MR27T1602F OKI | Alldatasheet

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Technical content

Issue Date: Mar. 12, 2002 MR27T1602F 1M–Word × 16–Bit or 2M–Word × 8–Bit P2ROM

FEATURES

  • 1,048,576-word × 16-bit/2,097,152-word × 8-bit electrically switchable configuration
  • 2.7 V to 3.6 V power supply
  • Access time 90 ns MAX
  • Operating current 30 mA MAX
  • Standby current 10 µA MAX
  • Input/Output TTL compatible
  • Three-state output PACKAGES
  • MR27T1602F-xxxMA 44-pin plastic SOP (SOP44-P-600-1.27-K)
  • MR27T1602F-xxxTP 44-pin plastic TSOP (TSOP(2)44-P-400-0.80-K)
  • MR27T1602F-xxxTN 48-pin plastic TSOP (TSOP(1)48-P-1220-0.50-K) P2ROM ADVANCED TECHNOLOGY P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following;
  • Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimizes liability as a custom product.
  • No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply.
  • No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price.
  • Custom Marking is available at no additional charge.
  • Pin Compatible with Mask ROM and some FLASH products. A15 A14 A13 A12 A11 A10 A19 NC NC NC NC NC NC A18 A17 48TSOP(Type-I) PIN CONFIGURATION (TOP VIEW) NC A18 A17 CE# V SS OE# D10 D11 NC A19 A10 A11 A12 A13 A14 A15 A16 BYTE# V SS D15/A–1 D14 D13 D12 V CC 44SOP, 44TSOP(Type-II) A16 BYTE# V SS D15/A–1 D14 D13 D12 V CC D11 D10 OE# V SS CE#

OKI Semiconductor MR27T1602F/P2ROM BLOCK DIAGRAM PIN DESCRIPTIONS Pin name Functions D15 / A–1 Data output / Address input A0 to A19 Address inputs D0 to D14 Data outputs CE# Chip enable input OE# Output enable input BYTE# Word / Byte select input VCC Power supply voltage VSS Ground NC No connect A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 CE# BYTE# OE# CE OE × 8/× 16 Switch D0 D2 D4 D6 D8 D10 D12 D14 D1 D3 D5 D7 D9 D11 D13 D15 Memory Cell Matrix 1M × 16-Bit or 2M × 8-Bit Multiplexer Output Buffer Row Decoder Column Decoder Address Buffer In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. A–1

OKI Semiconductor MR27T1602F/P2ROM FUNCTION TABLE Mode CE# OE# BYTE# V CC D0 to D7 D8 to D14 D15/A–1 Read (16-Bit) L L H D OUT Read (8-Bit) L L L D OUT Hi–Z L/H H Output disable L H L Hi–Z H Standby H ∗ L 3.0 V Hi–Z ∗: Don’t Care (H or L) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Value Unit Operating temperature under bias Ta 0 to 70 °C Storage temperature Tstg –55 to 125 °C Input voltage V I –0.5 to V CC+0.5 V Output voltage V O –0.5 to V CC+0.5 V Power supply voltage V CC relative to VSS –0.5 to 5 V Power dissipation per package P D — 1.0 W RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol Condition Min. Typ. Max. Unit VCC power supply voltage V CC 2.7 — 3.6 V Input “H” level V IH 2.2 — V CC+0.5∗ V Input “L” level V IL VCC = 2.7 to 3.6 V –0.5∗∗ — 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. PIN CAPACITANCE (VCC = 3.0 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Condition Min. Typ. Max. Unit Input C IN1 — — 8 BYTE# C IN2 VI = 0 V — — 120 Output C OUT V O = 0 V — — 10 pF

OKI Semiconductor MR27T1602F/P2ROM

ELECTRICAL CHARACTERISTICS

(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Typ. Max. Unit Input leakage current I LI V I = 0 to VCC — — 10 µA Output leakage current I LO V O = 0 to VCC — — 10 µA ICCSC CE# = V CC — — 10 µA VCC power supply current (Standby) ICCST CE# = V IH — — 1 m Α ICCA1 tc = 100 ns — — 30 mA VCC power supply current (Read) ICCA2 CE# = VIL OE# = VIH tc = 200 ns — — 16 mA Input “H” level V IH — 2.2 — V CC+0.5∗ V Input “L” level V IL — –0.5 ∗∗ — 0.6 V Output “H” level V OH I OH = –1 mA 2.4 — — V Output “L” level V OL I OL = 2 mA — — 0.4 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. AC Characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit Address cycle time t C — 90 — ns Address access time t ACC CE# = OE# = V IL — 90 ns CE# access time t CE OE# = V IL — 90 ns OE# access time t OE CE #= V IL — 30 ns tCHZ OE# = V IL 0 30 ns Output disable time tOHZ CE# = V IL 0 25 ns Output hold time t OH CE #= OE# = V IL 0 — ns Measurement conditions Output load Output 50 pF (Including scope and jig)

OKI Semiconductor MR27T1602F/P2ROM TIMING CHART (READ CYCLE) 8-Bit Read Mode (BYTE# = VIL) A-1 to A19 CE# OE# D0 to D7 tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH Valid Data tACC tC tACC 16-Bit Read Mode (BYTE# = VIH) A0 to A19 CE# OE# D0 to D15 tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH Valid Data tACC tC tACC

OKI Semiconductor MR27T1602F/P2ROM PACKAGE DIMENSIONS SOP44-P-600-1.27-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 2.10 TYP.5 Rev. No./Last Revised 4/Dec. 5, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages ar e very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

OKI Semiconductor MR27T1602F/P2ROM TSOP(2)44-P-400-0.80-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 0.54 TYP.5 Rev. No./Last Revised 3/Dec. 10, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages ar e very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

OKI Semiconductor MR27T1602F/P2ROM TSOP(1)48-P-1220-0.50-1K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 0.55 TYP.5 Rev. No./Last Revised 1/Dec. 2, 1999 Notes for Mounting the Surface Mount Type Package The surface mount type packages ar e very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

OKI Semiconductor MR27T1602F/P2ROM

REVISION HISTORY

No. Date Previous Edition Current Edition

Description

FEDR27T1602F-02-01 Jun. 2001 – – Final edition 1 Changed tC, tACC, tCE to 90ns Changed tOE to 30ns Changed ICCSC to 10uA Changed IOH, the condition of VOH, to –1 mA 5 4 Changed IOL, the condition of VOL, to 2 mA FEDR27T1602F-02-02 Mar. 12, 2002 1-4, 7 1-3 Changed the form

OKI Semiconductor MR27T1602F/P2ROM NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improp er installation, repair, alteration or accident, improp er handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third part y’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communicati on equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2002 Oki Electric Industry Co., Ltd.