MR27C1602B OKI | Alldatasheet

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Issue Date: Jun. 17, 2003 MR27C1602B 1,048,576–Word × 16–Bit or 2,097,152–Word × 8–Bit One Time PROM GENERAL DESCRIPTION The MR27C1602B is a 16 Mbit electrically One Time Programmable Read-Only Memory that can be electrically switched between 1,048,576-word × 16-bit and 2,097,152-word × 8-bit by the state of the BYTE# pin. The MR27C1602B supports high speed asynchronous read operation using a single 5.0V power supply.

FEATURES

  • 1,048,576-word × 16-bit/2,097,152-word × 8-bit electrically switchable configuration
  • +5.0 V power supply
  • Access time 90 nS MAX
  • Operating current 70 mA MAX
  • Standby current 50 µA MAX
  • Input/Output TTL compatible
  • Tri-state output
  • Packages: 42-pin plastic DIP (DIP42-P-600-2.54) (MR27C1602BRA) 44-pin plastic SOP (SOP44-P-600-1.27-K (MR27C1602BMA)

OKI Semiconductor MR27C1602B (OTP) PIN CONFIGURATION (TOP VIEW) Pin name Functions D15/A–1 Data output/Address input A0 to A19 Address input D0 to D14 Data output CE# Chip enable OE# Output enable BYTE#/VPP Mode switch/Program power supply voltage VCC Power supply voltage VSS GND NC Non connection NC A19 A10 A11 A12 A13 A14 A15 A16 BYTE#/VPP VSS D15/A–1 D14 D13 D12 V CC NC A18 A17 CE# V SS OE# D10 D11 44-pin SOP A19 A10 A11 A12 A13 A14 A15 A16 BYTE#/VPP VSS D15/A–1 D14 D13 D12 V CC A18 A17 CE# V SS OE# D10 D11 42-pin DIP

OKI Semiconductor MR27C1602B (OTP) BLOCK DIAGRAM FUNCTION TABLE Mode CE# OE# BYTE#/V PP V CC D0 to D7 D8 to D14 D15/A–1 Read (16-Bit) L L H D OUT Read (8-Bit) L L L D OUT Hi–Z L/H H Output disable L H L Hi–Z H Standby H ∗ L 5.0 V Hi–Z Program L H D IN Program inhibit H H Hi–Z Program verify H L 9.75 V 4.0 V DOUT ∗: Don’t Care (H or L) A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 CE# BYTE#/V PP OE# CE PGM OE × 8/× 16 Switch D0 D2 D4 D6 D8 D10 D12 D14 D1 D3 D5 D7 D9 D11 D13 D15 Memory Cell Matrix 1,048,576 × 16-Bit or 2,097,152 × 8-Bit Multiplexer Output Buffer Row Decoder Column Decoder Address Buffer In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. A–1

OKI Semiconductor MR27C1602B (OTP) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Value Unit Operating temperature under bias Ta 0 to 70 °C Storage temperature Tstg –55 to 125 °C Input voltage V I –0.5 to V CC+0.5 V Output voltage V O –0.5 to V CC+0.5 V Power supply voltage V CC –0.5 to 7 V Program power supply voltage V PP relative to VSS –0.5 to 11.5 V Power dissipation per package P D — 1.0 W RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol Conditio n Min. Typ. Max. Unit VCC power supply voltage V CC 4.5 — 5.5 V VPP power supply voltage V PP –0.5 — V CC+0.5 V Input “H” level V IH 2.2 — V CC+0.5∗ V Input “L” level V IL VCC = 4.5 to 5.5 V –0.5∗∗ — 0.8 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.

OKI Semiconductor MR27C1602B (OTP)

ELECTRICAL CHARACTERISTICS

(VCC = 5.0 V ± 0.5 V, Ta = 0 to 70°C) parameter Symbol Conditio n Min. Typ. Max. Unit Input leakage current I LI V I = 0 to VCC — — 10 µA Output leakage current I LO V O = 0 to VCC — — 10 µA ICCSC CE# = V CC — — 50 µA VCC power supply current (Standby) ICCST CE# = V IH — — 1 m Α VCC power supply current (Read) ICCA CE# = VIL, OE# = VIH tc = 90 ns — — 70 mA VPP power supply current I PP V PP = VCC — — 10 µA Input “H” level V IH — 2.2 — V CC+0.5∗ V Input “L” level V IL — –0.5 ∗∗ — 0.8 V Output “H” level V OH I OH = –400 µA 2.4 — — V Output “L” level V OL I OL = 2.1 mA — — 0.4 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. AC Characteristics (VCC = 5.0 V ± 0.5 V, Ta = 0 to 70°C) Parameter Symbol Condit ion Min. Max. Unit Address cycle time t C — 90 — ns Address access time t ACC CE# = OE# = V IL — 90 ns CE access time t CE OE# = V IL — 90 ns OE access time t OE CE# = V IL — 45 ns tCHZ OE# = V IL 0 30 ns Output disable time tOHZ CE# = V IL 0 25 ns Output hold time t OH CE# = OE# = V IL 0 — ns Measurement conditions Output 2.08 V 800 Ω 100 pF (Including scope and jig)

