MSA4709A OKI | Alldatasheet

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¡ Semiconductor MSA4709A ¡ Semiconductor MSA4709A Subscriber Line Interface Circuit GENERAL DESCRIPTION The MSA4709A is designed to provide BSH functions and to meet PABX transmission performance requirements. This device provides two-wire to four-wire conversion function (Hybrid).

FEATURES

  • B (Battery feed), S (Supervision), and H (Hybrid) functions integrated on chip.
  • Design to meet Central Office and PABX quality transmission requirements.
  • All transmission performance parameters can be externally programmable.
  • Free from parasitic SCR's using dielectric isolation technology.
  • Size and weight reduction over conventional approaches.
  • Supply voltage selectable (V BB = –24 V/–48 V).
  • 1 channel built-in relay driver.
  • Package: 30-pin plastic Shrink DIP (SDIP30-P-400-1.78) (Product name: MSA4709ASS) E2A0032-16-X0 This version: Jan. 1998 Previous version: Nov. 1996

¡ Semiconductor MSA4709A BLOCK DIAGRAM Ring Current DET Ring Current Drive Amp. Over Voltage Protection TIP Current DET TIP Current Drive Amp. Interface Circuit HYB Loop & Fault DET RING TRIP Relay Driver TIP RING Zt ZFR ZR Zb 4WR ZR BN ZX 4WS 4WR ZX VBS BF SCN SEL RG RB VEEVCC RI RSI RSO VBB or VEE RY CDCCN VBB NE NB A B PB PE G CB IL CDP

¡ Semiconductor MSA4709A PIN CONFIGURATION (TOP VIEW) 15 16 30VBB A NE NB RSO CN RY CDC RSI RB RG VEE 4WR BN ZR SCN SEL CDP IL VBS BF RI V CC ZX CB G PB PE B NC 30-Pin Plastic Shrink DIP Note: NC: No connect pin

¡ Semiconductor MSA4709A PIN DESCRIPTION Pin No. Name Description 1V BB Battery supply, –48 V or –24 V input. 2A The Ring voltage sensing input. This input is high impedance (apr. 37 kW), and is connected to the built-in over voltage protection circuit. 3N E The Ring current sensing input is connected to the emitter of NPN Darlington transistor and the power resistor REA. 4 NB The base drive output for the NPN Darlington transistor. 5 RSO Relay driver current sink terminal. 6 CN Battery noise rejection capacitor input. This capacitor value is 1 mF (60V). 7 RY AC performance adjusting resistor RY input.

8 CDC AC high impedance providing capacitor Cdc input and constant current feed at the short

line adjusting zener diode input. This capacitor value is 1 mF (15V). 9 RSI Relay driver current source terminal. 10 RB Ring-Trip filtering capacitor input (RING). 11 RG Ring-Trip filtering capacitor input (TIP). 12 V EE –5 V input. 13 4WR Receive input and is connected to the negative input of the built-in buffer operational amplifier. 14 BN Balancing network drive output. 15 ZR Receive gain adjust and frequency compensation input.

16 SCN

Output of both the fault current detector and loop current detector. This output is open- collector with a built-in pull-up resistor. (apr. 10 kW). Condition SEL = "H" SEL = "L"

  • ON-Hook H H
  • OFF-Hook L H
  • Dial pulse: break H H
  • Dial pulse: make L H
  • RING TRIP L H
  • Ground/Battery fault L L

¡ Semiconductor MSA4709A Pin No. Name Description 17 SEL SCN output information select control input. At SEL = "L", SCN Indicates only ground/ battery fault condition. 18 CDP Dial pulse shaping capacitor input. 19 IL Tip to Ring constant loop current determination resistor input. 20 VBS Supply voltage selection terminal. VBS = VCC (–24 V), VBS = G (–48 V). 21 BF Battery-feed mode control input. A logic level "H" switches off both the Ring and Tip current drive amp. and presents a high impedance to the line. (apr. 80 kW). 22 RI Relay driver control input. RI = "H" is Driver "ON"

23 V CC +5 V input

24 ZX 2 wire terminating impedance compornent Zx input. This pin has a low input impedance. 25 CB Compensation capacitor input. This capacitor value is 4700 pF(35V). 26 G Ground input. 27 PB The base drive output for the PNP Darlington power transistor.

28 PE The Tip current sensing input is connected to the emitter of the PNP Darlington power

transister and the power resistor REB. 29 B The Tip voltage sensing input. This input is high impedance (apr. 37 kW) and is connected to the built-in over voltage protection circuit.

30 NC No connection

¡ Semiconductor MSA4709A ABSOLUTE MAXIMUM RATINGS Parameter Unit Power Supply Voltage Symbol Condition VBS = G Rating –53.0 to +0.3 V VBB VBS = VCC –30.0 to +0.3 — –0.3 to +7.0VCC — –7.0 to +0.3VEE — –0.3 to V CC + 0.3VIN VDigital Input Voltage VRI = H –30IRD mARelay Driver Current — 0 to 80Top °COperating Temperature — –55 to 150TSTG °CStorage Temperature (Ta = 25°C) RECOMMENDED OPERATING CONDITIONS Parameter Max. Unit Power Supply Voltage –53 Symbol Condition VBS = G Typ.Min. –48 –43 V VBB –30VBS = VCC –24 –21.6 +4.75— +5 +5.25VCC –5.25— –5 –4.75VEE 0VBB = –48 V — 2000RL 0VBB = –24 V — 600Loop Resistance W 0—— 7 0TaOperating Ambient Temperature °C

