MSA180 OKI | Alldatasheet

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MSA180¡ Semiconductor GENERAL DESCRIPTION The MSA180 is a piezo speaker driver for OKI's speech synthesizers. Its voltage gain can be adjusted by a factor of up to 10. The differential output provides an amplitude of twice the voltage supply. A separate output connects to the base of an external transistor for controlling system voltage. A standby function eliminates power loss when no input signal is present.

FEATURES

  • Power supply voltage : 2.0 V to 6.0 V (single supply voltage)
  • Low current consumption : 4.2 mA typ (V CC=3 V, no load)
  • Standby current : <1 mA
  • Differential output : Tw ice the supply voltage (maximum output amplitube)
  • Package options : 8-pin plastic DIP (DIP8-P-300-2.54) (Product name: MSA180RS) 8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name: MSA180MS-K) Chip BLOCK DIAGRAM VCC MODE1 MODE2 AIN GND Logic VCC VCC BASE SP SP 2.2 kW AV=20 AV=20 1.3 kW 6.6 kW 6.6 kW 18 kW ¡ Semiconductor MSA180 Piezo Speaker Amplifier E2D0049-39-21 This version: Feb. 1999 Previous version: May. 1997

MSA180¡ Semiconductor PIN CONFIGURATION (TOP VIEW) 8-Pin Plastic DIP or 8-Pin Plastic SOP PIN DESCRIPTIONS MODE2 AIN GND SP MODE1 BASE V CC SP Pin Type Description 6V CC — Power supply pin. 3 GND — Ground pin. IN I Voice signal input pin.

8 MODE1 I

This pin switches the device between operation and standby modes. The IC is in operation mode if VIH > 1.0 V on the MODE1 pin and is in standby mode if VIL < 0.3 V on the MODE1 pin. When MODE1 is used, MODE2 must be connected to VCC.

1 MODE2 I

This pin switches the device between operation and standby modes. The IC is in operation mode if VIL < VCC–1.0 V on MODE1 pin and is in standby mode if VIH > VCC–0.3 V on MODE1 pin. When MODE2 is used MODE1 must be connected to GND.

7 BASE O

This pin is connected to the base of an external transistor. If an external transistor is not used to control system voltage, this pin must be left open.

4 SP O This is a speaker output pin that provides signals with the same phase

as the input. 5S P O This is a speaker output pin that provides signals with an inverted phase to the input. Symbol

MSA180¡ Semiconductor ABSOLUTE MAXIMUM RATINGS RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Rating Unit Remarks Power Supply Voltage V CC — –0.3 to +6.5 V — Input Voltage V IN — –0.3 to V CC+0.3 V AIN MODE1 MODE2 BASE Maximum Output Current I OMAX VCC=3 V ±80 mA SP, SP Power Dissipation P D Ta=25°C 400 mW DIP type 340 mW SOP type Junction Temperature T jMAX — 110 °C Chip Storage Temperature T STG — –55 to +150 °C — (Ta=25°C unless otherwise specified) Parameter Symbol Min. Max. UnitCondition Power Supply Voltage V CC 2.0 6.0 V— "L" Input Voltage VIL1 — 0.3 VApplied to MODE1 pin Operating Temperature T op –40 +85 °C— Load Impedance Z L 200 — W Peak Load Current I O-P — ±30 mA— "H" Input Voltage VIH1 1.0 — V VIH2 VCC–0.3 — V VIL2 —V CC–1.0 VApplied to MODE2 pin Applied to MODE1 pin Applied to MODE2 pin

MSA180¡ Semiconductor

ELECTRICAL CHARACTERISTICS

Parameter Symbol Condition Min. Typ. Max. Unit Voltage Gain AV1 AIN®SP 4.25 5 5.75 V/V (Ta=25°C, VCC=2 V to 6 V unless otherwise specified) AV2 AIN®SP 4.25 5 5.75 V/V AV3 AIN®(SP-SP) 8.5 10 11.5 V/V AIN Input Resistance R IN — 17.2 24.6 32.0 k W Output DC Offset Voltage VCC=2 V — — 0.2 V*2 VCC=6 V — — 0.6 V SP, SP Output "H" Voltage V OH IOUT=–10 mA V CC–0.25 — — V SP, SP Output "L" Voltage V OL IOUT=10 mA — — 0.25 V VCC=3 V Operating Current I CC — 4.2 6.2 mA ZL=¥ BASE=Open Circuit Current in Standby Mode I CCS AIN=Open —— 1 µ AMODE1=GND AIN Input DC Bias Voltage V AIN MODE1 "H" Input Current I IH1 MODE1=VCC — — 160 µA MODE2 "H" Input Current I IH2 MODE2=VCC —— 1 µ A MODE1 "L" Input Current I IL1 MODE1=GND –1 — — µA MODE2 "L" Input Current I IL2 MODE2=GND –160 — — µA Base Output Current IBO1 VCC=2 V 0.4 — — mABASE=VCC IBO2 VCC=6 V 1.6 — — mABASE=VCC No signal SP-SP MODE1=MODE2=GND or MODE1=MODE2=VCC MODE2=VCC VO DVO *1 Typical value is V O = VCC ´ 0.625 – 0.25. *2 Maximum value is DVO = VCC ´ 0.1. *3 Typical value is V AIN = VCC ´ 0.12 + 0.02.