OKI Semiconductor MR27C1602B (OTP) TIMING CHART (READ CYCLE) 16-Bit Read Mode (BYTE# = V IH) A0 to A19 CE# OE# D0 to D15 8-Bit Read Mode (BYTE# = VIL) tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH tACC Valid Data tACC tC A–1 to A19 CE# OE# D0 to D7 D8 to D14 Hi-Z tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH tACC Valid Data tACC tC

OKI Semiconductor MR27C1602B (OTP) ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION) DC Characteristics (Ta = 25°C ± 5°C) Parameter Symbol Conditio n Min. Typ. Max. Unit Input leakage current I LI V I = VCC+0.5 V — — 10 µA VPP power supply current (Program) I PP2 CE# = V IL — — 50 mA VCC power supply current I CC — — — 70 mA Input “H” level V IH — V CC+1.0 — V CC+0.5 V Input “L” level V IL — –0.5 — 0.6 V Output “H” level V OH I OH = –400 µA 2.4 — — V Output “L” level V OL I OL = 2.1 mA — — 0.45 V Program voltage V PP — 9.5 9.75 10.0 V VCC power supply voltage (Program) V CC — 3.9 4.0 4.1 V VCC power supply voltage (Verify-1) V CV1 — 5.9 6.0 6.1 V VCC power supply voltage (Verify-2) V CV2 — 4.4 4.5 4.6 V VCC power supply voltage (Verify-3) V CV3 — 5.4 5.5 5.6 V Voltage is relative to VSS. AC Characteristics (VCC = 4.0 V ± 0.1 V, BYTE#/VPP = 9.75 V ± 0.25 V, Ta = 25°C ± 5°C) Parameter Symbol Conditio n Min. Typ. Max. Unit Address set-up time t AS — 100 — — ns OE set-up time t OES — 2 — — µs Data set-up time t DS — 100 — — ns Address hold time t AH — 2 — — µs Data hold time t DH — 100 — — ns Output float delay time from OE t OHZ — 0 — 25 ns VPP voltage set-up time t VS — 2 — — µs Program pulse width t PW — 9 10 11 µs Data valid from OE t OE — — — 50 ns Address hold from OE high t AOH — 0 — — ns Pin Check Function Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer. Setting up address as following condition call the preprogrammed codes on device outputs. (VCC = 4.0 V ± 0.1 V, CE# = VIL, OE# = VIL, BYTE#/VPP = VIH, Ta = 25°C ± 5°C) A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 DATA 1 0 1 0 1 0 1 0 1 VH∗ 1 0 1 0 1 0 1 1 0 0 FF00 0 1 0 1 0 1 0 1 0 VH∗ 0 1 0 1 0 1 0 0 1 1 00FF Other conditions FFFF ∗: VH = 8 V ± 0.25 V

OKI Semiconductor MR27C1602B (OTP) Consecutive Programming Waveforms Consecutive Program Verify Waveforms tAS A0 to A19 CE# OE# D0 to D15 tAH tPW Din High BYTE#/Vpp tDH tDS tVS Din tOHZ tAHO tACC A0 to A19 CE# OE# D0 to D15 High BYTE#/Vpp Dout tOE Dout 9.75 V

OKI Semiconductor MR27C1602B (OTP) Program and Program Verify Cycle Waveforms Pin Capacitance (VCC = 5.0 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Conditio n Min. Typ. Max. Unit Input C IN1 — — 8(10) BYTE#/VPP C IN2 VI = 0 V — — 120 Output C OUT V O = 0 V — — 10(12) pF ( ) : DIP only tOHZ tDS tOE tAS A0 to A19 CE# OE# D0 to D15 tAHO tPW Dout BYTE#/Vpp tDH Din tOES tOHZ 9.75 V

OKI Semiconductor MR27C1602B (OTP) Programming/Verify Flow Chart Programming Verify NG NO VCC=4.5V/VPP =4.5V(VCV2) Start Last Address? Increment Address Program 10 µs Pin Check NG PASS Verify(All Address) Verify(All Address) Start Pin Check Bad Insertion Device PassedYES PASS NG PASS NG PASS VCC=5.5V/VPP=5.5V(VCV3) Device Failed Bad Insertion Address = First Location VCC = 4.0 V VPP = 9.75 V Device Passed PASS NG Verify(All Address) Device Failed VCC =4.5V/VPP =4.5V(VCV2) NG Verify(All Address) VCC = 6V/VPP =6V(VCV1) X=2 X=X+1 X=0 YES NO PASS Address = First Location Address = First Location

OKI Semiconductor MR27C1602B (OTP) PACKAGE DIMENSIONS SOP44-P-600-1.27-K Mirror finish Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 2.10 TYP.5 Rev. No./Last Revised 4/Dec. 5, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages ar e very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code a nd desired mounting conditions (reflow method, temperature and times). (Unit: mm)

OKI Semiconductor MR27C1602B (OTP) DIP42-P-600-2.54 Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 6.20 TYP.5 Rev. No./Last Revised 2/Dec. 11, 1996 (Unit: mm)

OKI Semiconductor MR27C1602B (OTP)

REVISION HISTORY

No. Date Previous Edition Current Edition

Description

FEDR27V1602B-01-01 Dec, 2001 – – Final edition 1 FEDR27V1602B-01-03 Jun. 17, 20 03 – – Change over-bar fonts.

OKI Semiconductor MR27C1602B (OTP) NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improp er installation, repair, alteration or accident, improp er handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third part y’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communicati on equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2003 Oki Electric Industry Co., Ltd.