HLM-40U MARKIMICROWAVE | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
High Power 40GHz Limiter HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 1 | R e v . B Module Die 1. Device Overview
1.1 General Description
The HLM-40 is a high-power GaAs Schottky diode signal limiter featuring high IP3 and high power handling. It offers low insertion loss and low return loss from DC through Ka band and has a typical 1dB compression point of 15dBm. Its high power handling makes it ideal for protecting sensitive components and for applications requiring high linearity. It is available as a wire bondable die and as a connectorized module.
1.2 Features
▪ DC to 40 GHz limiter ▪ 20W Peak Power (pulsed), 4W CW ▪ 18dBm Flat Leakage @ 1W CW ▪ Typical P1dB of 15dBm ▪ Small signal S2P data: HLM-40U.zip, HLM-40CH.zip
1.3 Functional Block Diagram
1.4 Part Ordering Options1
Number Description Package Green Status Product Lifecycle Export Classification HLM-40CH Wire bondable die CH RoHS Active EAR99 HLM-40U Connectorized module U Active EAR99 1 Refer to our website for a list of definitions for terminology presented in this table.
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 2 | R e v . B Table of Contents
3.3 Linear Regime Electrical Specifications
4.1 Mounting and Bonding
Revision History
Revision Code Revision Date Comment - September 2019 Initial Release A October 2019 Corrected References B December 2019 Updated sect. 3.4 Graphs
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 3 | R e v . B 2. Port Configurations and Functions
2.1 Port Diagram
A top-down view of the HLM-40’s CH package outline drawing is shown below. The HLM- 40 has the input and output ports given in Port Functions.
2.2 Port Functions
Port Function Description Equivalent Circuit for Package IN Input The input port is diode connected for the CH and U package. OUT Output The output port is diode connected for the CH and U package. GND Ground CH package ground path is provided through the substrate and ground bond pads. U package ground provided through metal housing and outer coax conductor.
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 4 | R e v . B 3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime. Parameter Maximum Rating Units Average Power Handling at input port2,3 4 W Peak Power Handling at input port3 20 W Operating Temperature -55 to +100 °C Storage Temperature -65 to +125 ºC
3.2 Package Information
ESD Human Body Model (HBM), per MIL-STD-750, Method 1020 1A Weight U Package 10 g The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the connectorized U-package limiter unless otherwise specified. Linear Specifications valid for input power up to the 0.1dB compression point. See page 5 for P0.1dB graph. Min and Max limits are guaranteed at TA=+25°C. Parameter Test Conditions Min Typical Max Units Insertion Loss, bare die DC – 40GHz 0.5 1.5 dB Insertion Loss, U package 1 3 Return Loss, bare die 26 dB Return Loss, U package 14 Flat Leakage at 1W 18 dBm Input IP3 (IIP3) See graph dBm Input 1dB Gain Compression Point (P1dB) 15 dBm Recovery Time4 10 ps 2 Average power handling derated linearly to +35dBm at 85°C. Power handling spec based on observed power handling at 800MHz. Actual power handling is frequency specific. 3 See section 3.5 for basis of power handling specs. 4 Calculated based on equivalent capacitance and resistance.
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 5 | R e v . B
3.4 Typical Performance Plots
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 6 | R e v . B
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 7 | R e v . B
3.5 Input Power at Observed Failure
Power handling specification is based on tests performed at different combinations of temperature and frequency. Input power was increased until catastrophic failure was observed. Results are shown in the following table. The power handling specification listed in section 3.1 is based on the worst observed power handling derated by 3dB. Frequency Maximum Average Power Handling Unit at 25°C at 85°C
0.8 GHz 39 38
dBm 2.5 GHz 42 41
6 GHz 40 39
Frequency Maximum Peak Power Handling5 Unit
2 GHz 35 W
5 Tested using a 1µs pulse, 1% duty cycle at 25°C
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 8 | R e v . B 4. Die Mounting Recommendations
4.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground. Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
4.2 Handling Precautions
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces. Static Sensitivity GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments. Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
www.markimicrowave.com HLM-40 Copyright © 2019 Marki Microwave, Inc. P a g e 9 | R e v . B
4.3 Bonding Diagram
- Mechanical Data
5.1 CH Package Outline Drawing
- CH Substrate material is 0.004 in thick GaAs. 2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.
www.markimicrowave.com HLM-40 Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any product. © Marki Microwave, Inc.
5.2 U Package Outline Drawing
Unless otherwise specified, dimensions are in inches. Tolerances are: .XX ± .02 .XXX ±.005