MB9B300B

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Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 112

Technical content

Datasheet sections

• 6.1 Precautions for Product Design
• 6.2 Precautions for Package Mounting
• 6.3 Precautions for Use Environment
• 12.1 Absolute Maximum Ratings
• 12.2 Recommended Operating Conditions
• 12.3 DC Characteristics
• 12.3.1 Current Rating
• 12.3.2 Pin Characteristics
• 12.4 AC Characteristics
• 12.4.1 Main Clock Input Characteristics
• 12.4.2 Sub Clock Input Characteristics
• 12.4.3 Built-in CR Oscillation Characteristics
• 12.4.4 Operating Conditions of Main and USB PLL (In the case of using main clock for input of PLL)
• 12.4.5 Operating Conditions of Main PLL (In the case of using built-in high speed CR)
• 12.4.6 Reset Input Characteristics
• 12.4.7 Power-on Reset Timing
• 12.4.8 External Bus Timing
• 12.4.9 Base Timer Input Timing
• 12.4.10 CSIO/UART Timing
• 12.4.11 External Input Timing
• 12.4.12 Quadrature Position/Revolution Counter timing
• 12.4.13 I2C Timing
• 12.4.14 ETM Timing
• 12.4.15 JTAG Timing
• 12.6 USB Characteristics
• 12.7 Low-Voltage Detection Characteristics
• 12.7.1 Low-Voltage Detection Reset
• 12.7.2 Interrupt of Low-Voltage Detection
• 12.8 Flash Memory Write/Erase Characteristics
• 12.8.1 Write / Erase time
• 12.8.2 Erase/write cycles and data hold time
• 12.9 Return Time from Low-Power Consumption Mode
• 12.9.1 Return Factor: Interrupt
• 12.9.2 Return Factor: Reset

Features

32-bit Arm® Cortex®-M3 Core  Processor version: r2p0  Up to 80 MHz Frequency Operation  Memory Protection Unit (MPU): improve the reliability of an embedded system  Integrated Nested Vectored Interrupt Controller (NVIC): 1 NMI (non-maskable interrupt) and 48 peripheral interrupts and 16 priority levels  24-bit System timer (Sys Tick): System timer for OS task management On-chip Memories [Flash memory]  Up to 512 KB  Read cycle: 0 wait-cycle @ up to 60 MHz, 2 wait-cycle[1] above [1]: Instruction pre-fetch buffer is included. So when CPU access continuously, it becomes 0 wait-cycle  Security function for code protection [SRAM] This series contain a total of up to 64 KB on-chip SRAM. This is composed of two independent SRAM (SRAM0, SRAM1). SRAM0 is connected to I-code bus and D-code bus of Cortex- M3 core. SRAM1 is connected to System bus.  SRAM0: Up to 32 KB  SRAM1: Up to 32 KB USB Interface The USB interface is composed of Device and Host. PLL for USB is built-in, USB clock can be generated by multiplication of Main clock. [USB Device]  USB2.0 Full-Speed supported  Max 6 EndPoint supported  EndPoint 0 is control transfer  EndPoint 1 - 5 can be selected bulk-transfer or interrupt- transfer  Endpoint1-5 is comprised Double Buffers. [USB host]  USB2.0 Full/Low-speed supported  Bulk-transfer and interrupt-transfer and Isochronous-transfer support  USB Device connected/dis-connected automatically detect  IN/OUT token handshake packet automatically  Max 256-byte packet-length supported  Wake-up function supported Multi-function Serial Interface (Max. 8 channels)  4 channels with 16steps × 9bit FIFO (ch.4-ch.7), 4 channels without FIFO (ch.0-ch.3)  Operation mode is selectable from the followings for each channel.  UART  CSIO  LIN  I2C [UART]  Full-duplex double buffer  Selection with or without parity supported  Built-in dedicated baud rate generator  External clock available as a serial clock  Hardware Flow control: Automatically control the transmission by CTS/RTS (only ch.4)  Various error detect functions available (parity errors, framing errors, and overrun errors) [CSIO]  Full-duplex double buffer  Built-in dedicated baud rate generator  Overrun error detect function available

Document Number: 002-05612 Rev. *D Page 2 of 112 MB9B300B Series [LIN]  LIN protocol Rev.2.1 supported  Full duplex double buffer  Master/Slave mode supported  LIN break field generate (can be changed 13-16 bit length)  LIN break delimiter generate (can be changed 1- 4 bit length)  Various error detect functions available (parity errors, framing errors, and overrun errors) [I2C] Standard-mode (Max.100 kbps) / Fast-mode (Max 400 kbps) supported External Bus Interface  Supports SRAM, NOR& NAND Flash device  Up to 8 chip selects  8-/16-bit Data width  Up to 25-bit Address bit  Maximum area size: Up to 256 MB DMA Controller (8 channels) DMA Controller has an independent bus for CPU, so CPU and DMA Controller can process simultaneously.  8 independently configured and operated channels  Transfer can be started by software or request from the built- in peripherals  Transfer address area: 32 bit (4GB)  Transfer mode: Block transfer/Burst transfer/Demand transfer  Transfer data type: byte/half-word/word  Transfer block count: 1 to 16  Number of transfers: 1 to 65536 A/D Converter (Max. 16 channels) [12-bit A/D Converter]  Successive Approximation Register type  Built-in 3unit  Conversion time: 1.0 μs @ 5 V  Priority conversion available (priority at 2 levels)  Scanning conversion mode  Built-in FIFO for conversion data storage (for SCAN conversion: 16 steps, for Priority conversion: 4steps) Base Timer (Max. 8 channels) Operation mode is selectable from the followings for each channel.  16-bit PWM timer  16-bit PPG timer  16-/32-bit reload timer  16-/32-bit PWC timer Multi-function Timer (Max. 2 units) The Multi-function timer is composed of the following blocks.  16-bit free-run timer × 3ch/unit  Input capture × 4ch/unit  Output compare × 6ch/unit  A/D activation compare × 3ch/unit  Waveform generator × 3ch/unit  16-bit PPG timer × 3ch/unit The following function can be used to achieve the motor control.  PWM signal output function  DC chopper waveform output function  Dead time function  Input capture function  A/D convertor activate function  DTIF (Motor emergency stop) interrupt function Quadrature Position/Revolution Counter (QPRC) (Max. 2 units) The Quadrature Position/Revolution Counter (QPRC) is used to measure the position of the position encoder. Moreover, it is possible to use up/down counter.  The detection edge of the three external event input pins AIN, BIN and ZIN is configurable.  16-bit position counter  16-bit revolution counter  Two 16-bit compare registers Dual Timer (Two 32/16-bit Down Counter) The Dual Timer consists of two programmable 32/16-bit down counters. Operation mode is selectable from the followings for each channel.  Free-running  Periodic (=Reload)  One-shot

