V] Load Current IOUT [mA] SP Output 1.6 1.2 0.8 0.4 350 VCC=6.0V VCC=3.0V VCC=2.0V 1.8 1.4 0.6 0.2 300250200150100500 Output Voltage vs. Load Current Output "L" Voltage VOL [V] Load Current IOUT [mA] SP Output -0.4 -0.8 -1.2 -1.6 350 Output Voltage vs. Load Current Output "H" Voltage VOH (VCC-VO) [V] Load Current IOUT [mA] VCC=6.0V VCC=3.0V VCC=2.0V SP Output -0.2 -0.6 -1.4 -1.8 300250200150100500
¡ Semiconductor MSC1157 -20 Circuit Curent vs. Ambient Temperature Circuit Current [mA] Ambient Temperature [°C] 0 20 40 100 140-40 0.8 1.2 1.4 1.6 1.8 2.2 2.4 60 80 120 VCC = 6.0V Range of Ambient Temp. VCC = 2.0V -20 VR Resistance vs. Ambient Temperature VR Resistance [kW] Ambient Temperature [°C] 0 20 40 100 140-40 60 80 120 Range of Ambient Temp. -20 Circuit Current during Standby vs. Ambient Temperature (VCC = 6.0V) Circuit Current during standby ICCS [mA] Ambient Temperature [°C] 0 20 40 100 140-40 -0.2 0.2 0.6 1.4 1.8 2.2 2.6 60 80 120 Range of Ambient Temp.
¡ Semiconductor MSC1157 VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W VCC=6V RL=16W Total Harmonic Distortion vs. Output Total Harmonic Distortion THD [%] Output Power POUT [mW] f=1kHz 0 100 200 300 400 500 600 Total Harmonic Distortion vs. Output Total Harmonic Distortion THD [%] Output Power POUT [mW] f=3kHz VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W VCC=6V RL=16W 0 100 200 300 400 500 600 Voltage Gain vs. Frequency Voltage Gain AV3 [dB] Frequency f [Hz] 100 1k 10k 20k C1=0.47 mF C1=0.22 mF C1=0.1 mF C1=0.047 mF SEL V CC STBY AIN VR GND SP SP Vi C1 VO Ripple Elimination Ratio vs. Frequency Ripple Elimination Ratio RR [dB] Frequency f [Hz] -80 -70 -60 -50 -40 -30 -20 100 1k 10k 20k C2=2.2mF C2=4.7mF C2=10mF C2=22mF C2=0 mF SEL V CC STBY AIN VR GND SP SP Vi VO-10
¡ Semiconductor MSC1157 PAD CONFIGURATION Pad Layout Chip size : X=2.3mm, Y=2.4mm Chip thickness : 350 –30mm Pad size (PV aperture) : 110 ´110mm Substrate potential : GND Pad location diagram 21 8 7 Y-Axis X-Axis Pad No. Pad Name X-AXIS Y-AXIS
1 VR –133 1035
IN –985 1035
3 SP –950 –263
4 GND –180 –1027
CC 240 –914
6 SP 950 –263
7 STBY 985 1035
8 SEL 159 1035
(Unit: µm) Pad Coordinates (Chip center is located at X=0 and Y=0.)
¡ Semiconductor MSC1157 (Unit : mm) PACKAGE DIMENSIONS DIP8-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.46 TYP.
¡ Semiconductor MSC1157 (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SOP8-P-250-1.27-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.10 TYP. Mirror finish
- The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan E2Y0002-29-11