MR4A16B

MR4A16B EVERSPIN | Alldatasheet

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MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. INTRODUCTION The MR4A16B is a 16,777,216-bit magnetoresistive random access memory (MRAM) device organized as 1,048,576 words of 16 bits. The MR4A16B offers SRAM compatible 35 ns read/write timing with unlimited endurance. Data is always non-volatile for greater than 20 years. Data is automatically pro- tected on power loss by low-voltage inhibit circuitry to prevent writes with voltage out of specification. To simplify fault tolerant design, the MR4A16B includes internal single bit error correction code with 7 ECC parity bits for every 64 data bits. The MR4A16B is the ideal memory solution for applications that must permanently store and retrieve critical data and programs quickly. The MR4A16B is available in a small footprint 48-pin ball grid array (BGA) package and a 54-pin thin small outline package (TSOP Type 2). These packages are compatible with similar low-power SRAM products and other nonvolatile RAM products. The MR4A16B provides highly reliable data storage over a wide range of temperatures. The product is offered with commercial temperature (0 to +70 °C), and industrial temperature (-40 to +85 °C) operating temperature options. MR4A16B 1M x 16 MRAMFEATURES

• +3.3 Volt power supply
• Fast 35 ns read/write cycle
• SRAM compatible timing
• Unlimited read & write endurance
• Data always non-volatile for >20 years at temperature
• RoHS-compliant small footprint BGA and TSOP2 package
• All products meet MSL-3 moisture sensitivity level BENEFITS
• One memory replaces FLASH, SRAM, EEPROM and BBSRAM in systems for simpler, more efficient designs
• Improves reliability by replacing battery-backed SRAM RoHS

CONTENTS

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. CHIP ENABLE BUFFER OUTPUT ENABLE BUFFER ADDRESS BUFFER WRITE ENABLE BUFFER G E UPPER BYTE OUTPUT ENABLE LOWER BYTE OUTPUT ENABLE 1M x 16 BIT MEMORY ARRAY ROW DECODER COLUMN DECODER SENSE AMPS LOWER BYTE WRITE DRIVER LOWER BYTE OUTPUT BUFFER UPPER BYTE OUTPUT BUFFER FINAL WRITE DRIVERS UPPER BYTE WRITE ENABLE LOWER BYTE WRITE ENABLE W BYTE ENABLE BUFFER UB A[19:0] 816 DQL[7:0]

8 DQU[15:8]

1. DEVICE PIN ASSIGNMENT Figure 1.1 Block Diagram Table 1.1 Pin Functions Signal Name Function A Address Input E Chip Enable W Write Enable G Output Enable UB Upper Byte Enable LB Lower Byte Enable DQ Data I/O VDD Power Supply VSS Ground DC Do Not Connect NC No Connection MR4A16B

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. 1 2 3 4 5 6 LB G A0 A1 A2 NC A DQU8 UB A3 A4 E DQL0 B DQU9 DQU10 A5 A6 DQL1 DQL2 C VSS DQU11 A15 DQL3 VDD D VDD DQU12 DC A16 DQL4 VSS E DQU14 DQU13 A14 A13 DQL5 DQL6 F DQU15 A10 A17 A11 W DQL7 G A9A8 A12 HA18 NC A19 NC NC NC NC A₁₉ W E DQ₀ DQ₁ DQ₂ DQ₃ DQ₄ DQ₅ DQ₆ DQ₇ VDD VSS NC NC NC NC A₁₈ A₁₇ A₁₆ A₁₅ G DC A₁₄ A₁₃ A₁₂ A₁₁ A₁₀ UB LB DQ₁₅ DQ₁₄ DQ₁₃ DQ₁₂ DQ₁₁ DQ₁₀ DQ₉ DQ₈ VSS VDD Figure 1.1 Pin Diagrams for Available Packages (Top View) 48-Pin BGA 54-Pin TSOP2 Table 1.2 Operating Modes DEVICE PIN ASSIGNMENT MR4A16B E1 G1 W1 LB1 UB1 Mode VDD Current DQL[7:0]2 DQU[15:8]2 H X X X X Not selected ISB1, ISB2 Hi-Z Hi-Z L H H X X Output disabled IDDR Hi-Z Hi-Z L X X H H Output disabled IDDR Hi-Z Hi-Z L L H L H Lower Byte Read IDDR DOut Hi-Z L L H H L Upper Byte Read IDDR Hi-Z DOut L L H L L Word Read IDDR DOut DOut L X L L H Lower Byte Write IDDW Din Hi-Z L X L H L Upper Byte Write IDDW Hi-Z Din L X L L L Word Write IDDW Din Din