Document Number: 002-05612 Rev. *D Page 3 of 112 MB9B300B Series Watch Counter The Watch counter is used for wake up from sleep mode. Interval timer: up to 64 s (Max.) @ Sub Clock: 32.768 kHz Watch dog Timer (2 channels) A watchdog timer can generate interrupts or a reset when a time-out value is reached. This series consists of two different watchdogs, a "Hardware" watchdog and a "Software" watchdog. "Hardware" watchdog timer is clocked by the built-in low- speed CR oscillator. Therefore, “Hardware" watchdog is active in any low-power consumption modes except STOP mode. External Interrupt Controller Unit  Up to 16 external vectors  Include one non-maskable interrupt(NMI) General Purpose I/O Port This series can use its pins as general-purpose I/O ports when they are not used for external bus or peripherals. Moreover, the port relocate function is built in. It can set which I/O port the peripheral function can be allocated.  Capable of pull-up control per pin  Capable of reading pin level directly  Built-in the port relocate function  Up to 100 high-speed general-purpose I/O Ports @ 120pin Package CRC (Cyclic Redundancy Check) Accelerator The CRC accelerator helps a verify data transmission or storage integrity. CCITT CRC16 and IEEE-802.3 CRC32 are supported.  CCITT CRC16 Generator Polynomial: 0x1021  IEEE-802.3 CRC32 Generator Polynomial: 0x04C11DB7 Clock and Reset [Clocks] Five clock sources (2 ext. osc, 2 CR osc, and Main PLL) that are dynamically selectable.  Main Clock : 4 MHz to 48 MHz  Sub Clock : 32.768 kHz  Built-in high-speed CR Clock : 4 MHz  Built-in low-speed CR Clock : 100 kHz  Main PLL Clock [Resets]  Reset requests from INITX pins  Power-on reset  Software reset  Watchdog timers reset  Low-voltage detector reset  Clock supervisor reset Clock Super Visor (CSV) Clocks generated by CR oscillators are used to supervise abnormality of the external clocks.  External OSC clock failure (clock stop) is detected, reset is asserted.  External OSC frequency anomaly is detected, interrupt or reset is asserted. Low Voltage Detector (LVD) This series include 2-stage monitoring of voltage on the VCC. When the voltage falls below the voltage has been set, Low Voltage Detector generates an interrupt or reset.  LVD1: error reporting via interrupt  LVD2: auto-reset operation Low-Power Consumption Mode Three low-power consumption modes supported.  SLEEP  TIMER  STOP Debug  Serial Wire JTAG Debug Port (SWJ-DP)  Embedded Trace Macrocells (ETM) provide comprehensive debug and trace facilities. Power Supply Two Power Supplies  VCC = 2.7 V to 5.5 V: Correspond to the wide range voltage.  USBVCC = 3.0 V to 3.6 V: for USB I/O voltage, when USB is used. = 2.7 V to 5.5 V: when GPIO is used.[1]

Document Number: 002-05612 Rev. *D October 23, 2017 Page 5 of 112 MB9B300B Series

