MM1-0320H MARKIMICROWAVE | Alldatasheet
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Compact Chip Style Package (0.058” x 0.046”x0.004”) CAD Optimized for Superior Isolation and Spurious Response Broadband Performance Excellent Unit-to-Unit Repeatability Fully nonlinear software models available with Marki PDK for Microwave Office® RoHS Compliant Electrical Specifications - Specifications guaranteed from -55 to +100C, measured in a 50Ω system. Specifications are shown for Configurations A (B). See page 2 for port locations. All bare die are 100% DC tested and 100% visual inspected. RF testing is performed on a sample basis to verify conformance to datasheet guaranteed specifications. Consult factory for more information. Parameter LO RF IF Min Typ Max LO drive level (dBm) (GHz) (GHz) (GHz) Conversion Loss 3.5-20 DC-4 8 (9) 13 (16) Isolation (dB) LO-RF See LO-IF Plots RF-IF Input 1 dB Compression (dBm) +9 Config. A: +13 to +20 +9 Config. B: +12 to +17 Input Two-Tone Third Order Intercept Point (dBm) +20 Config. A: +13 to +20 +20 Config. B: +12 to +17 Part Number Options Please specify diode level and package style by adding to model number. Package Styles Examples Connectorized1, 3 S MM1-0320HCH-2, MM1-0320HS Chip2, 3 (RoHS) CH-2 MM1-0320 (Model) H (Diode Option) CH-2 (Package) 1Connectorized package consists of chip package wire bonded to a substrate, equivalent to an evaluation board. 2Chip package connects to external circuit through wire bondable gold pads. 3Note: For port locations and I/O designations, refer to the drawings on page 2 of this document. The MM1-0320H is a passive double balanced MMIC mixer. It features excellent conversion loss, superior isolations and spurious performance across a broad bandwidth, in a highly miniaturized form factor. Accurate, nonlinear simulation models are available for Microwave Office® through the Marki Microwave PDK. The MM1-0320H is available as a wire bondable chip or an SMA connectorized package. The MM1- 0320H is a superior alternative to Marki Microwave carrier and packaged M1 and M3 mixers. For a list of recommended LO driver amps for all mixers and IQ mixers, see here.
Copyright © [2020] Marki Microwave, Inc. All Rights Reserved 10/19/18 GaAs DOUBLE-BALANCED MIXER MM1-0320H Page 2 LO/RF 3.5 to 20 GHz IF DC to 4 GHz 1. Configuration A/B refer to the same part number (MM1-0320H) used in one of two different ways for optimal spurious performance. For the lowest conversion loss, use the mixer in Configuration A (port 1 as the LO input, port 3 as the RF input or output). If you need to use a lower LO drive, use the mixer in Configuration B (port 1 as the RF input or output, port 3 as the LO input). For optimal spurious suppression, experimentation or simulation is required to choose between Configuration A and B. For more information, see here. 1. CH Substrate material is .004 thick GaAs. 2. I/O traces and ground plane finish are 2 microns Au. 3. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). MM10320H Configuration A LO 1 Function RF IF Port Number Configuration B Port Number Note: S-Package Connectors are not removeable Connector SMA Female SMA Female SMA Female Type Ø.067 Thru, 4 PL [5.0] .20 [1.70] [7.11] .280 [6.60] .260 [13.21] .520 [11.07] .436 [1.07] .042 [4.06] .160 .560 [6.10] [14.22] .240 .06 Rad 4 PL [1.5] PROJECTION [MM] INCH D/C 1 3 [9.9] .39 XX=±.01 XXX=±.005
Copyright © [2020] Marki Microwave, Inc. All Rights Reserved 10/19/18 GaAs DOUBLE-BALANCED MIXER MM1-0320H Page 3 LO/RF 3.5 to 20 GHz IF DC to 4 GHz Typical Performance -20 -18 -16 -14 -12 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 RF Frequency (GHz) Conversion Loss (dB)1-4 Configuration A Configuration B -10 0 1 2 3 4 5 6 7 IF Frequency (GHz) Relative IF Response (dB)
8 GHz RF - Configuration A
8 GHz RF - Configuration B
