MK70110

MK70110 OKI | Alldatasheet

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Issue Date: Apr. 24, 2002 MK70110/MK70120 Preliminary Bluetooth Module GENERAL DESCRIPTION The MK70110 and MK70120 are Bluetooth modules that operate in the 2.4 GHz band. Mounted on the board of each of these modules are Bluetooth baseband & RF transceiver IC, RF filter, flash memory, and TCXO. Lower protocol stacks up to the HCI are already installed in these modules as software. These modules can be connected to user’s board product by using the connector the modules have. Since the modules are provided not only with the UART and USB interfaces as communication control inte rfaces but with a PCM interface as a voice control interface, they can cope with any application for data and voice communication. The MK70110 is equipped with an RF coaxial connector, and the MK70120 has a chip antenna built-in. By utilizing the MK70110/MK70120, the development TAT for products equipped with Bluetooth can be shortened very effectively.

FEATURES

• Conforms to the Bluetooth Specification Version 1.1
• Optimized design where originally developed LSI chips and authorized Oki software are used
• HCI full module includes Bluetooth baseband IC & RF transceiver IC, flash memory and TCXO
• RF output power: Class 2
• RF I/O: MK70110: RF coaxial connector / MK70120: Internal chip antenna
• Interfaces provided UART interface* (up to 921.6 kbps) USB interface* (USB1.1-conformed) PCM interface (selectable betw een PCM Linear/A-law/µ-law) * Supports HCI commands. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc. and licensed to Oki Electric Industry. The information contained herein can change without notice owing to the product being under development.

OKI Semiconductor MK70110/MK70120 BLOCK DIAGRAM RF_LSI ML7050LA ANT Chip MK70120 PCM_IN PCM_OUT PCM_CLK BPF Osc.

13 MHz

PCM_SYNC BB_LSI ML70Q511LA 4M b i t Flash ROM CPU ARM7TDMI Baseband Core Voltage Regulator VDD GND UART_RD UART_TD * UART_CTS * UART_RTS PCM I/F PCM I/F USB I/F USB_D+ USB_D– RESET ** XCLK (32 kHz ±200 ppm) VBUS TEST1 Note: * indicates that the pin will be supported later. * * X C L K i s o ptional ANT Connector MK70110 32 KB SRAM 20-Pin Connector ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Power supply voltage V DD Ta = 25°C –0.3 to 4.5 V Input voltage V IN Ta = 25°C –0.3 to 4.5 V Input RF power — Ta = 25°C 20 dBm Storage temperature T stg — –20 to +70 °C

OKI Semiconductor MK70110/MK70120 RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min. Typ. Max. Unit Power supply voltage V DD — 3.2 — 3.45 V “H” level input voltage V ih — 2.2 — 3.6 V “L” level input voltage V il — 0 — 0.8 V Operating temperature T OP — 0 25 50 °C

ELECTRICAL CHARACTERISTICS

Specifications in this section are fulfilled under the conditions that V DD = 3.3 V ±0.1 V, Ta = 0 to 50°C. Values of the RF characteristics represent those specified at the edge of the module for both the MK70110 and the MK70120. General Specifications Items Specification Note Conformance Specifications Bluetooth Specification Version 1.1 — Power Class Class 2 — Frequency range 2,402 to 2,480 MHz — Number of channels 79ch — Channel separation 1 MHz — Modulation method GFSK — RF input-output impedance Nominal 50 Ω 2,402 to 2,480 MHz Symbol Rate 1 Mbps —