1 H = high, L = low, X = don’t care

2 Hi-Z = high impedance

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. 2. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings This device contains circuitry to protect the inputs against damage caused by high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage greater than maximum rated voltages to these high-impedance (Hi-Z) circuits. The device also contains protection against external magnetic fields. Precautions should be taken to avoid application of any magnetic field greater than the maximum field intensity specified in the maximum ratings. Symbol Parameter Conditions Value Unit VDD Supply voltage2 -0.5 to 4.0 V VIN Voltage on an pin 2 -0.5 to VDD + 0.5 V IOUT Output current per pin ±20 mA TBIAS Temperature under bias Commercial -10 to 85 °C Industrial -45 to 95 °C Tstg Storage Temperature -55 to 150 °C TLead Lead temperature during solder (3 minute max) 260 °C Hmax_write Maximum magnetic field During Write

8000 A/m

Hmax_read Maximum magnetic field During Read or Standby 1 Permanent device damage may occur if absolute maximum ratings are exceeded. Functional operation should be restricted to recommended operating conditions. Exposure to excessive voltages or magnetic fields could affect device reliability. 2 All voltages are referenced to VSS. The DC value of VIN must not exceed actual applied VDD by more than 0.5V. The AC value of VIN must not exceed applied VDD by more than 2V for 10ns with IIN limited to less than 20mA. 3 Power dissipation capability depends on package characteristics and use environment. Table 2.1 Absolute Maximum Ratings 1 MR4A16B

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. Symbol Parameter Temp Range Min Typical Max Unit VDD Power supply voltage 3.0 1 3.3 3.6 V VWI Write inhibit voltage 2.5 2.7 3.0 1 V VIH Input high voltage 2.2 - VDD + 0.3 2 V VIL Input low voltage -0.5 3 - 0.8 V TA Temperature under bias Commercial 0 - 70 °C Industrial -40 - 85 °C 1 There is a 2 ms startup time once VDD exceeds VDD,(min). See Power Up and Power Down Sequencing below. 2 VIH(max) = VDD + 0.3 VDC ; VIH(max) = VDD + 2.0 VAC (pulse width ≤ 10 ns) for I ≤ 20.0 mA. 3 V IL(min) = -0.5 VDC ; VIL(min) = -2.0 VAC (pulse width ≤ 10 ns) for I ≤ 20.0 mA. Table 2.2 Operating Conditions Power Up and Power Down Sequencing The MRAM is protected from write operations whenever VDD is less than VWI. As soon as VDD exceeds VDD(min), there is a startup time of 2 ms before read or write operations can start. This time allows memory power supplies to stabilize. The E and W control signals should track VDD on power up to VDD- 0.2 V or VIH (whichever is lower) and remain high for the startup time. In most systems, this means that these signals should be pulled up with a resis- tor so that a signal remains high if the driving signal is Hi-Z during power up. Any logic that drives E and W should hold the signals high with a power-on reset signal for longer than the startup time. During power loss or brownout where VDD goes below VWI, writes are protected and a startup time must be observed when power returns above VDD(min). Figure 2.1 Power Up and Power Down Diagram MR4A16BElectrical Specifications BROWNOUT or POWER LOSS NORMAL OPERATION VDD READ/WRITE INHIBITED VWI 2 ms READ/WRITE INHIBITED VIH STARTUP NORMAL OPERATION 2 ms E W RECOVER VIH

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. Symbol Parameter Conditions Min Max Unit Ilkg(I) Input leakage current All - ±1 μA Ilkg(O) Output leakage current All - ±1 μA VOL Output low voltage IOL = +4 mA - 0.4 V IOL = +100 μA VSS + 0.2 V VOH Output high voltage IOH = -4 mA 2.4 - V IOH = -100 μA VDD - 0.2 - V Table 2.3 DC Characteristics Table 2.4 Power Supply Characteristics Symbol Parameter Typical Max Unit IDDR AC active supply current - read modes1 (IOUT= 0 mA, VDD= max) 60 68 mA IDDW AC active supply current - write modes1 (VDD= max) 152 180 mA ISB1 AC standby current (VDD= max, E = VIH) no other restrictions on other inputs 9 14 mA ISB2 CMOS standby current (E ≥ VDD - 0.2 V and VIn ≤ VSS + 0.2 V or ≥ VDD - 0.2 V) (VDD = max, f = 0 MHz) 5 9 mA 1 All active current measurements are measured with one address transition per cycle and at minimum cycle time. MR4A16BElectrical Specifications