Document Number: 002-05612 Rev. *D October 23, 2017 Page 6 of 112 MB9B300B Series 1. Product Lineup Memory Size Product device MB9BF304NB/RB MB9BF305NB/RB MB9BF306NB/RB On-chip Flash memory 256 KB 384 KB 512 KB On-chip SRAM 32 KB 48 KB 64 KB Function Product device MB9BF304NB MB9BF305NB MB9BF306NB MB9BF304RB MB9BF305RB MB9BF306RB Pin count 100 120 CPU Cortex-M3 Freq. 80 MHz Power supply voltage range 2.7 V to 5.5 V USB2.0 (Device/Host) 1 ch DMAC 8 ch External Bus Interface Addr: 25-bit (Max.) Data:8-/16-bit CS: 5 (Max.) Support: SRAM, NOR Flash Addr: 25-bit (Max.) Data:8-/16-bit CS: 8 (Max.) Support: SRAM, NOR & NAND Flash Multi-function Serial Interface (UART/CSIO/LIN/I2C) 8 ch (Max.) Base Timer (PWC/ Reload timer/PWM/PPG) 8 ch (Max.) MF- Timer A/D activation compare 3 ch. 2 units (Max.) Input capture 4 ch. Free-run timer 3 ch. Output compare 6 ch. Waveform generator 3 ch. PPG 3 ch. QPRC 2 ch (Max.) Dual Timer 1 unit Watch Counter 1 unit CRC Accelerator Yes Watchdog timer 1ch(SW) + 1ch(HW) External Interrupts 16 pins (Max.) + NMI × 1 I/O ports 80 pins (Max.) 100 pins (Max.) 12 bit A/D converter 16 ch (3 units) CSV (Clock Super Visor) Yes LVD (Low Voltage Detector) 2 ch Built-in CR High-speed 4 MHz Low-speed 100 kHz Debug Function SWJ-DP/ETM Note: − All signals of the peripheral function in each product cannot be allocated by limiting the pins of package. It is necessary to use the port relocate function of the General I/O port according to your function use. built-in CR.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 7 of 112 MB9B300B Series 2. Packages Product name Package MB9BF304NB MB9BF305NB MB9BF306NB MB9BF304RB MB9BF305RB MB9BF306RB LQFP : LQI100 (0.5 mm pitch)  - LQFP: LQM120 (0.5 mm pitch) -  FBGA: LBC112 (0.8 mm pitch)  - : Supported Note: − Refer to “15. Package Dimensions” for detailed information on each package.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 8 of 112 MB9B300B Series 3. Pin Assignment LQI100 (TOP VIEW) Note: − The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. 100 1 75 2 74 3 73 4 72 5 71 6 70 7 69 8 68 9 67 10 66 11 65 12 64 13 63 14 62 15 61 16 60 17 59 18 58 19 57 20 56 21 55 22 54 23 53 24 52 25 51 LQ FP -100 VCC P50/INT00_0/AIN0_2/SIN3_1/RTO10_0/MDATA0 P51/INT01_0/BIN0_2/SOT3_1/RTO11_0/MDATA1 P52/INT02_0/ZIN0_2/SCK3_1/RTO12_0/MDATA2 P53/SIN6_0/TIOA1_2/INT07_2/RTO13_0/MDATA3 P54/SOT6_0/TIOB1_2/RTO14_0/MDATA4 P55/SCK6_0/ADTG_1/RTO15_0/MDATA5 P56/INT08_2/DTTI1X_0/MCSX7 P30/AIN0_0/TIOB0_1/INT03_2/MDATA6 P31/BIN0_0/TIOB1_1/SCK6_1/INT04_2/MDATA7 P32/ZIN0_0/TIOB2_1/SOT6_1/INT05_2/MDQM0 P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MDQM1 P34/FRCK0_0/TIOB4_1/MAD24 P35/IC03_0/TIOB5_1/INT08_1/MAD23 P36/IC02_0/SIN5_2/INT09_1/MCSX3 P37/IC01_0/SOT5_2/INT10_1/MCSX2 P38/IC00_0/SCK5_2/INT11_1 P39/DTTI0X_0/ADTG_2 P3A/RTO00_0/TIOA0_1 P3B/RTO01_0/TIOA1_1 P3C/RTO02_0/TIOA2_1 P3D/RTO03_0/TIOA3_1 P3E/RTO04_0/TIOA4_1 P3F/RTO05_0/TIOA5_1 VSS VCC P40/TIOA0_0/RTO10_1/INT12_1/MAD22 P41/TIOA1_0/RTO11_1/INT13_1/MAD21 P42/TIOA2_0/RTO12_1/MAD20 P43/TIOA3_0/RTO13_1/ADTG_7/MAD19 P44/TIOA4_0/RTO14_1/MAD18 P45/TIOA5_0/RTO15_1/MAD17 C VSS VCC P46/X0A P47/X1A INITX P48/DTTI1X_1/INT14_1/SIN3_2/MAD16 P49/TIOB0_0/IC10_1/AIN0_1/SOT3_2/MAD15 P4A/TIOB1_0/IC11_1/BIN0_1/SCK3_2/MAD14 P4B/TIOB2_0/IC12_1/ZIN0_1/MAD13 P4C/TIOB3_0/IC13_1/SCK7_1/AIN1_2/MAD12 P4D/TIOB4_0/FRCK1_1/SOT7_1/BIN1_2/MAD11 P4E/TIOB5_0/INT06_2/SIN7_1/ZIN1_2/MAD10 MD1 MD0 VSS VSS P20/INT05_0/CROUT/AIN1_1 P21/SIN0_0/INT06_1/BIN1_1 P22/SOT0_0/TIOB7_1/ZIN1_1 P23/SCK0_0/TIOA7_1/RTO00_1 P1F/AN15/ADTG_5/FRCK0_1/MDATA15 P1E/AN14/RTS4_1/DTTI0X_1/MDATA14 P1D/AN13/CTS4_1/IC03_1/MDATA13 P1C/AN12/SCK4_1/IC02_1/MDATA12 P1B/AN11/SOT4_1/IC01_1/MDATA11 P1A/AN10/SIN4_1/INT05_1/IC00_1/MDATA10 P19/AN09/SCK2_2/MDATA9 P18/AN08/SOT2_2/MDATA8 AVSS AVRH AVCC P17/AN07/SIN2_2/INT04_1/MWEX P16/AN06/SCK0_1/MOEX P15/AN05/SOT0_1/MCSX0 P14/AN04/SIN0_1/INT03_1/MCSX1 P13/AN03/SCK1_1/MAD08 P12/AN02/SOT1_1/MAD09 P11/AN01/SIN1_1/INT02_1 P10/AN00 VCC VSS P81/UDP0 P80/UDM0 USBVCC P60/SIN5_0/TIOA2_2/INT15_1 P61/SOT5_0/TIOB2_2/UHCONX P62/SCK5_0/ADTG_3/MAD00 P63/INT03_0/MAD01 P0F/NMIX/MAD02 P0E/CTS4_0/TIOB3_2/IC13_0/MAD03 P0D/RTS4_0/TIOA3_2/IC12_0/MAD04 P0C/SCK4_0/TIOA6_1/IC11_0/MAD05 P0B/SOT4_0/TIOB6_1/IC10_0/MAD06 P0A/SIN4_0/INT00_2/FRCK1_0/MAD07 P09/TRACECLK/TIOB0_2/RTS4_2 P08/TRACED3/TIOA0_2/CTS4_2 P07/TRACED2/ADTG_0/SCK4_2 P06/TRACED1/TIOB5_2/SOT4_2/INT01_1 P05/TRACED0/TIOA5_2/SIN4_2/INT00_1 P04/TDO/SWO P03/TMS/SWDIO P02/TDI P01/TCK/SWCLK P00/TRSTX VCC