OKI Semiconductor MK70110/MK70120 DC Characteristics Output voltage (Applies to digital pins except USB ports) Parameter Symbol Min. Typ. Max. Unit “H” level output voltage V oh 2.4 — — V “L” level output voltage V ol — — 0.4 V Output voltage (Applies to USB ports (USB_D+, USB_D–)) Parameter Symbol Min. Typ. Max. Unit “H” level output voltage V oh 2.8 — 3.6 V “L” level output voltage V ol — — 0.3 V Power consumption (UART interface, with 32 kHz XCLK) Mode Typ. Max. Unit Initialize (Stop mode) 10 — mA Idle (Cold standby) 6 — mA Hold mode (Slave) 40 — mA Sniff mode (Slave) 40 — mA ACL connection DH1 103 125 mA SCO connection HV1 113 135 mA RF Transmission Characteristics Parameter Min. Max. Unit Remarks Output power –6 +4 dBm Frequency deviation –50 +50 kHz Frequency drift DH1 DH3, DH5 –25 –40 +25 +40 kHz kHz Frequency shift ∆f1avg: payload = 11110000 ∆f2max: payload = 1010… ∆f2avg/∆f1avg 140 115 175 kHz kHz 20 dB band width — 1 MHz In-band spurious emission Freq. offset = ±2 MHz Freq. offset ≥ ±3 MHz –20 –40 dBm dBm Measured by peak detection Out-of-band spurious emission

30 MHz ≤ f < 1GHz

1 GHz ≤ f ≤ 12.75 GHz 1.8 GHz ≤ f ≤ 1.9 GHz 5.15 GHz ≤ f ≤ 5.30 GHz –36 –30 –47 –47 dBm dBm dBm dBm

OKI Semiconductor MK70110/MK70120 Reception Characteristics Parameter Min. Max. Unit Remarks Reception sensitivity — 0.1 % at –70 dBm input C/I characteristics Co-channel Adjacent channel C/I = 1 MHz Adjacent channel C/I = 2 MHz Adjacent channel C/I ≥ 3 MHz Image frequency Image frequency ±1 MHz *2 –30 –40*1 –16 dB dB dB dB dB dB Specification at ordinary temperature (Bluetooth Ver.1.1 Test Specification) Out-of-band blocking

30 MHz ≤ f < 2,000 MHz

2,000 MHz ≤ f ≤ 2,399 MHz 2,498 MHz ≤ f < 3,000 MHz 3,000 MHz ≤ f ≤ 12.75 GHz –10 –27 –27 –10 dBm dBm dBm dBm Specification at ordinary temperature Intermodulation characteristic –25 — dB Specification at ordinary temperature Maximum input level — 0.1 % Specification at ordinary temperature, at –20 dBm input Limit of collateral radio waves

30 MHz ≤ f < 1 GHz

1 GHz ≤ f ≤ 12.75 GHz –57 –47 dBm dBm Spurious emission during inquiry scan operation *1 Relaxed C/I specification On five spurious response frequencies with a distance of ≥ 2 MHz from the wanted signal (except for image frequency and image ±1 MHz), a relaxed interference requirement C/I = –17 dB is applied. (According to Bluetooth Specification 1.1, Part A Radio Specification) *2 Image Frequencies and adjacent interference to image Image frequency = Co-channel –4 MHz ±1 MHz adjacent interference to image frequency = Co-channel –3 MHz, Co-channel –5 MHz

OKI Semiconductor MK70110/MK70120 MECHANICAL CHARACTERISTICS Weight Specifications Model Name Weight MK70120 (antenna built-in type) 3.6 g (Max.) MK70110 (RF coaxial connector type) 3.5 g (Max.) RF I/O Pin Specifications The following chip antenna and RF coaxial connector are mounted: Model Name RF I/O Type Manufacturer / Model Name MK70120 Chip antenna MURATA MFG. / ANCM12G45 MK70110 RF coaxial connector HIROSE ELECTRIC / U.FL-R-SMT Connector Specifications The following board-to-board connector is mounted: Interface Type Manufacturer / Series Name Board-to-board connector Matsushita Electric Works / AXK6F20345 A header is mounted on the module side. It is therefore recommended that a 2.0 mm high socket (AXK5F20545) be used against the socket insertion side of the connector. Board-to-board Connector Detail

OKI Semiconductor MK70110/MK70120 CONNECTOR PIN DESCRIPTIONS Pin Symbol Type Description If Not Used 5, 6, 7 V DD — Power supply pin *1 — 15, 16 GND — Ground pin —