¡ Semiconductor MSA4709A

ELECTRICAL CHARACTERISTICS

Parameter Max. Unit Power Supply Current Symbol Condition VBB = –24 V ON-HOOK Typ.Min. 1.7 2.6 mA IBB — 4.0 6.0ICC — 1 1.5IEE VBB = –24 V OFF-HOOK 3.7 6.2IBB — 5.4 8.1ICC — 1.2 1.8IEE VBB = –48 V ON-HOOK 1.5 2.3 mA IBB — 4.0 6.0ICC — 1 1.5IEE VBB = –48 V OFF-HOOK 5.0 7.5IBB — 6.1 9.2ICC — 1.2 1.8IEE VBB = –24 V ON-HOOK — 70 100Pds24 VBB = –24 V OFF-HOOK — 130 200Pd24 VBB = –48 V ON-HOOK — 100 150Pds48 VBB = –48 V OFF-HOOK — 280 420Pd48 mWPower Dissipation 26 30 34IL50 R L = 50 W 26 30 34IL400 R L = 400 W ———IL1K R L = 1 kW Loop Current mA –3 — 1.2VRSI-RSO IRSI-RSO = 30 mARelay Driver Output Voltage V (IL = 30 mA, VBB = –24/–48 V, VCC = 5 V, VEE = –5 V, Ta = 25°C)

¡ Semiconductor MSA4709A AC Characteristics Parameter Max. Unit Symbol Condition Vi = 0 dBm0 f = 1 kHz Typ.Min. 4.0 — dBG242W®4W — –4.0 —G424W®2W Transmit & Receive Gain –0.1f = 0.3 to 3.4 kHz Vi = –55 to +3 dBm0 — 0.1 dBDL242W®4W Insertion Loss Variety —Psohometric Filter — –81 dBm0PNI22W — — –81NI44W Idel Channel Noise 53f = 1 kHz Vi = 0 dBm0 —— dBPSN242W®4W 53 — —SN424W®2W Signal to Distortion Ratio 40f = 0.3 kHz to 3.4 kHz —— dBLB2W2W 40 — —LB4W4W Longitudinal Balance 20f = 0.3 kHz to 3.4 kHz ——LMReturn Loss dB 23f = 0.3 kHz to 3.4 kHz ——LRTranshybrid Loss dB 20 — —LB2VBB®2W 20 — —LC2VCC®2W 20 — —LE2VEE®2W f = 0.3 kHz to 3.4 kHz Vin = 24.5 mVrms dB 20 — —LB4VBB®4W 20 — —LC4VCC®4W 20 — —LE4VEE®4W f = 0.3 kHz to 3.4 kHz Vin = 24.5 mVrms dB Power Supply Rejection Ratio 53IAC = 12.8 mArms Vi = 0 dBm0 —— dBP IAC242W®4W 53 — —IAC424W®2W AC Induction Tolerance ( VBB = –24/–48 V, VCC = 5 V, VEE = –5 V, Ta = 25°C )

¡ Semiconductor MSA4709A APPLICATION CIRCUIT

  • V BB : –48 V
  • Loop Current IL : 30 mA
  • Equivalent Terminal Impedance : 600W + 1mF RB V BS VCC VEE IL G CDC RYPE PB ZX BB N AZ R NB 4WR NE V BB CDP RG CB RSI CN RSO RI BF SEL SCN MSA4709A +5V –5V 27k(*4) VBB TIP VBB 750W (*3) (*6) 510k 51W (*5) (*1) 2.2k RING 51W (*5) (*1) 2.2k (*2) VBB or VEE (Controller) 750W 4.7k 0.028m 21k 42k 0.028m 187k 2.7k 12k 4700pF CODEC GSX AIN– AIN+ AOUT+ MSM6999 BHWPCM IN FHWPCM OUT VBB + 1m VBB RG RB TIP 750 510k RING 750W VBB VBB RSO RSI RI VCC Fig. 1 Fig. 2

¡ Semiconductor MSA4709A Notes: *1. Use heat sinks required for Darlinton-connected power transistors. *2. This diagram indicates that V BB or VEE (negative supply) is used for driving the relay, but a positive supply, such as VEE indicated in Fig. 2, can also be used. *3. This diagram indicates that the ring trip circuit consists of the RING line connected to ground through the riging current source and the TIP line connected to the battery (V BB), but the ring trip circuit can also be configured, using the RG pin indicated in Fig. 2, by the RING line connected to the battery through the ringing current source and the TIP line connected to ground. *4. This diagram indicates V BB=–48V. If –24V is used for VBB, connect the VBS pin to VCC and change the ring trip filtering constants from 510 kW plus 1 mF to 150 kW plus 33 mF. *5. Use a resistor with precision of 0.1% or better. *6. Connect additional circuits for suppressing or absorbing surge and noise caued by relay contacts. Battery Feed Characteristics 10.5 1.5 Loop Current IL (mA) Loop Resistance RL (kW) VBB = –24V Loop Current IL (mA) Loop Resistance RL (kW) IL = 30 mA IL = 40 mA VBB = –48V

¡ Semiconductor MSA4709A (Unit : mm) PACKAGE DIMENSIONS SDIP30-P-400-1.78 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 1.80 TYP.