MMD-2060H MARKIMICROWAVE | Alldatasheet
Document overview
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Technical content
GaAs MMIC Millimeter Wave Doubler MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 1 | R e v . A Module Die 1. Device Overview
1.1 General Description
The MMD-2060H is a MMIC millimeter wave doubler fabricated with GaAs Schottky diodes. This operates over a guaranteed 10 to 30 GHz input frequency range or a doubled output frequency range of 20 to 60 GHz. It features excellent conversion loss, superior isolations and harmonic suppressions across a broad bandwidth. Both the wire bondable die and connectorized units are available.
1.2 Features
▪ High fundamental rejection ▪ Millimeter wave output frequencies
1.3 Applications
▪ High frequency synthesis ▪ LO signal chain
1.4 Functional Block Diagram
1.5 Part Ordering Options1
Number Description Package Green Status Product Lifecycle Export Classification MMD-2060HCH Wire bondable die CH RoHS Active EAR99 MMD-2060HU Connectorized module; 1.85 mm connector output U Active EAR99 1 Refer to our website for a list of definitions for terminology presented in this table.
www.markimicrowave.com MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 2 | R e v . A Table of Contents 3.3 Recommended Operating Conditions . 4
4.1 Mounting and Bonding
Revision History
Revision Code Revision Date Comment - November 2018 Datasheet Initial Release A November 2018 Correction to Performance Plots Limits
www.markimicrowave.com MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 3 | R e v . A 2. Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MMD-2060H’s CH package outline drawing is shown below. The MMD-2060H should only be used in the forward direction, with the input and output ports given in Port Functions.
2.2 Port Functions
Port Function Description Equivalent Circuit for Package Port 1 Input Port 1 is DC coupled to the diodes for the CH and U packages. Blocking capacitor is optional. Port 2 Output Port 2 is DC open for the CH and U package. GND Ground CH package ground path is provided through the substrate and ground bond pads. U package ground provided through metal housing and outer coax conductor.
www.markimicrowave.com MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 4 | R e v . A 3. Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime. Parameter Maximum Rating Units Port 1 DC Current 25 mA Port 2 DC Current N/A mA Power Handling, at any Port +23 dBm Operating Temperature -55 to +100 °C Storage Temperature -65 to +125 ºC
3.2 Package Information
ESD Human Body Model (HBM), per MIL-STD-750, Method 1020 1A Weight U Package 10 g
3.3 Recommended Operating Conditions
The Recommended Operating Conditions indicate the limits, inside which the device should be operated, to guarantee the performance given in Electrical Specifications Operating outside these limits may not necessarily cause damage to the device, but the performance may degrade outside the limits of the electrical specifications. For limits, above which damage may occur, see Absolute Maximum Ratings. Min Nominal Max Units TA, Ambient Temperature -55 +25 +100 °C Input Power +10 +15 dBm
3.4 Sequencing Requirements
There is no requirement to apply power to the ports in a specific order. However, it is recommended to provide a 50Ω termination to each port before applying power. This is a passive diode doubler that requires no DC bias.
www.markimicrowave.com MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 5 | R e v . A
3.5 Electrical Specifications
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the connectorized U package doubler used in the forward direction with a +11 dBm sine wave input. Min and Max limits apply only to our connectorized units and are guaranteed at TA=+25°C. RF testing of our die is performed on a sample basis to verify conformance to datasheet guaranteed specifications. Parameter Test Conditions Min Typical Max Units Input (Port 1) Frequency Range 10 30 GHz Output (Port 2) Frequency Range 20 60 Input Power +10 +15 dBm 2F Conversion Loss (CL) Input = 10 - 30 GHz Output = 20 - 60 GHz 10.5 13 dB Suppression2,3 1F Input = 10 - 30 GHz Output = 10 - 30 GHz 38 dBc 3F Input = 10 – 20 GHz Output = 30 - 60 GHz 39.5 4F Input = 10 – 15 GHz Output = 40 - 60 GHz 12.5 Isolations4 1F Input = 10 – 30 GHz Output = 10 - 30 GHz 49.7 dB 3F Input = 10 – 20 GHz Output = 30 – 60 GHz 50 4F Input = 10 – 15 GHz Output = 40 - 60 GHz 22.5
2 Suppressions and isolations measured with an input source with >60dBc (relative to fundamental
input) harmonic suppression
3 Suppression is defined as the harmonic power relative to the 2F doubled output power
4 Isolation is defined as the harmonic power relative to the 1F fundamental input power.
www.markimicrowave.com MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 6 | R e v . A
3.6 Typical Performance Plots
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www.markimicrowave.com MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 8 | R e v . A 4. Die Mounting Recommendations
4.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground. Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
4.2 Handling Precautions
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces. Static Sensitivity GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments. Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
www.markimicrowave.com MMD-2060H Copyright © 2018 Marki Microwave, Inc. P a g e 9 | R e v . A
4.3 Bonding Diagram
www.markimicrowave.com MMD-2060H Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any product. © Marki Microwave, Inc. 5.Mechanical Data
5.1 CH Package Outline Drawing
5.2 U Package Outline Drawing
.005 [.13] min clearance .004 [.10] .002 [.04] .010 [.25] .046 [1.17] .027 [.69] .054 [1.38] bonding pad 2 PL F INCH [MM] PROJECTION