MSA180¡ Semiconductor APPLICATION CIRCUITS How to Adjust Gain Gain control adjustment of the input signal level is shown below. When using OKI's speech synthesizer devices, insert a diode in series with the variable resistor to reduce pop noise. The circuit below also implements gain adjustment for a higher impedance signal source. Signal 100 kW 0.1 mF AIN MSA180 VDD BASE VCC SP SP GND MODE1 PIEZO SPEAKER MODE2 Signal 20 kW 0.1 mF AIN MSA180 VDD BASE VCC SP SP GND MODE1 PIEZO SPEAKER MODE2

MSA180¡ Semiconductor How to Connect the Piezo Speaker To achieve the full gain level of 10 V, even at a low supply voltage (VCC=3 V), connect a coil in series with the piezo speaker. The resonance frequency that occurs in the circuit containing the coil and the piezo speaker is : fQ = 2p CL ´ LL 1 [Hz] Where CL is the piezo capacitance and L L the coil inductance. For instance, if the piezo capacitance is 0.1 mF and fQ is in a range of 2 to 3 kHz, then the coil induct- ance should be 30 mH. AIN MSA180 VDD BASE VCC SP SP GND MODE1 PIEZO SPEAKER COIL MODE2

MSA180¡ Semiconductor This example shows how to connect the MSA180 with an MSM6378A or MSM6379 speech synthesizer using an external transistor and the MODE1 pin. The analog output of both synthesizers lowers to 0 V in their standby mode. For this reason, the voice signal can be used to control operation and standby modes of the MSA180. The circuit also controls the voltage via an external transistor. If this function is not used, leave the BASE pin open. MSM6378A or MSM6379 VDD AOUT GND SP START SWITCH AIN MSA180 VDD BASE V CC SP GND MODE1 PIEZO SPEAKER R2 R1 MODE2 Operation Flow 1. When the start switch is pressed, power is supplied to the V DD pins on the MSM6378A or MSM6379, and operation mode is invoked. Voice output level then rises. 2. When operation mode is involved, the voice signal rises above the GND level, and MODE1 on MSA180 goes high (H). 3. The BASE pin on MSA180 goes low (L) to drive the external transistor for power-supply control. 4. The audio IC continues to operate using the external transistor as a power supply. The device continues to operate and voice sounds, even if the start switch is released at this time. 5. When the sound ends, MODE1 on MSA180 falls low (L), the voice signal falls to GND level, and standby mode ensues. 6. The external transistor for power-supply control is switched off, switching the voice synthesizer off because the power supply is switched off.

MSA180¡ Semiconductor Supplemental Information When Using a Voice Signal on the MODE1 Pin When using the voice signal on MODE1, as in the circuit below, care must be taken regarding the voice input level. Application of the voice signal below VIH1level to the MODE1 pin causes the MSA180 to switch into standby mode, interrupting the voice reproduction flow, and causing undesired noises. SP C1 AIN MSA180 VDD BASE V CC SP GND MODE1 PIEZO SPEAKER R1 MODE2 Signal When using a voice signal lower than VIH, refer to the circuit below. With a low-pass filter consisting of R2 and C2, voice levels lower than VIH1 are passed through. However, select values for R2 and C2 such that the input voltage on MODE1 is greater than V IH2. The cutoff frequency of the low-pass filter is calculated as follows: fC = 2p ´ R2 ´ C2 1 [Hz] For instance, if the cutoff frequency is 50 Hz, C2 is 0.1 mF and R2 is 30 kW. For a lower cutoff frequen- cy, use a larger value for C2 or R2. SP AIN MSA180 VDD BASE V CC SP GND MODE1 PIEZO SPEAKER R2 R1 MODE2 Signal

MSA180¡ Semiconductor The example below shows how to connect the MSA180 with the MSM6375 or MSM6650 family speech synthesizers using the synthesizer's BUSY output to control operation and standby mode of the MSA180. As voice output stops, BUSY rises to the "H" level. For this reason, MODE2 is used to control operation and standby modes of the MSA180. Notes: 1. The diode on A OUT reduces pop noise. 2. This circuit makes use of the BUSY output of the speech synthesizer. 3. As the voice reproduction stops, BUSY outputs a "H" level to MODE2, setting the stand- by function. 4. If MODE2 is used, MODE1 must be connected to GND. 5. Leave the BASE pin open if it is not used. MSM6650 or MSM6375 VDD AOUT GND SP C1 AIN MSA180 VDD BASE V CC SP GND MODE1 PIEZO SPEAKER MODE2BUSY

