MEQX-14ACH MARKIMICROWAVE | Alldatasheet
Document overview
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Technical content
Passive GaAs MMIC 14GHz Equalizer Family MEQX-14ACH Copyright © 2019 Marki Microwave, Inc. P a g e 1 | R e v . D Die
1 Device Overview
1.1 General Description
The MEQX-14ACH family of passive MMIC equalizer die are an ideal solution for compensating for low pass filtering effects in RF/microwave and high speed digital systems. They provide positive slope from DC to 14GHz with DC attenuation options between 3 and 10dB. The unique design offers superior return loss to competitors. GaAs MMIC technology provides consistent unit-to-unit performance in a small, low cost form factor.
1.2 Features
▪ DC attenuation options from 3 to 10dB ▪ Typical Insertion Loss 0.5dB at 14GHz ▪ VSWR < 1.3:1 Over Entire Band ▪ S2P data: MEQX-ACH.zip
1.3 Applications
▪ RF Transceivers ▪ High-Speed Data ▪ Telecom ▪ Cable Loss Compensation ▪ Amplifier Compensation
1.4 Functional Block Diagram
1.5 Part Ordering Options1
(dB) Description Package Green Status Product Lifecycle Export Classification MEQ3-14ACH 3 Wire bondable die CH RoHS Active EAR99 MEQ6-14ACH 6 MEQ10-14ACH 10 MEQ14CH-KIT Evaluation Kit contains 5x of each model: MEQ3-14ACH, MEQ6-14ACH, MEQ10-14ACH. Contact info@markimicrowave.com for pricing and availability. 1 Refer to our website for a list of definitions for terminology presented in this table. INPUT OUTPUT
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4.1 Mounting and Bonding
Revision History
Revision Code Revision Date Comment - November 2017 Datasheet Initial Release A August 2018 Evaluation Kit: MEQ14CH-KIT B March 2019 Updated ESD Rating C May 2019 Added Chip Dimension Tolerance Spec D August 2019 Added signal pad dimensions call- out, updated tolerance spec
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2 Port Configurations and Functions
2.1 Port Diagram
A top-down view of the MEQX-14A CH package outline drawing is shown below. The MEQ equalizers are symmetrical allowing Port 1 or Port 2 to be used as the input.
2.2 Port Functions
Port Function Description Equivalent Circuit Port 1 Input/Output Port 1 is DC connected to ground through a resistor. DC block is required if voltage present. Port 2 Input/Output Port 2 is DC connected to ground through a resistor. DC block is required if voltage present. Pad Ground CH package ground path is provided through the substrate and ground bond pads.
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3 Specifications
3.1 Absolute Maximum Ratings
The Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. If these limits are exceeded, the device may be inoperable or have a reduced lifetime. Parameter Maximum Rating Units Port 1 DC Current 40 mA Port 2 DC Current 40 mA Power Handling, at any Port +30 dBm Operating Temperature -55 to +100 °C Storage Temperature -65 to +125 ºC
3.2 Package Information
ESD Human Body Model (HBM), per MIL-STD-750, Method 1020 1A
3.3 Electrical Specifications2
The electrical specifications apply at TA=+25°C in a 50Ω system. Typical data shown is for the equalizer in a CH package with a sine wave input applied to port 1. Min and Max limits are guaranteed at TA=+25°C. All bare die are 100% DC tested and visually inspected. Part Number Typical Insertion Loss Typical Return Loss Units DC 14 GHz DC – 14 GHz MEQ3-14ACH 3 0.5 23 dB MEQ6-14ACH 6 0.5 22 dB MEQ10-14ACH 10 0.6 24 dB 2 Equalizer is symmetrical. Reverse measurement is equivalent to forward measurement.
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3.4 Typical Performance Plots
3.4.1 Insertion Loss
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3.4.2 Return Loss & Group Delay3
3 Group delay calculated using wrapped phase response.
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4 Die Mounting Recommendations
4.1 Mounting and Bonding Recommendations
Marki MMICs should be attached directly to a ground plane with conductive epoxy. The ground plane electrical impedance should be as low as practically possible. This will prevent resonances and permit the best possible electrical performance. Datasheet performance is only guaranteed in an environment with a low electrical impedance ground. Mounting - To epoxy the chip, apply a minimum amount of conductive epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip. Cure epoxy according to manufacturer instructions. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31 mm (12 mils). Circuit Considerations – 50 Ω transmission lines should be used for all high frequency connections in and out of the chip. Wirebonds should be kept as short as possible, with multiple wirebonds recommended for higher frequency connections to reduce parasitic inductance. In circumstances where the chip more than .001” thinner than the substrate, a heat spreading spacer tab is optional to further reduce bondwire length and parasitic inductance.
4.2 Bonding Diagram
www.markimicrowave.com MEQX-14ACH Marki Microwave reserves the right to make changes to the product(s) or information contained herein without notice. Marki Microwave makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Marki Microwave assume any liability whatsoever arising out of the use or application of any product. © Marki Microwave, Inc.
4.3 Handling Precautions
Chips should be handled with care using tweezers or a vacuum collet. Users should take precautions to protect chips from direct human contact that can deposit contaminants, like perspiration and skin oils on any of the chip's surfaces. Static Sensitivity GaAs MMIC devices are sensitive to ESD and should be handled, assembled, tested, and transported only in static protected environments. Cleaning and Storage: Do not attempt to clean the chip with a liquid cleaning system or expose the bare chips to liquid. Once the ESD sensitive bags the chips are stored in are opened, chips should be stored in a dry nitrogen atmosphere.
5 Mechanical Data
5.1 CH Package Outline Drawing
- CH Substrate material is 0.004 in thick GaAs. 2. I/O trace finish is 4.2 microns Au. Ground plane finish is 5 microns Au. 3. XXXX denotes circuit number 4. Tolerance for X, Y dimensions is ±0.002 in. Tolerance for Z dimension is ±0.0005 in. Tolerance for pad location is ±0.0001 in. Part Number Circuit Number MEQ3-14ACH 6336 MEQ6-14ACH 6337 MEQ10-14ACH 6338