Document Number: 002-05612 Rev. *D October 23, 2017 Page 9 of 112 MB9B300B Series LQM120 (TOP VIEW) Note: − The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 1 90 2 89 3 88 4 87 5 86 6 85 7 84 8 83 9 82 10 81 11 80 12 79 13 78 14 77 15 76 16 75 17 74 18 73 19 72 20 71 21 70 22 69 23 68 24 67 25 66 26 65 27 64 28 63 29 62 30 61 LQFP - 120 VCC P50/INT00_0/AIN0_2/SIN3_1/RTO10_0/MDATA0 P51/INT01_0/BIN0_2/SOT3_1/RTO11_0/MDATA1 P52/INT02_0/ZIN0_2/SCK3_1/RTO12_0/MDATA2 P53/SIN6_0/TIOA1_2/INT07_2/RTO13_0/MDATA3 P54/SOT6_0/TIOB1_2/RTO14_0/MDATA4 P55/SCK6_0/ADTG_1/RTO15_0/MDATA5 P56/SIN1_0/INT08_2/DTTI1X_0/MCSX7 P57/SOT1_0/MNALE P58/SCK1_0/MNCLE P59/SIN7_0/INT09_2/MNWEX P5A/SOT7_0/MNREX P5B/SCK7_0 P30/AIN0_0/TIOB0_1/INT03_2/MDATA6 P31/BIN0_0/TIOB1_1/SCK6_1/INT04_2/MDATA7 P32/ZIN0_0/TIOB2_1/SOT6_1/INT05_2/MDQM0 P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MDQM1 P34/FRCK0_0/TIOB4_1/MAD24 P35/IC03_0/TIOB5_1/INT08_1/MAD23 P36/IC02_0/SIN5_2/INT09_1/MCSX3 P37/IC01_0/SOT5_2/INT10_1/MCSX2 P38/IC00_0/SCK5_2/INT11_1 P39/DTTI0X_0/ADTG_2 P3A/RTO00_0/TIOA0_1 P3B/RTO01_0/TIOA1_1 P3C/RTO02_0/TIOA2_1 P3D/RTO03_0/TIOA3_1 P3E/RTO04_0/TIOA4_1 P3F/RTO05_0/TIOA5_1 VSS VCC P40/TIOA0_0/RTO10_1/INT12_1/MAD22 P41/TIOA1_0/RTO11_1/INT13_1/MAD21 P42/TIOA2_0/RTO12_1/MAD20 P43/TIOA3_0/RTO13_1/ADTG_7/MAD19 P44/TIOA4_0/RTO14_1/MAD18 P45/TIOA5_0/RTO15_1/MAD17 C VSS VCC P46/X0A P47/X1A INITX P48/DTTI1X_1/INT14_1/SIN3_2/MAD16 P49/TIOB0_0/IC10_1/AIN0_1/SOT3_2/MAD15 P4A/TIOB1_0/IC11_1/BIN0_1/SCK3_2/MAD14 P4B/TIOB2_0/IC12_1/ZIN0_1/MAD13 P4C/TIOB3_0/IC13_1/SCK7_1/AIN1_2/MAD12 P4D/TIOB4_0/FRCK1_1/SOT7_1/BIN1_2/MAD11 P4E/TIOB5_0/INT06_2/SIN7_1/ZIN1_2/MAD10 P70/TIOA4_2 P71/INT13_2/TIOB4_2 P72/SIN2_0/INT14_2 P73/SOT2_0/INT15_2 P74/SCK2_0 MD1 MD0 VSS VSS P20/INT05_0/CROUT/AIN1_1 P21/SIN0_0/INT06_1/BIN1_1 P22/SOT0_0/TIOB7_1/ZIN1_1 P23/SCK0_0/TIOA7_1/RTO00_1 P24/SIN2_1/INT01_2/RTO01_1 P25/SOT2_1/RTO02_1 P26/SCK2_1/RTO03_1/MCSX4 P27/INT02_2/RTO04_1/MCSX5 P28/ADTG_4/RTO05_1/MCSX6 P1F/AN15/ADTG_5/FRCK0_1/MDATA15 P1E/AN14/RTS4_1/DTTI0X_1/MDATA14 P1D/AN13/CTS4_1/IC03_1/MDATA13 P1C/AN12/SCK4_1/IC02_1/MDATA12 P1B/AN11/SOT4_1/IC01_1/MDATA11 P1A/AN10/SIN4_1/INT05_1/IC00_1/MDATA10 P19/AN09/SCK2_2/MDATA9 P18/AN08/SOT2_2/MDATA8 AVSS AVRH AVCC P17/AN07/SIN2_2/INT04_1/MWEX P16/AN06/SCK0_1/MOEX P15/AN05/SOT0_1/MCSX0 P14/AN04/SIN0_1/INT03_1/MCSX1 P13/AN03/SCK1_1/MAD08 P12/AN02/SOT1_1/MAD09 P11/AN01/SIN1_1/INT02_1 P10/AN00 VCC VSS P81/UDP0 P80/UDM0 USBVCC P60/SIN5_0/TIOA2_2/INT15_1 P61/SOT5_0/TIOB2_2/UHCONX P62/SCK5_0/ADTG_3/MAD00 P63/INT03_0/SIN5_1/MAD01 P64/TIOA7_0/SOT5_1/INT10_2 P65/TIOB7_0/SCK5_1 P66/SIN3_0/ADTG_8/INT11_2 P67/SOT3_0/TIOA7_2 P68/SCK3_0/TIOB7_2/INT12_2 P0F/NMIX/MAD02 P0E/CTS4_0/TIOB3_2/IC13_0/MAD03 P0D/RTS4_0/TIOA3_2/IC12_0/MAD04 P0C/SCK4_0/TIOA6_1/IC11_0/MAD05 P0B/SOT4_0/TIOB6_1/IC10_0/MAD06 P0A/SIN4_0/INT00_2/FRCK1_0/MAD07 P09/TRACECLK/TIOB0_2/RTS4_2 P08/TRACED3/TIOA0_2/CTS4_2 P07/TRACED2/ADTG_0/SCK4_2 P06/TRACED1/TIOB5_2/SOT4_2/INT01_1 P05/TRACED0/TIOA5_2/SIN4_2/INT00_1 P04/TDO/SWO P03/TMS/SWDIO P02/TDI P01/TCK/SWCLK P00/TRSTX VCC

Document Number: 002-05612 Rev. *D October 23, 2017 Page 10 of 112 MB9B300B Series LBC112 Note: − The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 11 of 112 MB9B300B Series 4. List of Pin Functions List of pin numbers The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