1 UART_RTS O UART Ready To Send (transmission data ready) *2 Pull_up or V DD

19 UART_CTS I UART Clear To Send (transmission ready) *2 Pull_down or GND

2 UART_TD O UART transmission data Pull_up or V DD

20 UART_RD I UART receive data Pull_up or V DD

12 USB_D+ I/O USB Data + Open

9 USB_D– I/O USB Data – Open

13 VBUS I

HCI transport selection pin H: USB is used as HCI L: UART is used as HCI adhering to the above logic at power-on

4 PCM_OUT O PCM data output Open

17 PCM_IN I PCM data input *5 Open

3 PCM_CLK O PCM clock output (64 kHz/128 kHz) *5 Open

18 PCM_SYNC O PCM synchronous signal input (8 kHz) *5 Open

8 RESET *6 I Reset signal input pin Reset = L

Effective reset pulse width > 10 µsec Pull_up

14 XCLK I Subclock input pin 32 kHz *3 GND

11 TEST1 I Test pin for our company's use *4 Open

10 N.C — N.C. Open *1 Mount an approximately 10 µF tantalum or electrolytic capacitor to the power supply input pin. The capacitor should be mounted as close to t he power supply pin of the module as possible. *2 At present, this pin is not supported. Must be left open. *3 At present, this pin does not support a 32 kHz sub-clock. Connect to GND. *4 Test pin for our company’s use. Must be left open. *5 The PCM_IN, CLK, and SYNC pi ns are pulled-down internally. *6 Setting the reset signal input pin RESET to a “L” level can reset the LSI. The reset state of the LSI is held for a duration of 10 msec even after the reset signal is switched to a “H” level.

OKI Semiconductor MK70110/MK70120 INTERFACE SPECIFICATIONS USB Interface

• Conforms to USB1.1
• Supports 12 Mbps Parameter Symbol Condition [1], [2], [3] Min. Typ. Max. Unit Rise time TR 4 — 20 Fall time TF CL = 50 pF 4 — 20 ns Output signal crossover voltage VCRS C L = 50 pF 1.3 — 2 V Driver output resistance ZDRV When being driven in a steady state 28 — 44 Ω Data rate TDRATE Average bit rate (12 Mbps ±0.25%) 11.97 — 12.03 Mbps [1] TR and TF are the intervals of the transition time fr om 10% to 90% (TR) or from 90% to 10% (TF) of an amplitude. [2] Input signal crossover point (W hen USB connector is not attached) VDD 0 V 0.8VDD 0.2VDD 0.8VDD 0.2VDD UART Interface Various settings can be made for the UART interface by using the Vendor specific command (refer to the ML70110/MK70120 User’s Manual). The default values are as follows:
• Baud rate: 115.2 kbps
• Parity: Non-parity
• Data length: 8 bits
• Stop bit: 1 bit
• Flow control: off PCM Interface
• Application format PCM linear (8, 16 bits/sample, 64 kHz sampling frequency)/A-law/ µ-law
• Bluetooth format CVSD/A-law/ µ-law

OKI Semiconductor MK70110/MK70120 PCMCLK (64kHz or 128kHz) PCMOUT PCMSYNC LSB MSB DATA DATA DATA LSB DATA 125 µs (8 kHz) MSB 8 bits or 16 bits Data is output at the timing of CLK rise. PCM Output Timing PCMCLK (64kHz or 128kHz) PCMIN PCMSYNC LSB MSB DATA DATA DATA LSB DATA 125 µs (8 kHz) MSB 8 bits or 16 bits Data is captured at the timing of CLK fall. PCM Input Timing

