MM1-0832LCH-2 | DigiCamel IC Datasheet

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PDF pages: 13

Technical content

1.1 General Description

The MM1-0832L is a GaAs MMIC double balanced mixer that is designed for and operates at X through K bands. MM1-0832L is a low power K band mixer that works well as both an up and down converter. This mixer offers low conversion loss and high LO to RF isolation over a broadband X to K band. The sister component MM1-0832H is recommended for high linearity applications. The MM1-0832L is available as both a wire bondable die and as a connectorized module. For a list of recommended LO driver amps for all mixers and IQ mixers, see here.

1.2 Features

▪ Low +7 dBm minimum LO drive ▪ Low cost K band mixer ▪ Broadband Performance ▪ RoHS Compliant

1.3 Applications

▪ Mobile test and measurement equipment ▪ Power efficient modules ▪ Radar and satellite communications ▪ 5G transceivers

1.4 Functional Block Diagram

1.5 Part Ordering Options1

Number Description Package Green Status Product Lifecycle Export Classification MM1-0832LCH-2 Wire bondable die CH RoHS Active EAR99 MM1-0832LS Connectorized module S Active EAR99 1 Refer to our website for a list of definitions for terminology presented in this table.

www.markimicrowave.com MM1-0832L Copyright © [2018, 2020] Marki Microwave, Inc. All Rights Reserved P a g e 2 | R e v . - Table of Contents 3.3 Recommended Operating Conditions . 4 3.6.1 Typical Performance Plots: IP3 .. 8

3.6.2 Typical Performance Plots: LO

3.6.3 Typical Spurious Performance:

3.6.4 Typical Spurious Performance: Up-

4.1 Mounting and Bonding

Revision History

Revision Code Revision Date Comment - October 2018 Datasheet Initial Release

2.1 Port Diagram

A top-down view of the MM1-0832L’s CH package outline drawing is shown below. The MM1-0832L has the input and output ports given in Port Functions. The MM1-0832L can be used in either an up or down conversion. For configuration A, input the LO into port 1, use port 3 for the RF, and port 2 for the IF. For configuration B, input the LO into port 3, use port 1 for the RF, and port 2 for the IF.

2.2 Port Functions

Port Function Description Equivalent Circuit for Package Port 1 LO (Configuration A) RF (Configuration B) Port 1 is DC open for the CH and S packages. Port 2 IF Port 2 is diode connected for the CH and S packages. Port 3 RF (Configuration A) LO (Configuration B) Port 3 is DC open for the CH and S packages. GND Ground CH package ground path is provided through the substrate and ground bond pads. S package ground provided through metal housing and outer coax conductor.

3.1 Absolute Maximum Ratings

The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime. Parameter Maximum Rating Units Port 1 DC Current N/A mA Port 2 DC Current N/A mA Power Handling, at any Port +30 dBm Operating Temperature -55 to +100 °C Storage Temperature -65 to +125 ºC

3.2 Package Information

ESD Human Body Model (HBM), per MIL-STD-750, Method 1020 1A Weight S Package 12 g

3.3 Recommended Operating Conditions

The Recommended Operating Conditions indicate the limits, inside which the device should be operated, to guarantee the performance given in Electrical Specifications Operating outside these limits may not necessarily cause damage to the device, but the performance may degrade outside the limits of the electrical specifications. For limits, above which damage may occur, see Absolute Maximum Ratings. Min Nominal Max Units TA, Ambient Temperature -55 +25 +100 °C LO Input Power +7 +15 dBm

3.4 Sequencing Requirements

There is no requirement to apply power to the ports in a specific order. However, it is recommended to provide a 50Ω termination to each port before applying power. This is a passive diode mixer that requires no DC bias.

3.5 Electrical Specifications

The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the connectorized S package mixer used in the forward direction with a +9 dBm sine wave input. Specifications shown for configuration A (B). Min and Max limits apply only to our connectorized units and are guaranteed at TA=+25°C. All bare die are 100% DC tested and visually inspected. Parameter Test Conditions Min Typical Max Units RF (Port 3) Frequency Range 8 32 GHz LO (Port 1) Frequency Range 8 32 I (Port 2) Frequency Range 0 12 Conversion Loss (CL)2 RF/LO = 8 - 32 GHz I = DC - 4 GHz 8 (9.5) (11.5) dB RF/LO = 8 - 32 GHz I = 4 - 12 GHz 9.5 (11) Noise Figure (NF)3 RF/LO = 8 - 32 GHz I = DC – 0.2 GHz 8.5 dB Isolation LO to RF RF/LO = 8 - 32 GHz 46 dB LO to IF IF/LO = 8 - 32 GHz 34 RF to IF RF/IF = 8 - 32 GHz 35 Input IP3 (IIP3) RF/LO = 8 - 32 GHz I = DC – 0.2 GHz +13.5 (+15) dBm Input 1 dB Gain Compression Point (P1dB) +2 (+4) dBm 2 Measured as a down converter to a fixed 91MHz IF. 3 Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater than 5 MHz.

