MR26V25605J OKI | Alldatasheet
Document overview
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Technical content
Issue Date: Jul. 9, 2004 MR26V25605J 8M–Word × 32–Bit or 16M–Word × 16–Bit P2ROM
FEATURES
- 8,388,608-word × 32-bit/16,777,216-word × 16-bit electrically switchable configuration
- 3.0 V to 3.6 V power supply
- Access time 90 ns MAX
- Operating current 60 mA MAX
- Standby current 50 µA MAX
- Input/Output TTL compatible
- Three-state output PACKAGES
- MR26V25605J-xxxMB 70-pin plastic SSOP (P-SSOP70-500-0.80-K-MC) PIN CONFIGURATION (TOP VIEW) A22 A21 A20 WORD# OE# CE# Vss D31/A-1 D15 D30/A-1 D14 Vss Vcc D29 D13 D28 D12 D27 D11 D26 D10 Vss Vcc D25 D24 Vcc A19 A18 A17 A16 A15 A14 A13 Vcc D16 D17 Vss Vcc D18 D19 D20 D21 Vss Vcc D22 D23 Vss A10 A11 A12
D31 / A–1,D30/A-1 Data output / Address input A0 to A22 Address inputs D0 to D29 Data outputs CE# Chip enable input OE# Output enable input WORD# Double word - Word select input VCC Power supply voltage VSS Ground In16-bit output mode, these pins are placed in a high-Z state and pin D31,D30 functions as the A-1 address pin. A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 CE# WORD# OE# CE OE × 16/× 32 Switch D0 D2 D4 D6 D8 D10 D12 D14 D16 D18 D20 D22 D24 D26 D28 D30 Memory Cell Matrix 8M × 32-Bit or 16M × 16-Bit Multiplexer Output Buffer Row Decoder Column Decoder Address Buffer A–1(D30/A-1[61] AND D31/A-1[63]) D1 D3 D5 D7 D9 D11 D13 D15 D17 D19 D21 D23 D25 D27 D29 D31
CE# OE# WORD# VCC D0 to D15 D16 to D29 D30/A–1,D31/A-1 Read (32-Bit) L L H DOUT Read (16Bit) L L L DOUT Hi–Z L/H H Output disable L H L Hi–Z H Standby H L 3.3 V Hi–Z ∗: Don’t Care (H or L) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Value Unit Operating temperature under bias Ta 0 to 70 Storage temperature Tstg –55 to 125 Input voltage VI –0.5 to VCC+0.5 V Output voltage VO –0.5 to VCC+0.5 V Power supply voltage VCC relative to VSS –0.5 to 5 V Power dissipation per package PD Ta = 25°C 1.0 W Output short circuit current IOS mA RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol Condition Min. Typ. Max. Unit VCC power supply voltage VCC 3.0 3.6 V Input “H” level VIH 2.2 VCC+0.5∗ V Input “L” level VIL VCC = 3.0 to 3.6 V –0.5∗∗ 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. PIN CAPACITANCE (VCC = 3.3 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Condition Min. Typ. Max. Unit Input CIN1 WORD# CIN2 VI = 0 V 400 Output COUT VO = 0 V pF
ELECTRICAL CHARACTERISTICS
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Typ. Max. Unit Input leakage current ILI VI = 0 to VCC µA Output leakage current ILO VO = 0 to VCC µA ICCSC CE# = VCC µA VCC power supply current (Standby) ICCST CE# = VIH mA VCC power supply current (Read) ICCA1 CE# = VIL OE# = VIH tc = 90 ns mA Input “H” level VIH 2.2 VCC+0.5∗ V Input “L” level VIL –0.5∗∗ 0.6 V Output “H” level VOH IOH = –2 mA 2.4 V Output “L” level VOL IOL = 2 mA 0.4 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. AC Characteristics (VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit Address cycle time tC ns Address access time tACC CE# = OE# = VIL ns CE# access time tCE OE# = VIL ns OE# access time tOE CE #= VIL ns tCHZ OE# = VIL ns Output disable time tOHZ CE# = VIL ns Output hold time tOH CE #= OE# = VIL ns Measurement conditions Output load Output 50 pF (Including scope and jig)
TIMING CHART (READ CYCLE) 16-Bit Read Mode (WORD# = VIL) A-1 to A22 CE# OE# D0 to D15 tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH Valid Data tACC tC tACC 32-Bit Read Mode (WORD# = VIH) A0 to A22 CE# OE# D0 to D31 tC tCE tOE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOH Valid Data tACC tC tACC
P-SSOP70-500-0.80-K-MC Package material Epoxy resin Lead frame material 42 alloy Pin treatment Solder plating (≥5µm) Package weight (g) 2.15 TYP. Rev. No./Last Revised 1/Nov. 13, 2002 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)
REVISION HISTORY
No. Date Previous Edition Current Edition
Description
Nov., 2002 Final edition 1 FEDR26V25605J-02-02 Jul. 31, 2003 Change tCHZ, tOHZ to 20ns FEDR26V25605J-02-03 Jul. 9, 2004 Add PD condition and IOS = 10mA
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