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. MR4A16BTiming Specifications Table 3.4 Write Cycle Timing 1 (W Controlled) 1 Symbol Parameter Min Max Unit tAVAV Write cycle time 2 35 - ns tAVWL Address set-up time 0 - ns tAVWH Address valid to end of write (G high) 20 - ns tAVWH Address valid to end of write (G low) 20 - ns tWLWH tWLEH Write pulse width (G high) 15 - ns tWLWH tWLEH Write pulse width (G low) 15 - ns tDVWH Data valid to end of write 10 - ns tWHDX Data hold time 0 - ns tWLQZ Write low to data Hi-Z 3 0 15 ns tWHQX Write high to output active 3 3 - ns tWHAX Write recovery time 12 - ns 1 All write occurs during the overlap of E low and W low. Power supplies must be properly grounded and decoupled and bus contention conditions must be minimized or eliminated during read and write cycles. If G goes low at the same time or after W goes low, the output will remain in a high impedance state. After W, E or UB/LB has been brought high, the signal must remain in steady-state high for a minimum of 2 ns. The minimum time between E being asserted low in one cycle to E being asserted low in a subsequent cycle is the same as the minimum cycle time allowed for the device. 2 All write cycle timings are referenced from the last valid address to the first transition address. 3 This parameter is sampled and not 100% tested. Transition is measured ±200 mV from the steady-state voltage. At any given voltage or temperate, tWLQZ(max) < tWHQX(min). W (WRITE ENABLE) A (ADDRESS) E (CHIP ENABLE) UB, LB (BYTE ENABLED) t AVAV t AVWH t WHAX t AVWL t WLEH t WLWH DATA VALID t DVWH t WHDX Q (DATA OUT) D (DATA IN) t WLQZ t WHQX Hi -Z Hi -Z Figure 3.4 Write Cycle Timing 1 (W Controlled)

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. MR4A16BTiming Specifications Table 3.5 Write Cycle Timing 2 (E Controlled) 1 Figure 3.5 Write Cycle Timing 2 (E Controlled) Symbol Parameter Min Max Unit tAVAV Write cycle time 2 35 - ns tAVEL Address set-up time 0 - ns tAVEH Address valid to end of write (G high) 20 - ns tAVEH Address valid to end of write (G low) 20 - ns tELEH tELWH Enable to end of write (G high) 15 - ns tELEH tELWH Enable to end of write (G low) 3 15 - ns tDVEH Data valid to end of write 10 - ns tEHDX Data hold time 0 - ns tEHAX Write recovery time 12 - ns 1 All write occurs during the overlap of E low and W low. Power supplies must be properly grounded and decoupled and bus contention conditions must be minimized or eliminated during read and write cycles. If G goes low at the same time or after W goes low, the output will remain in a high impedance state. After W, E or UB/ LB has been brought high, the signal must remain in steady-state high for a minimum of 2 ns. The minimum time between E being asserted low in one cycle to E being asserted low in a subsequent cycle is the same as the minimum cycle time allowed for the device. 2 All write cycle timings are referenced from the last valid address to the first transition address. 3 If E goes low at the same time or after W goes low, the output will remain in a high-impedance state. If E goes high at the same time or before W goes high, the output will remain in a high-impedance state. A (ADDRESS) E (CHIP ENABLE) W (WRITE ENABLE) Q (DATA OUT) D (DATA IN) tAVAV tAVEH tEHAX tELEH tEHDXtDVEH tAVEL Hi-Z tELWH Data Valid UB, LB (BYTE ENABLE)