1 B1 1 VCC -

2 C1 2

INT00_0 AIN0_2 SIN3_1 RTO10_0 (PPG10_0) MDATA0

3 C2 3

INT01_0 BIN0_2 SOT3_1 (SDA3_1) RTO11_0 (PPG10_0) MDATA1

4 B3 4

INT02_0 ZIN0_2 SCK3_1 (SCL3_1) RTO12_0 (PPG12_0) MDATA2

5 D1 5

SIN6_0 TIOA1_2 INT07_2 RTO13_0 (PPG12_0) MDATA3

6 D2 6

SOT6_0 (SDA6_0) TIOB1_2 RTO14_0 (PPG14_0) MDATA4

Document Number: 002-05612 Rev. *D October 23, 2017 Page 12 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

7 D3 7

SCK6_0 (SCL6_0) ADTG_1 RTO15_0 (PPG14_0) MDATA5

8 D5 8

SIN1_0 (120pin only) INT08_2 DTTI1X_0 MCSX7 - - 9 P57 E I SOT1_0 (SDA1_0) MNALE - - 10 P58 E I SCK1_0 (SCL1_0) MNCLE - - 11 P59 E H SIN7_0 INT09_2 MNWEX - - 12 P5A E I SOT7_0 (SDA7_0) MNREX - - 13 P5B E I SCK7_0 (SCL7_0)

9 E1 14

AIN0_0 TIOB0_1 INT03_2 MDATA6

Document Number: 002-05612 Rev. *D October 23, 2017 Page 13 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

10 E2 15

BIN0_0 TIOB1_1 SCK6_1 (SCL6_1) INT04_2 MDATA7

11 E3 16

ZIN0_0 TIOB2_1 SOT6_1 (SDA6_1) INT05_2 MDQM0

12 E4 17

INT04_0 TIOB3_1 SIN6_1 ADTG_6 MDQM1

13 F1 18

FRCK0_0 TIOB4_1 MAD24

14 F2 19

IC03_0 TIOB5_1 INT08_1 MAD23

15 F3 20

IC02_0 SIN5_2 INT09_1 MCSX3

16 G1 21

IC01_0 SOT5_2 (SDA5_2) INT10_1 MCSX2

17 G2 22

IC00_0 SCK5_2 (SCL5_2) INT11_1

Document Number: 002-05612 Rev. *D October 23, 2017 Page 14 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

18 F4 23

E I DTTI0X_0 ADTG_2

19 G3 24

G I RTO00_0 (PPG00_0) TIOA0_1 - B2 - VSS -

20 H1 25

G I RTO01_0 (PPG00_0) TIOA1_1

21 H2 26

G I RTO02_0 (PPG02_0) TIOA2_1

22 G4 27

G I RTO03_0 (PPG02_0) TIOA3_1

23 H3 28

G I RTO04_0 (PPG04_0) TIOA4_1

24 J2 29

G I RTO05_0 (PPG04_0) TIOA5_1

25 L1 30 VSS -

26 J1 31 VCC -

27 J4 32

TIOA0_0 RTO10_1 (PPG10_1) INT12_1 MAD22

28 L5 33

TIOA1_0 RTO11_1 (PPG10_1) INT13_1 MAD21

Document Number: 002-05612 Rev. *D October 23, 2017 Page 15 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

29 K5 34

TIOA2_0 RTO12_1 (PPG12_1) MAD20

30 J5 35

TIOA3_0 RTO13_1 (PPG12_1) ADTG_7 MAD19 - K2 - VSS - - J3 - VSS - - H4 - VSS -

31 H5 36

TIOA4_0 RTO14_1 (PPG14_1) MAD18

32 L6 37

TIOA5_0 RTO15_1 (PPG14_1) MAD17

33 L2 38 C -

34 L4 39 VSS -

35 K1 40 VCC -

36 L3 41 P46 D M X0A

37 K3 42 P47 D N X1A

38 K4 43 INITX B C

39 K6 44

DTTI1X_1 INT14_1 SIN3_2 MAD16

40 J6 45

TIOB0_0 IC10_1 AIN0_1 SOT3_2 (SDA3_2) MAD15

Document Number: 002-05612 Rev. *D October 23, 2017 Page 16 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

41 L7 46

TIOB1_0 IC11_1 BIN0_1 SCK3_2 (SCL3_2) MAD14

42 K7 47

TIOB2_0 IC12_1 ZIN0_1 MAD13

43 H6 48

TIOB3_0 IC13_1 SCK7_1 (SCL7_1) AIN1_2 MAD12

44 J7 49

TIOB4_0 FRCK1_1 SOT7_1 (SDA7_1) BIN1_2 MAD11

45 K8 50

TIOB5_0 INT06_2 SIN7_1 ZIN1_2 MAD10 - - 51 P70 E I TIOA4_2 - - 52 P71 E H INT13_2 TIOB4_2 - - 53 P72 E H SIN2_0 INT14_2

Document Number: 002-05612 Rev. *D October 23, 2017 Page 17 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 - - 54 P73 E H SOT2_0 (SDA2_0) INT15_2 - - 55 P74 E I SCK2_0 (SCL2_0)

46 K9 56 MD1 C D

47 L8 57 MD0 C D

48 L9 58 X0 A A

49 L10 59 X1 A B

50 L11 60 VSS -

51 K11 61 VCC -

52 J11 62

53 J10 63

SIN1_1 INT02_1 - K10 - VSS - - J9 - VSS -

54 J8 64

SOT1_1 (SDA1_1) MAD09

55 H10 65

SCK1_1 (SCL1_1) MAD08

56 H9 66

SIN0_1 INT03_1 MCSX1

57 H7 67

SOT0_1 (SDA0_1) MCSX0

Document Number: 002-05612 Rev. *D October 23, 2017 Page 18 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