MSA180¡ Semiconductor The example below shows how to connect the MSA180 with the MSM6388 or MSM6588 family speech recording ICs using the recorders' STBY output to control operation and standby mode of the MSA180. As voice output stops, STBY rises to the "H" level. For this reason, MODE2 is used to control operation and standby modes of the MSA180. Notes: 1. The diode on A OUT reduces pop noise. 2. This circuit makes use of the STBY output of the speech synthesizer. 3. As the voice reproduction stops, STBY outputs a "H" level to MODE2, setting the stand- by function. 4. If MODE2 is used, MODE1 must be connected to GND. 5. Leave the BASE pin open if it is not used. MSM6388 or MSM6588 VDD AOUT GND SP C1 AIN MSA180 VDD BASE V CC SP GND MODE1 PIEZO SPEAKER MODE2CS3(STBY)

MSA180¡ Semiconductor Application Examples for Circuits Containing a Microcontroller or Other Peripheral Devices The circuit below uses a voice signal which rises high in operation mode. The MODE1 pin is used. Be sure to connect the MODE2 pin to V CC pin. Note: If the BASE pin is not used, leave it open. In the circuit below, the signal falls low in operation mode. The MODE2 pin is used. Be sure to connect the MODE1 pin to the GND pin. Note: If the BASE pin is not used, leave it open. SP AIN MSA180 BASE V CC SP GND MODE1 PIEZO SPEAKER MODE2 Signal Control Signal Input VDD SP C1 AIN MSA180 VDD BASE V CC SP GND MODE1 PIEZO SPEAKER MODE2 Control Signal Input Signal

MSA180¡ Semiconductor OPERATING CHARACTERISTICS 23 456 No-load circuit current [mA] Power Supply Voltage vs. No-Load Circuit Current Power supply [V] –50 0 25 50 100 No-load circuit current [mA] No-Load Circuit Current vs. Temperature Characteristic Temperature [°C] –25 75 –0.5 –1.5 02 0 3 0 4 0 6 0 Output "H" voltage VCC–VOH [V] Output "H" Voltage Characteristic Output current [mA] 10 50 0 20 30 40 60 Output "H" voltage VCC–VOH [V] Output "H" Voltage vs. Temperature Characteristic Output current [mA] 10 50 –0.5 –1.5 1.5 0.5 02 0 3 0 4 0 6 0 Output "L" voltage VOL [V] Output "L" Voltage Characteristic Output current [mA] 10 50 0 20 30 40 60 Output "L" voltage VOL [V] Output "L" Voltage vs. Temperature Characteristic Output current [mA] 10 50 1.5 0.5 VCC=6 V VCC=3 V VCC=2 V VCC=2 V VCC=3 V VCC=6 V Ta=–40°C Ta=25°C Ta=85°CVCC=3 V VCC=2 V VCC=3 V VCC=6 V VCC=3 V Ta=–40°C Ta=25°C Ta=85°C

MSA180¡ Semiconductor 23 456 Voltage gain, AV1 [Magnification] Power Supply Voltage vs. Voltage Gain Power Supply Voltage [V] –50 0 25 50 100 Voltage gain, AV1 [Magnification] Temperature [°C] –25 75 120 100 –20 02 3 4 6 MODE1 input current [µA] MODE1 Input voltage vs. Input Current MODE1 input voltage [V] 150 2 3 4 6 MODE2 input current [µA] MODE2 Input Voltage vs. Input Current MODE2 input voltage [V] –20 –40 –120 2.5 1.5 0.5 02 3 4 6 BASE pin output current [mA] BASE Pin Output Current vs. Temperature Characteristic BASE voltage [V] –60 –80 –100 Ta=85°C Ta=25°C Ta=–40°C VCC=6 V VCC=2 V VCC=6 V VCC=2 V VCC=3 V VCC=6 V VCC=6 V Ta=85°C Ta=25°C Ta=–40°C Voltage Gain vs. Temperature Characteristics VCC=3 V

MSA180¡ Semiconductor PAD CONFIGURATION

  • Chip Layout Chip size : 2.00 mm ´ 2.00 mm Chip thickness : 350 mm – 30 mm Pad size : 110 mm ´ 110 mm Board potential : GND potential 2 1 8 7 36 45 Y-axis X-axis Pad Coordinates (Chip center: X=0, Y=0) Pad name X-coordinate [mm] Y-coordinate [ mm]Pad MODE2 –655 8351 AIN –835 8352 GND –835 –8353 SP –185 –7894 SP 121 –7895 VCC 815 –8356 BASE 793 8357 MODE1 613 8358

MSA180¡ Semiconductor (Unit : mm) PACKAGE DIMENSIONS DIP8-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.46 TYP.

MSA180¡ Semiconductor (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). SOP8-P-250-1.27-K Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.10 TYP. Mirror finish

  1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan E2Y0002-29-11