MPD-0226SM MARKIMICROWAVE | Alldatasheet
Document overview
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Technical content
2-26.5 GHz MMIC 2-way Power Divider/Combiner MPD-0226SM Copyright © 2020 Marki Microwave, Inc. All Rights Reserved. P a g e 1 | R e v .A QFN
1 Device Overview
1.1 General Description
1.2 Features
▪ 2 GHz to 26.5 GHz In-phase Power splitting ▪ 20 dB Typical Output to Output Isolation ▪ Outstanding phase and amplitude balance ▪ RoHS Compliant ▪ S3P data MPD-0226SM.zip
1.3 Functional Block Diagram
1.4 Part Ordering Options1
1 Refer to our website for a list of definitions for terminology presented in this table. Part Number Description Package Green Status Product Lifecycle Export Classification MPD-0226SM 4 X 4 mm QFN SM RoHS Active EAR99 EVAL-MPD-0226 Connectorized Evaluation Fixture Eval RoHS Active EAR99 Input Output 1 Output 2 MPD-0226SM is a MMIC 2-way Wilkinson power divider. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances result in less unit to unit variation than traditional power divider technologies, allowing for accurate simulations using the provided S3P file taken from measured production units. Power dividers are passive reciprocal devices that can be used either as power combiners or as power dividers. Applications include Radar, Satcom, EW and test equipment. The MPD-0226SM is available as a 4 X 4 mm QFN package. Evaluation boards are also available.
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Revision History
Revision Code Revision Date Comment - June 2020 Initial Datasheet Release A January 2021 Specs table update
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2 Port Configurations and Functions
2.1 Port Diagram
A bottom-up view of the MPD-0226SM’s SM package outline drawing is shown below. The MMIC Power dividers are passive reciprocal devices allowing either power splitting or power combining.
2.2 Port Functions
Port Function Description Equivalent Circuit Pin 1 Output 1 The output 1 port is DC short to the other two ports and open to ground. Pin 5 Output 2 The output 2 port is DC short to the other two ports and open to ground. Pin 13 Input/common The common port is DC short to the other two ports and open to ground. Pad Ground SM package ground path is provided through the ground paddle. Ground Paddle.094 Sq. [2.40] .020 Typ [.50] .011 Typ [.27] .019 Typ [.47] .157 [4.00] .031 Typ [.80] .047 [1.20] .039 Typ [1.00] .157 [4.00] N/C MBAL 6879 YYWW Function N/C Pad # N/C8 N/C N/C N/C N/C N/C N/C N/C14 N/C17 N/C20 IN N/C N/C N/C N/C N/C 678910 16 17 18 19 20
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3 Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime. Parameter Maximum Rating Units DC Current 60 mA Power Handling, at any Port TBD dBm Operating Temperature -55 to +100 °C Storage Temperature -65 to +125 °C
3.2 Package Information
ESD Human Body Model (HBM), per MIL-STD-750, Method 1020 N/A
3.3 Electrical Specifications¹
The electrical specifications apply at TA=+25°C in a 50Ω system. Min and Max limits are guaranteed at TA=+25°C. Parameter Frequency (GHz) Min Typ. Max Units Nominal Power Splitting 2-26.5 3 dB Excess Insertion Loss² 2-20 1.5 4 dB 20-26.5 3 6 Nominal Phase Shift 2-26.5
0 Degrees
Amplitude Balance 0.2 0.8 dB Phase Balance 2 8.5 Degrees VSWR 1.25 Isolation 20 dB Impedance 50 Ω 1 All measured data is taken from the eval board without de-embedding of the connectors and traces. ²Excess Insertion Loss = (Common Port to Output Port Insertion Loss) – 3 dB.
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3.4 Typical Performance Plots
Fig. 1. Total Insertion loss (Common to output port) Fig. 2. Return loss for common port and output ports. Fig. 3. Amplitude balance between output ports. Fig. 4. Phase balance between output ports. Fig. 5. Isolation between differential ports
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4 Mechanical Data
4.1 SM Package Outline Drawing
Notes: 1. Substrate material is LCP. 2. I/O Leads and Ground Paddle plating is (from base to finish): Ni: 0.5um MIN Pd: 0.02um MIN Au: 0.05um MAX 3. All unconnected pins should be connected to PCB RF ground.
4.2 SM Package Footprint
QFN-Package Surface-Mount Landing Pattern Click here for a DXF of the above layout. Click here for leaded solder reflow. Click here for lead-free solder reflow. Function N/C Pad # N/C8 N/C N/C N/C N/C N/C N/C N/C14 N/C17 N/C20 IN N/C N/C N/C N/C N/C 678910 16 17 18 19 20 N/C MPD 6876 YYWW Ground Paddle.157 [4.00] .094 Sq. [2.40] .020 Typ [.50] .011 Typ [.27] .019 Typ [.47] .157 [4.00] .031 Typ [.80] .047 [1.20] .039 Typ [1.00]
0.013 Typ
0.151 0.006
0.006 Typ
Ø0.010 Plated Thru Via, Copper or Non Conductive fill is recommended, 41 PL 0.0 0.0 0.028 0.033 0.033 0.045 0.046 0.019 0.026 0.048 0.054 0.064 0.070 0.107 0.113 0.123 0.129 0.157 0.051 0.107 0.111 0.125 0.112 0.124 0.129 0.157 0.00525 0.023 Typ0.0135 Typ 4mm QFN Plastic 20 Lead sample drawing Isolated Lead Pad to help stabilize QFN's position during reflow process, 4 PL 0.026 0.019 0.132 0.138 0.090 0.085 0.073 0.067 0.132 0.138 0.072 0.085 The landing pattern is to be used on Rogers4003 0.008" thick, and taper sample is below. Grounded Coplanar wave guide with 5.25mil slot.
0.012 Typ
www.markimicrowave.com MPD-0226SM Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any product. © Marki Microwave, Inc.
4.3 Evaluation Board outline
1.000 [25.40] 1.000 [25.40] 2.092 [53.13] 1.046 [26.57] 0.500 [12.70] Edge Mount Connector
2.92 Female, 3PL
0.546 [13.87] microwave EVAL-MPD-0226 Backside Label O O I PROJECTION [MM] INCH All measurements are typical MPD 6876YYWW