OKI Semiconductor MK70110/MK70120 PCM Timing Specifications Parameter Symbol Condition Min. Typ. Max. Unit PCMIN setup time to PCMCLK (input) fall t PC0 500 — — PCMIN hold time to PCMCLK (input) fall t PC1 500 — — PCMOUT setup time to PCMCLK (input) rise t PC2 500 — — PCMOUT hold time to PCMCLK (input) rise t PC3 500 — — PCMSYNC (input) setup time to PCMCLK (input) rise t PC4 500 — — PCMSYNC (input) hold time to PCMCLK (input) rise t PC5 500 — — Delay time from PCMCLK (input) rise to PCMSYNC (output) t PC6 — — 500 PCMIN setup time to PCMCLK (output) fall t PC7 500 — — PCMIN hold time to PCMCLK (output) fall t PC8 500 — — PCMOUT setup time to PCMCLK (output) rise t PC9 500 — — PCMOUT hold time to PCMCLK (output) rise t PC10 500 — — PCMSYNC (input) setup time to PCMCLK (output) rise t PC11 500 — — PCMSYNC (input) hold time to PCMCLK (output) rise t PC12 500 — — Delay time from PCMCLK (output) rise to PCMSYNC (output) t PC13 CL = 50 pF — — 500 ns PCMCLK (input) PCMIN PCMOUT tPC2 tPC3 tPC2 tPC3 tPC0 tPC1 PCMSYNC (input) PCMSYNC (output) tPC4 tPC5 tPC4 tPC5 tPC6 PCMCLK (output) PCMIN PCMOUT tPC9 tPC10 tPC9 tPC10 tPC7 tPC8 PCMSYNC (input) PCMSYNC (output) tPC11 tPC12 tPC11 tPC12 tPC13 PCM Timing

OKI Semiconductor MK70110/MK70120 MOUNTING MODULE Recommended Module Fixing Method When this module is fixed on a product, our recommended method is to fit the module board-to-board connector (header) into the board-to-board connector (socket) mounted on the product board, and to solder the module shielding case to the product board. Soldering Pattern Board-to-board connector (AXK5F20545) Pattern inhibiting zone 3.6 11.7 30.5 13.2 17.5 25.1 4.2 9.5 Pad dimension 3.0 4.0 Unit: [mm] The pattern inhibiting zone is applied to the MK70120 (antenna built-in type). 29.4 26.4 4.9 7.9 1.5 mm maximum (three soldering points) : Soldering points Unit: [mm] Soldering points in the shielding case for fixation on a product board

OKI Semiconductor MK70110/MK70120 Notes on Mounting the Module 1. This module is not adaptable to reflow mounting. When soldering the shielding case to a product board, use a soldering iron. 2. If metal is placed around the antenna, the antenna char acteristics may deteriorate. Do not place copper foil in the pattern inhibiting zone shown in the above section. Do not place metal around the antenna if possible. (Only for MK70120). 3. The shielding case is connected to GND in the module. For mounting the module, when pattern wiring that touches the shielding case is carried out on the product board, do not cause a short-circuit between the shielding case and the pattern. For example, apply resist on the entire surface that touches the shielding case. 4. The effects of noise on a product board depend on the connection of GND/NC to the fixation pads. Select the connection with better electrical characteristics in the module mounted state. CAUTIONS IN USE This module consists of precision electronic components. Therefore, note the following when handling the module: 1. In a case of decomposition or recomposition of this module, the operations in these specifications are not assured. 2. This module is not waterproof or drip-proof. Do not use the module in wet locations. 3. Do not use this module under high temperature or high humidity conditions , in direct sunlight, or in dusty places.

OKI Semiconductor MK70110/MK70120 MODULE OUTLINE Outline of MK70110 Board to Board Connector Assignment Case Board to Board Connector RF Coaxial Connector LabelLot No.

OKI Semiconductor MK70110/MK70120 Outline of MK70120 Board to Board Connector Assignment LabelLot No.Board to Board ConnectorCaseChip Antenna

OKI Semiconductor MK70110/MK70120

REVISION HISTORY

No. Date Previous Edition Current Edition

Description

PEDLMK70-01 Aug. 2001 – – Preliminary edition 1 Preliminary edition 2 PEDLMK70-02 Apr. 24, 2002 – – Owing to the device name change from MK70 Series to MK70110/MK70120, the contents have been changed throughout the document.

OKI Semiconductor MK70110/MK70120 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improp er installation, repair, alteration or accident, improp er handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third part y’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communicati on equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2002 Oki Electric Industry Co., Ltd.