-20 -18 -16 -14 -12 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 RF Frequency (GHz) Configuration A Conversion Loss vs. LO Power (dB)1-4 +17 dBm +12 dBm +10.5 dBm +9 dBm -20 -18 -16 -14 -12 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 RF Frequency (GHz) Configuration B Conversion Loss vs. LO Power (dB)1-4 +15 dBm +10.5 dBm +9 dBm +8 dBm -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 LO Frequency (GHz) LO to RF Isolation (dB) Configuration A Configuration B -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 LO Frequency (GHz) LO to IF Isolation (dB) Configuration A Configuration B
Copyright © [2020] Marki Microwave, Inc. All Rights Reserved 10/19/18 GaAs DOUBLE-BALANCED MIXER MM1-0320H Page 4 LO/RF 3.5 to 20 GHz IF DC to 4 GHz Typical Performance -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 RF Frequency (GHz) RF to IF Isolation (dB) Configuration A Configuration B -30 -25 -20 -15 -10 0 1 2 3 4 5 6 7 IF Frequency (GHz) IF Return Loss (dB) -25 -20 -15 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 RF Frequency (GHz) RF Return Loss (dB) Configuration A Configuration B -25 -20 -15 -10 2 4 6 8 10 12 14 16 18 20 22 24 26 LO Frequency (GHz) LO Return Loss (dB) Configuration A Configuration B 3 5 7 9 11 13 15 17 19 21 23 25 RF Frequency (GHz) Input IP3 (dBm) Configuration A Configuration B 3 5 7 9 11 13 15 17 19 21 23 25 RF Frequency (GHz) Output IP3 (dBm) Configuration A Configuration B
Copyright © [2020] Marki Microwave, Inc. All Rights Reserved 10/19/18 GaAs DOUBLE-BALANCED MIXER MM1-0320H Page 5 LO/RF 3.5 to 20 GHz IF DC to 4 GHz Typical Performance -90 -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 LO Output Frequency (GHz) Even LO Harmonic to RF Isolation (dB) 2xLO Configuration A 2xLO Configuration B 4xLO Configuration A 4xLO Configuration B -90 -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 LO Output Frequency (GHz) Even LO Harmonic to IF Isolation (dB) 2xLO Configuration A 2xLO Configuration B 4xLO Configuration A 4xLO Configuration B -90 -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 LO Output Frequency (GHz) Odd LO Harmonic to RF Isolation (dB) 3xLO Configuration A 3xLO Configuration B 5xLO Configuration A 5xLO Configuration B -90 -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 LO Output Frequency (GHz) Odd LO Harmonic to IF Isolation (dB) 3xLO Configuration A 3xLO Configuration B 5xLO Configuration A 5xLO Configuration B -90 -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 RF Input Frequency (GHz) 2RF x 2LO Spurious Suppression (dBc) -10 dBm RF Input Configuration A Configuration B -90 -80 -70 -60 -50 -40 -30 -20 -10 2 4 6 8 10 12 14 16 18 20 RF Output Frequency (GHz) 2IF x 1LO Spurious Suppression (dBc) -10 dBm IF Input Configuration A Configuration B
Copyright © [2020] Marki Microwave, Inc. All Rights Reserved 10/19/18 GaAs DOUBLE-BALANCED MIXER MM1-0320H Page 6 LO/RF 3.5 to 20 GHz IF DC to 4 GHz Downconversion Spurious Suppression Spurious data is taken by selecting RF and LO frequencies (+mLO+nRF) within the RF/LO bands, to create a spurious output within the IF output band. The mixer is swept across the full spurious band and the mean is calculated. The numbers shown in the table below are for a -10 dBm RF input. Spurious suppression is scaled for different RF power levels by (n-1), where “n” is the RF spur order. For example, the 2RFx2LO spur is 68 dBc for the A configuration for a -10 dBm input, so a -20 dBm RF input creates a spur that is (2-1) x (-10 dB) dB lower, or 78 dBc. Typical Downconversion Spurious Suppression (dBc): A Configuration (B Configuration) -10 dBm RF Input 0xLO 1xLO 2xLO 3xLO 4xLO 5xLO 1xRF 23 (18) Reference 19 (32) 13 (12) 34 (47) 21 (24) 2xRF 71 (74) 55 (49) 68 (70) 64 (50) 69 (64) 66 (51) 3xRF 88 (89) 66 (61) 78 (87) 74 (73) 82 (89) 68 (72) 4xRF 122 (124) 104 (106) 108 (110) 112 (107) 118 (115) 114 (105) 5xRF 134 (134) 123 (115) 120 (125) 119 (119) 125 (127) 123 (121) Upconversion Spurious Suppression Spurious data is taken by mixing an input within the IF band, with LO frequencies (+mLO+nIF), to create a spurious output within the RF output band. The mixer is swept across the full spurious output band and the mean is calculated. The numbers shown in the table below are for a -10 dBm IF input. Spurious suppression is scaled for different IF input power levels by (n-1), where “n” is the IF spur order. For example, the 2IFx1LO spur is typically 70 dBc for the A configuration for a -10 dBm input, so a -20 dBm IF input creates a spur that is (2-1) x (-10 dB) dB lower, or 80 dBc. Typical Upconversion Spurious Suppression (dBc): A Configuration (B Configuration) -10 dBm IF Input 0xLO 1xLO 2xLO 3xLO 4xLO 5xLO 1xIF 21 (25) Reference 18 (31) 12 (11) 34 (37) 24 (22) 2xIF 55 (44) 70 (66) 60 (47) 68 (65) 59 (50) 66 (64) 3xIF 72 (78) 72 (72) 71 (82) 63 (68) 71 (81) 60 (56) 4xIF 112 (110) 121 (110) 121 (95) 110 (105) 115 (90) 99 (98) 5xIF 129 (129) 119 (121) 123 (123) 119 (110) 126 (118) 110 (94)
Copyright © [2020] Marki Microwave, Inc. All Rights Reserved 10/19/18 GaAs DOUBLE-BALANCED MIXER MM1-0320H Page 7 LO/RF 3.5 to 20 GHz IF DC to 4 GHz Mounting and Bonding Recommendations Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible and the epoxy should have high thermal conductivity. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground. MMICs with high power dissipation, particularly those with high DC power requirements, also require a thermally conductive ground plane with a thermally conductive epoxy attachment. Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). Circuit Considerations – 50 ohm transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance. Handling Precautions General Handling: Chips should be handled with a vacuum collet when possible, or with sharp tweezers using well trained personnel. The surface of the chip is fragile and should not be contacted if possible. Static Sensitivity: GaAs MMIC devices are subject to static discharge, and should be handled, assembled, tested, and transported only in static protected environments. Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere. Bonding Diagram LO/RF LO/RF IF Minimum Space Gap/ Wirebond Length Multiple Wirebonds for Reduced Inductance
Copyright © [2020] Marki Microwave, Inc. All Rights Reserved 10/19/18 GaAs DOUBLE-BALANCED MIXER MM1-0320H Page 8 LO/RF 3.5 to 20 GHz IF DC to 4 GHz Port Description DC Interface Schematic Port 1 Port 1 is DC short to ground and AC matched to 50 Ohms from 3.5 to 20 GHz. Blocking capacitor is optional. Port 2 Port 2 is DC coupled to the diodes. Blocking capacitor is optional. Port 3 Port 3 is DC short to ground and AC matched to 50 Ohms from 3.5 to 20 GHz. Blocking capacitor is optional. Absolute Maximum Ratings Parameter Maximum Rating Port 1 DC Current 15 mA Port 3 DC Current 15 mA Port 2 DC Current 30 mA RF Power Handling (RF+LO) +25 dBm at +25°C, derated linearly to +21 dBm at +100°C Operating Temperature -55ºC to +100ºC Storage Temperature -65ºC to +125ºC DATA SHEET NOTES: 1. Mixer Conversion Loss Plot IF frequency is 100 MHz. 2. Mixer Noise Figure typically measures within 0.5 dB of conversion loss for IF frequencies greater than 5 MHz. 3. Conversion Loss typically degrades less than 0.5 dB at +100°C and improves less than 0.5 dB at -55°C. 4. Unless otherwise specified, data is taken with +15 dBm LO drive. 5. Specifications are subject to change without notice. Contact Marki Microwave for the most recent specifications and data sheets. 6. Catalog mixer circuits are continually improved. Configuration control requires custom mixer model numbers and specifications. Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Mi crowave makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any product. © Marki Microwave, Inc. www.markimicrowave.com