58 G10 68

SCK0_1 (SCL0_1) MOEX

59 G9 69

SIN2_2 INT04_1 MWEX

60 H11 70 AVCC -

61 F11 71 AVRH -

62 G11 72 AVSS -

63 G8 73

SOT2_2 (SDA2_2) MDATA8

64 F10 74

SCK2_2 (SCL2_2) MDATA9

65 F9 75

SIN4_1 INT05_1 IC00_1 MDATA10 - H8 - VSS -

66 E11 76

SOT4_1 (SDA4_1) IC01_1 MDATA11

67 E10 77

SCK4_1 (SCL4_1) IC02_1 MDATA12

Document Number: 002-05612 Rev. *D October 23, 2017 Page 19 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

68 F8 78

CTS4_1 IC03_1 MDATA13

69 E9 79

RTS4_1 DTTI0X_1 MDATA14

70 D11 80

ADTG_5 FRCK0_1 MDATA15 - - 81 P28 E I ADTG_4 RTO05_1 (PPG04_1) MCSX6 - - 82 P27 E H INT02_2 RTO04_1 (PPG04_1) MCSX5 - - 83 P26 E I SCK2_1 (SCL2_1) RTO03_1 (PPG02_1) MCSX4 - - 84 P25 E I SOT2_1 (SDA2_1) RTO02_1 (PPG02_1) - B10 - VSS - - C9 - VSS - - - 85 P24 E H SIN2_1 INT01_2 RTO01_1 (PPG00_1)

Document Number: 002-05612 Rev. *D October 23, 2017 Page 20 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

71 D10 86

SCK0_0 (SCL0_0) TIOA7_1 RTO00_1 (PPG00_1)

72 E8 87

SOT0_0 (SDA0_0) TIOB7_1 ZIN1_1

73 C11 88

SIN0_0 INT06_1 BIN1_1

74 C10 89

INT05_0 CROUT AIN1_1

75 A11 90 VSS -

76 A10 91 VCC -

77 A9 92 P00 E E TRSTX

78 B9 93

79 B11 94 P02 E E TDI

80 A8 95

81 B8 96

82 C8 97

TIOA5_2 SIN4_2 INT00_1 - D8 - VSS -

Document Number: 002-05612 Rev. *D October 23, 2017 Page 21 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

83 D9 98

TIOB5_2 SOT4_2 (SDA4_2) INT01_1

84 A7 99

ADTG_0 SCK4_2 (SCL4_2)

85 B7 100

TIOA0_2 CTS4_2

86 C7 101

TIOB0_2 RTS4_2

87 D7 102

SIN4_0 INT00_2 FRCK1_0 MAD07

88 A6 103

SOT4_0 (SDA4_0) TIOB6_1 IC10_0 MAD06

89 B6 104

SCK4_0 (SCL4_0) TIOA6_1 IC11_0 MAD05

90 C6 105

RTS4_0 TIOA3_2 IC12_0 MAD04

Document Number: 002-05612 Rev. *D October 23, 2017 Page 22 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state typet LQFP-100 BGA-112 LQFP-120

91 A5 106

CTS4_0 TIOB3_2 IC13_0 MAD03 - D4 - VSS - - C3 - VSS -

92 B5 107

• - 108 P68 E H SCK3_0 (SCL3_0) TIOB7_2 INT12_2 - - 109 P67 E I SOT3_0 (SDA3_0) TIOA7_2 - - 110 P66 E H SIN3_0 ADTG_8 INT11_2 - - 111 P65 E I TIOB7_0 SCK5_1 (SCL5_1) - - 112 P64 E H TIOA7_0 SOT5_1 (SDA5_1) INT10_2

93 D6 113

E H INT03_0 MAD01 - - SIN5_1

94 C5 114

SCK5_0 (SCL5_0) ADTG_3 MAD00

95 B4 115

SOT5_0 (SDA5_0) TIOB2_2 UHCONX

Document Number: 002-05612 Rev. *D October 23, 2017 Page 23 of 112 MB9B300B Series Pin no. Pin name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120

96 C4 116

E H SIN5_0 TIOA2_2 INT15_1

97 A4 117 USBVCC -

98 A3 118 P80 H O UDM0

99 A2 119 P81 H O UDP0

100 A1 120 VSS -

Document Number: 002-05612 Rev. *D October 23, 2017 Page 24 of 112 MB9B300B Series List of pin functions The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 ADC ADTG_0 A/D converter external trigger input pin. ADTG_1 7 D3 7 ADTG_2 18 F4 23 ADTG_3 94 C5 114 ADTG_4 - - 81 ADTG_5 70 D11 80 ADTG_6 12 E4 17 ADTG_7 30 J5 35 ADTG_8 - - 110 AN00 A/D converter analog input pin. ANxx describes ADC ch.xx. TIOA0_0 Base timer ch.0 TIOA pin. TIOA0_1 19 G3 24 TIOA0_2 85 B7 100 TIOB0_0 Base timer ch.0 TIOB pin. TIOB0_1 9 E1 14 TIOB0_2 86 C7 101 Base Timer TIOA1_0 Base timer ch.1 TIOA pin. TIOA1_1 20 H1 25 TIOA1_2 5 D1 5 TIOB1_0 Base timer ch.1 TIOB pin. TIOB1_1 10 E2 15 TIOB1_2 6 D2 6 Base Timer TIOA2_0 Base timer ch.2 TIOA pin. TIOA2_1 21 H2 26 TIOA2_2 96 C4 116 TIOB2_0 Base timer ch.2 TIOB pin. TIOB2_1 11 E3 16 TIOB2_2 95 B4 115