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. MR4A16BTiming Specifications Table 3.6 Write Cycle Timing 3 (LB/UB Controlled) 1 Figure 3.6 Write Cycle Timing 3 (LB/UB Controlled) Symbol Parameter Min Max Unit tAVAV Write cycle time 2 35 - ns tAVBL Address set-up time 0 - ns tAVBH Address valid to end of write (G high) 20 - ns tAVBH Address valid to end of write (G low) 20 - ns tBLEH tBLWH Write pulse width (G high) 15 - ns tBLEH tBLWH Write pulse width (G low) 15 - ns tDVBH Data valid to end of write 10 - ns tBHDX Data hold time 0 - ns tBHAX Write recovery time 12 - ns 1 All write occurs during the overlap of E low and W low. Power supplies must be properly grounded and decoupled and bus contention conditions must be minimized or eliminated during read and write cycles. If G goes low at the same time or after W goes low, the output will remain in a high impedance state. After W, E or UB/LB has been brought high, the signal must remain in steady-state high for a minimum of 2 ns. If both byte control signals are asserted, the two signals must have no more than 2 ns skew between them. The minimum time between E being asserted low in one cycle to E being asserted low in a subsequent cycle is the same as the minimum cycle time allowed for the device. 2 All write cycle timings are referenced from the last valid address to the first transition address. W (WRITE ENABLE) A (ADDRESS) E (CHIP ENABLE) UB, LB (BYTE ENABLED) t AVAV t AVEH t BHAX t AVBL t BLEH t BLWH Data Valid t DVBH t BHDX Q (DATA OUT) D (DATA IN) Hi -Z Hi -Z

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. MR4A16B 4. ORDERING INFORMATION Figure 4.1 Part Numbering System Carrier Blank = Tray, R = Tape & Reel Speed 35 ns Package MA = FBGA, YS = TSOP Temperature Range Blank= Commercial (0 to +70 °C), C= Industrial (-40 to +85°C ) Revision Data Width 16 = 16-bit Type A = Asynchronous Density 4 =16Mb Magnetoresistive RAM MR 4 A 16 B C MA 35 R Grade Temp Range Package Shipping Con- tainer Order Part Number Commercial 0 to +70 °C 48-BGA Trays MR4A16BMA35 Tape & Reel MR4A16BMA35R 54-TSOP2 Trays MR4A16BYS35 Tape & Reel MR4A16BYS35R Industrial -40 to +85°C 48-BGA Tray MR4A16BCMA35 Tape & Reel MR4A16BCMA35R 54-TSOP2 Tray MR4A16BCYS35 Tape & Reel MR4A16BCYS35R Table 4.1 Available Parts

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. MR4A16B 5. MECHANICAL DRAWING 123456 (DATUM A) (DATUM B) SEATING PLANE PIN A1 INDEX PIN A1 INDEX A B C D E F G H BOTTOM VIEW TOP VIEW SOLDER BALL DIAMETER REFERS TO POST REFLOW CONDITION. THE PRE-REFLOW DIAMETER IS ø 0.35mm Figure 5.1 48-FBGA Print Version Not To Scale 1. Dimensions in Millimeters. 2. The ‘e’ represents the basic solder ball grid pitch. 3. ‘b’ is measurable at the maximum solder ball diameter in a plane parallel to datum C. 4. Dimension ‘ddd’ is measured parallel to primary datum 5. Primary datum C (seating plane) is defined by the crowns of the solder balls. 6. Package dimensions refer to JEDEC MO-205 Rev. G. Ref Min Nominal Max A 1.19 1.27 1.35 A1 0.22 0.27 0.32 b 0.31 0.36 0.41 D 10.00 BSC E 10.00 BSC D1 5.25 BSC E1 3.75 BSC DE 0.375 BSC SE 0.375 BSC e 0.75 BSC Ref Tolerance of, from and position aaa 0.10 bbb 0.10 ddd 0.10 eee 0.15 fff 0.08

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. MR4A16B 5. MECHANICAL DRAWING D C C0.10SEATING PLANE 0.71 REF. 54 28 A2 A1 A θ3θ2 θ e c b 0.21(0.008)REF. GAGE PLANE 0.25 mm 0.665(0.026)REF. E ⊕0.20(0.008) M Figure 5.2 54-TSOP2 Print Version Not To Scale 1. Dimensions in Millimeters. 2. Package dimensions refer to JEDEC MS-024 Ref Min Nominal Max A 1.20 A1 0.05 0.10 0.15 A2 0.95 1.00 1.05 b 0.30 0.35 0.45 c 0.12 0.21 D 22.10 22.22 22.35 E 11.56 11.76 11.95 E1 10.03 10.16 10.29 e 0.80 BSC L 0.40 0.50 0.60 L1 0.80 REF R1 0.12 - - R2 0.12 - 0.25 θ 0° - 8° θ1 0.40 - - θ2 15° REF θ3 15° REF

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. MR4A16B Rev Date Description of Change

1 May 29, 2009 Establish Speed and Power Specifications

2 July 27, 2009 Increase BGA Package to 11 mm x 11 mm

3 Nov 26, 2009 Changed ball definition of H6 to A19 and G2 to NC in Figure 1.2. 4 Mar 10, 2010 Changed speed marking and timing specs to 35 ns part. Changed BGA package to 10 mm x 10mm 5 Apr 7, 2010 Added 54-TSOP package options.

