MCMPBGA AMKOR | Alldatasheet

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Technical content

Features: Thermal Performance: Reliability: Innovative designs and expanding package offerings provide a platform from prototype-to-production.

  • Ball counts up to 1156
  • 13.0 mm to 40.0 mm body sizes
  • 1.00, 1.27 & 1.50 mm ball pitch available
  • Perimeter, stagger and full ball arrays
  • Special packaging for memory available
  • 2, 4, or 6 layer construction, ground / power
  • Full in-house design capability
  • JEDEC MS-034 standard outlines
  • MCM under high volume manufacturing in all sites
  • Enhanced electrical performance, shorter signal paths and reduced package parasitics
  • 2-8 active devices
  • 200-600 wire bonds
  • Passives can be added by utilizing the SMT equipment located in the SiP line Multi layer PCB, 0 air flow PCB Cu Theta JA Pkg Body Size Layer Thickness (°C/W) 272 27.0 x 27.0 4 36 µm1 9 388 35.0 x 35.0 4 36 µm1 6 Amkor assures you reliable performance by continuously monitoring key indices:
  • Moisture sensitivity JEDEC Level 3 characterization 30 °C/60% RH/192 hours
  • High temp op life 125 °C, 6V, 1000 hours
  • High temp storage 150 °C, 1000 hours
  • Autoclave or unbiased hast 130 °C/85% RH/96 hours
  • Temp cycle -55/+125 °C, 1000 cycles MCM-PBGA Packages: The MCM-PBGA (Multi-Chip Module Plastic Ball Grid Array) by Amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA package provide the platform to mix semiconductor technologies such as analog, digital, bipolar, CMOS, ASIC, memory, etc., in a single IC package. The affordability of our MCM-PBGAs enable systems designers to realize their vision of new, advanced or improved applications. Our designs are optimized to use standard PBGA package outline tooling to save you costs and utilize a proven BGA infrastructure. Additionally, we work with you to produce the most efficient substrate circuit design that will enhance the operation and performance of your IC chips. Our advanced in-house design center and electrical test support services complete the turn-key solution. Applications: Amkor’s MCM-PBGA is an excellent platform for reducing form factor and size while combining semiconductor technologies. MCM-PBGAs are perfect for any application where size, weight, electrical performance, board density and SMT yields are important considerations, such as ASICs, cable and DSL modems, wireless telecommunica- tions and electronic automotive components. LAMINATE VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION www.amkor.com DS 540G Rev Date: 05 ‘07

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and withou t notice. www.amkor.com Process Highlights Die Thickness (max) 13 mils Bond Pad Pitch (min) 2.4 mils Marking Laser Ball Inspection Optical Pack/Ship Options Dry Pack Wafer Backgrinding Available Standard Materials Die attach Ablestik 2300 Au wire 25 µm or 30 µm Mold compound Nitto GE 100L Solder Balls 63 Sn / 37 Pb Test Services Program Generation/Conversion Product Engineering Wafer sort

256 Pin x 20 mhz Test System available

-55 °C to + 125 °C Test available Tape and Reel Services Burn-in Shipping Low Profile Tray (JEDEC Outline CO-029) NOTE: All measurements in mm. P = Perimeter F = Full Array S = Stagger = Maximum possible ball count (may not be tooled). Additional depopulated options are available. Contact account manager for additional tooling. BODY BALL BALL BALL BALL PCB THICKNESS MOLD TOTAL PACKAGE SIZE COUNT PITCH MATRIX DIAM. 2 LYR 4 LYR CAP THICKNESS THK 2 LYR 4LYR PBGA Standard Package Offering (mm) MCM-PBGA Cross Section