Document Number: 002-05612 Rev. *D October 23, 2017 Page 25 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 Base Timer TIOA3_0 Base timer ch.3 TIOA pin. TIOA3_1 22 G4 27 TIOA3_2 90 C6 105 TIOB3_0 Base timer ch.3 TIOB pin. TIOB3_1 12 E4 17 TIOB3_2 91 A5 106 Base Timer TIOA4_0 Base timer ch.4 TIOA pin. TIOA4_1 23 H3 28 TIOA4_2 - - 51 TIOB4_0 Base timer ch.4 TIOB pin. TIOB4_1 13 F1 18 TIOB4_2 - - 52 Base Timer TIOA5_0 Base timer ch.5 TIOA pin. TIOA5_1 24 J2 29 TIOA5_2 82 C8 97 TIOB5_0 Base timer ch.5 TIOB pin. TIOB5_1 14 F2 19 TIOB5_2 83 D9 98 Base Timer TIOA6_1 Base timer ch.6 TIOA pin. 89 B6 104 TIOB6_1 Base timer ch.6 TIOB pin. 88 A6 103 Base Timer TIOA7_0 Base timer ch.7 TIOA pin. - - 112 TIOA7_1 71 D10 86 TIOA7_2 - - 109 TIOB7_0 Base timer ch.7 TIOB pin. - - 111 TIOB7_1 72 E8 87 TIOB7_2 - - 108 Debugger SWCLK Serial wire debug interface clock input. 78 B9 93 SWDIO Serial wire debug interface data input / output. 80 A8 95 SWO Serial wire viewer output. 81 B8 96 TCK JTAG test clock input. 78 B9 93 TDI JTAG test data input. 79 B11 94 TDO JTAG debug data output. 81 B8 96 TMS JTAG test mode state input/output. 80 A8 95 TRACECLK Trace CLK output of ETM. 86 C7 101 TRACED0 Trace data output of ETM. TRSTX JTAG test reset Input. 77 A9 92

Document Number: 002-05612 Rev. *D October 23, 2017 Page 26 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 External Bus MAD00 External bus interface address bus. External bus interface chip select output pin. External bus interface data bus. MDQM0 External bus interface byte mask signal output. 11 E3 16 MDQM1 12 E4 17

Document Number: 002-05612 Rev. *D October 23, 2017 Page 27 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 External Bus MNALE External bus interface ALE signal to control NAND Flash output pin. - - 9 MNCLE External bus interface CLE signal to control NAND Flash output pin. - - 10 MNREX External bus interface read enable signal to control NAND Flash. - - 12 MNWEX External bus interface write enable signal to control NAND Flash. - - 11 MOEX External bus interface read enable signal for SRAM. 58 G10 68 MWEX External bus interface write enable signal for SRAM. 59 G9 69

Document Number: 002-05612 Rev. *D October 23, 2017 Page 28 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 External Interrupt INT00_0 External interrupt request 00 input pin. INT00_1 82 C8 97 INT00_2 87 D7 102 INT01_0 External interrupt request 01 input pin. INT01_1 83 D9 98 INT01_2 - - 85 INT02_0 External interrupt request 02 input pin. INT02_1 53 J10 63 INT02_2 - - 82 INT03_0 External interrupt request 03 input pin. INT03_1 56 H9 66 INT03_2 9 E1 14 INT04_0 External interrupt request 04 input pin. INT04_1 59 G9 69 INT04_2 10 E2 15 INT05_0 External interrupt request 05 input pin. INT05_1 65 F9 75 INT05_2 11 E3 16 INT06_1 External interrupt request 06 input pin. 73 C11 88 INT06_2 45 K8 50 INT07_2 External interrupt request 07 input pin. 5 D1 5 INT08_1 External interrupt request 08 input pin. 14 F2 19 INT08_2 8 D5 8 INT09_1 External interrupt request 09 input pin. 15 F3 20 INT09_2 - - 11 INT10_1 External interrupt request 10 input pin. 16 G1 21 INT10_2 - - 112 INT11_1 External interrupt request 11 input pin. 17 G2 22 INT11_2 - - 110 INT12_1 External interrupt request 12 input pin. 27 J4 32 INT12_2 - - 108 INT13_1 External interrupt request 13 input pin. 28 L5 33 INT13_2 - - 52 INT14_1 External interrupt request 14 input pin. 39 K6 44 INT14_2 - - 53 INT15_1 External interrupt request 15 input pin. 96 C4 116 INT15_2 - - 54 NMIX Non-Maskable Interrupt input. 92 B5 107

Document Number: 002-05612 Rev. *D October 23, 2017 Page 29 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 GPIO P00 General-purpose I/O port 0.

77 A9 92

General-purpose I/O port 1. General-purpose I/O port 2.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 30 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 GPIO P30 General-purpose I/O port 3. General-purpose I/O port 4. General-purpose I/O port 5.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 31 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 GPIO P60 General-purpose I/O port 6. General-purpose I/O port 7. - - 51 P71 - - 52 P72 - - 53 P73 - - 54 P74 - - 55 P80 General-purpose I/O port 8. 98 A3 118 P81 99 A2 119 Multi Function Serial SIN0_0 Multifunction serial interface ch.0 input pin. 73 C11 88 SIN0_1 56 H9 66 SOT0_0 (SDA0_0) Multifunction serial interface ch.0 output pin. This pin operates as SOT0 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA0 when it is used in an I2C (operation mode 4). SOT0_1 (SDA0_1) 57 H7 67 SCK0_0 (SCL0_0) Multifunction serial interface ch.0 clock I/O pin. This pin operates as SCK0 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL0 when it is used in an I2C (operation mode 4). SCK0_1 (SCL0_1) 58 G10 68 Multi Function Serial SIN1_0 Multifunction serial interface ch.1 input pin. - - 8 SIN1_1 53 J10 63 SOT1_0 (SDA1_0) Multifunction serial interface ch.1 output pin. This pin operates as SOT1 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA1 when it is used in an I2C (operation mode 4). - - 9 SOT1_1 (SDA1_1) 54 J8 64 SCK1_0 (SCL1_0) Multifunction serial interface ch.1 clock I/O pin. This pin operates as SCK1 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL1 when it is used in an I2C (operation mode 4). - - 10 SCK1_1 (SCL1_1) 55 H10 65 Multi Function Serial SIN2_0 Multifunction serial interface ch.2 input pin. - - 53 SIN2_1 - - 85 SIN2_2 59 G9 69 SOT2_0 (SDA2_0) Multifunction serial interface ch.2 output pin. This pin operates as SOT2 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA2 when it is used in an I2C (operation mode 4). - - 54 SOT2_1 (SDA2_1) - - 84 SOT2_2 (SDA2_2) 63 G8 73 SCK2_0 (SCL2_0) Multifunction serial interface ch.2 clock I/O pin. This pin operates as SCK2 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL2 when it is used in an I2C (operation mode 4). - - 55 SCK2_1 (SCL2_1) - - 83 SCK2_2 (SCL2_2) 64 F10 74