3.6 Typical Performance Plots

3.6.1 Typical Performance Plots: IP3

3.6.2 Typical Performance Plots: LO Harmonic Isolation

3.6.3 Typical Spurious Performance: Down-Conversion

Typical spurious data is provided by selecting RF and LO frequencies (± m*LO ± n*RF) within the RF/LO bands, to create a spurious output within the IF band. The mixer is swept across the full spurious band and the mean is calculated. The numbers shown in the table below are for a -10 dBm RF input. Spurious suppression is scaled for different RF power levels by (n-1), where “n” is the RF spur order. For example, the 2RF x 2LO spur is 67 dBc for a -10 dBm input, so a -20 dBm RF input creates a spur that is (2-1) x (-10 dB) lower, or 77 dBc. Data is shown for the frequency plan in 3.6 Typical Performance. mLOx0RF plots can be found in section 3.6.2 Typical Performance Plots: LO Harmonic Isolation. 0LOx1RF plot is identical to the plot of LO-RF isolation. Typical Down-conversion spurious suppression (dBc): Config A (B) -10 dBm RF Input 0xLO 1xLO 2xLO 3xLO 4xLO 5xLO 0xRF - 35 (33) 64 (57) 57 (59) 91 (73) N/A 1xRF 27 (24) Reference 30 (36) 13 (13) 41 (42) 29 (31) 2xRF 72 (80) 57 (40) 67 (65) 57 (47) 64 (71) 51 (49) 3xRF 86 (92) 48 (48) 68 (85) 57 (58) 64 (78) 53 (58) 4xRF 109 (122) 95 (87) 96 (94) 100 (85) 101 (99) 99 (84) 5xRF N/A 92 (91) 90 (101) 93 (103) 105 (117) 98 (99)

3.6.4 Typical Spurious Performance: Up-Conversion

Typical spurious data is taken by mixing an input within the IF band, with LO frequencies (± m*LO ± n*IF), to create a spurious output within the RF output band. The mixer is swept across the full spurious output band and the mean is calculated. The numbers shown in the table below are for a -10 dBm IF input. Spurious suppression is scaled for different IF input power levels by (n-1), where “n” is the IF spur order. For example, the 2IFx1LO spur is typically 65 dBc for a - 10 dBm input with a sine-wave LO, so a -20 dBm IF input creates a spur that is (2-1) x (-10 dB) lower, or 75 dBc. Data is shown for the frequency plan in 3.6 Typical Performance. Typical Up-conversion spurious suppression (dBc): Config A (B) -10 dBm RF Input 0xLO 1xLO 2xLO 3xLO 4xLO 5xLO 0xIF - 35 (33) 41 (33) 56 (58) 66 (43) N/A 1xIF 27 (24) Reference 32 (38) 14 (12) 37 (38) 29 (25) 2xIF 63 (58) 65 (64) 49 (39) 57 (70) 58 (41) 66 (74) 3xIF 80 (87) 56 (55) 61 (73) 50 (46) 63 (78) 56 (51) 4xIF 99 (82) 101 (100) 92 (79) 90 (103) 77 (78) 98 (105) 5xIF 107 (118) 89 (90) 100 (110) 86 (78) 98 (111) 79 (83)

4.1 Mounting and Bonding Recommendations

Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground. Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.

4.2 Handling Precautions

Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces. Static Sensitivity GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments. Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.

4.3 Bonding Diagram

www.markimicrowave.com MM1-0832L Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any product. © Marki Microwave, Inc. 5. Mechanical Data

5.1 CH Package Outline Drawing

CH Substrate material is 0.004 in thick GaAs. 2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au.

5.2 S Package Outline Drawing

Product Information

MM1-0832LCH-2 specifications and overview.

Summary

GaAs MMIC Double Balanced Mixer

Description

GaAs MMIC Double Balanced Mixer

Source title MM1-0832LCH-2 Datasheet(PDF) - Marki Microwave

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