6 Oct 7, 2011

Added AEC-Q100 Grade 1 product option. Max. magnetic field during write (Hmax_write ) increased to 8000 A/m. Revised IDDW typical from110 to 152mA, max from TBD to 180mA; IDDR max from TBD to 68mA; ISB1 typical from 11 to 9ma; ISB2 from typical 7 to 5mA. 7 Oct 28, 2011 Added note to BGA package option products are MSL-6 only, MSL-3 qualification underway. Fixed typo on BGA drawing: Top View incorrectly labeled Bottom View. 8 August 6, 2012 Figure 2.1 Power Up and Power Down Timing redrawn. Added 54-TSOP illustrations. Re- formatted all parametric tables. Reformatted Table 4.1 Ordering Part Numbers.

9 August 27, 2013 Corrected the AEC Q-100 Grade A ordering option to be available in 54-TSOP2, not 48-

BGA.

9.1 Jaunary 29,

2014 Corrected minor typo in Ordering PN table. 10 April 25, 2014 AEC-Q100 removed until qualified product is available.

11 September 17,

2014 48-BGA package options moisture sensitivity level upgraded to MSL-5. 11.1 May 19, 2015 Revised Everspin contact information. 11.2 June 11, 2015 Corrected Japan Sales Office telephone number. 11.3 July 29, 2015 Minor correction to the ‘ddd’ tolerance value for the BGA Package (Note 4.) 11.4 March 11, 2016 The BGA package moisture sensitivity level rating is changed to MSL-6 in Table 4.1.

11.5 November 22,

2016 The BGA package moisture sensitivity level rating is changed to MSL-5 in Table 4.1.

11.6 May 09, 2017 All products meet MSL-3 moisture sensitivity level

11.7 March 23, 2018 Updated the Contact Us table

1. REVISION HISTORY

MR4A16B Rev. 11.7 3/2018 Copyright © 2018 Everspin Technologies, Inc. Everspin Technologies, Inc. Information in this document is provided solely to enable system and software implementers to use Everspin Technologies products. There are no express or implied licenses granted hereunder to design or fabricate any integrated cir- cuit or circuits based on the information in this document. Everspin Technolo- gies reserves the right to make changes without further notice to any products herein. Everspin makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Everspin Technologies assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters, which may be provided in Everspin Technologies data sheets and/or speci- fications can and do vary in different applications and actual performance may vary over time. All operating parameters including “Typicals” must be validated for each customer application by customer’s technical experts. Ever- spin Technologies does not convey any license under its patent rights nor the rights of others. Everspin Technologies products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Everspin Technologies product could create a situation where personal injury or death may occur. Should Buyer purchase or use Everspin Technologies products for any such unintended or unauthorized application, Buyer shall indemnify and hold Everspin Tech- nologies and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Everspin Technologies was negligent regarding the design or manufacture of the part. Everspin™ and the Everspin logo are trademarks of Everspin Technologies, Inc. All other product or service names are the property of their respective owners. Copyright © 2018 Everspin Technologies, Inc. 7. HOW TO CONTACT US How to Reach Us: Home Page: www.everspin.com World Wide Information Request WW Headquarters - Chandler, AZ 5670 W. Chandler Blvd., Suite 100 Chandler, Arizona 85226 Tel: +1-877-480-MRAM (6726) Local Tel: +1-480-347-1111 Fax: +1-480-347-1175 support@everspin.com orders@everspin.com sales@everspin.com Europe, Middle East and Africa Everspin Europe Support support.europe@everspin.com Japan Everspin Japan Support support.japan@everspin.com Asia Pacific Everspin Asia Support support.asia@everspin.com Filename: EST00352_MR4A16B_Datasheet_Rev11.7 032318