Document Number: 002-05612 Rev. *D October 23, 2017 Page 32 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 Multi Function Serial SIN3_0 Multifunction serial interface ch.3 input pin. - - 110 SIN3_1 2 C1 2 SIN3_2 39 K6 44 SOT3_0 (SDA3_0) Multifunction serial interface ch.3 output pin. This pin operates as SOT3 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA3 when it is used in an I2C (operation mode 4). - - 109 SOT3_1 (SDA3_1) 3 C2 3 SOT3_2 (SDA3_2) 40 J6 45 SCK3_0 (SCL3_0) Multifunction serial interface ch.3 clock I/O pin. This pin operates as SCK3 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL3 when it is used in an I2C (operation mode 4). - - 108 SCK3_1 (SCL3_1) 4 B3 4 SCK3_2 (SCL3_2) 41 L7 46 Multi Function Serial SIN4_0 Multifunction serial interface ch.4 input pin. SIN4_1 65 F9 75 SIN4_2 82 C8 97 SOT4_0 (SDA4_0) Multifunction serial interface ch.4 output pin. This pin operates as SOT4 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA4 when it is used in an I2C (operation mode 4). SOT4_1 (SDA4_1) 66 E11 76 SOT4_2 (SDA4_2) 83 D9 98 SCK4_0 (SCL4_0) Multifunction serial interface ch.4 clock I/O pin. This pin operates as SCK4 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL4 when it is used in an I2C (operation mode 4). SCK4_1 (SCL4_1) 67 E10 77 SCK4_2 (SCL4_2) 84 A7 99 RTS4_0 Multifunction serial interface ch.4 RTS output pin. RTS4_1 69 E9 79 RTS4_2 86 C7 101 CTS4_0 Multifunction serial interface ch.4 CTS input pin. CTS4_1 68 F8 78 CTS4_2 85 B7 100 Multi Function Serial SIN5_0 Multifunction serial interface ch.5 input pin. SIN5_1 - - 113 SIN5_2 15 F3 20 SOT5_0 (SDA5_0) Multifunction serial interface ch.5 output pin. This pin operates as SOT5 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA5 when it is used in an I2C (operation mode 4). SOT5_1 (SDA5_1) - - 112 SOT5_2 (SDA5_2) 16 G1 21 SCK5_0 (SCL5_0) Multifunction serial interface ch.5 clock I/O pin. This pin operates as SCK5 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL5 when it is used in an I2C (operation mode 4). SCK5_1 (SCL5_1) - - 111 SCK5_2 (SCL5_2) 17 G2 22

Document Number: 002-05612 Rev. *D October 23, 2017 Page 33 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 Multi Function Serial SIN6_0 Multifunction serial interface ch.6 input pin. 5 D1 5 SIN6_1 12 E4 17 SOT6_0 (SDA6_0) Multifunction serial interface ch.6 output pin. This pin operates as SOT6 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA6 when it is used in an I2C (operation mode 4). SOT6_1 (SDA6_1) 11 E3 16 SCK6_0 (SCL6_0) Multifunction serial interface ch.6 clock I/O pin. This pin operates as SCK6 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL6 when it is used in an I2C (operation mode 4). SCK6_1 (SCL6_1) 10 E2 15 Multi Function Serial SIN7_0 Multifunction serial interface ch.7 input pin. - - 11 SIN7_1 45 K8 50 SOT7_0 (SDA7_0) Multifunction serial interface ch.7 output pin. This pin operates as SOT7 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA7 when it is used in an I2C (operation mode 4). - - 12 SOT7_1 (SDA7_1) 44 J7 49 SCK7_0 (SCL7_0) Multifunction serial interface ch.7 clock I/O pin. This pin operates as SCK7 when it is used in a UART/CSIO (operation modes 0 to 2) and as SCL7 when it is used in an I2C (operation mode 4). - - 13 SCK7_1 (SCL7_1) 43 H6 48

Document Number: 002-05612 Rev. *D October 23, 2017 Page 34 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 Multi Function Timer DTTI0X_0 Input signal controlling wave form generator outputs RTO00 to RTO05 of multi-function timer 0. DTTI0X_1 69 E9 79 FRCK0_0 16-bit free-run timer ch.0 external clock input pin. 13 F1 18 FRCK0_1 70 D11 80 IC00_0 16-bit input capture ch.0 input pin of multi-function timer 0. ICxx describes channel number. IC00_1 65 F9 75 IC01_0 16 G1 21 IC01_1 66 E11 76 IC02_0 15 F3 20 IC02_1 67 E10 77 IC03_0 14 F2 19 IC03_1 68 F8 78 RTO00_0 (PPG00_0) Wave form generator output of multi-function timer 0. This pin operates as PPG00 when it is used in PPG 0 output modes. RTO00_1 (PPG00_1) 71 D10 86 RTO01_0 (PPG00_0) Wave form generator output of multi-function timer 0. This pin operates as PPG00 when it is used in PPG 0 output modes. RTO01_1 (PPG00_1) - - 85 RTO02_0 (PPG02_0) Wave form generator output of multi-function timer 0. This pin operates as PPG02 when it is used in PPG 0 output modes. RTO02_1 (PPG02_1) - - 84 RTO03_0 (PPG02_0) Wave form generator output of multi-function timer 0. This pin operates as PPG02 when it is used in PPG 0 output modes. RTO03_1 (PPG02_1) - - 83 RTO04_0 (PPG04_0) Wave form generator output of multi-function timer 0. This pin operates as PPG04 when it is used in PPG 0 output modes. RTO04_1 (PPG04_1) - - 82 RTO05_0 (PPG04_0) Wave form generator output of multi-function timer 0. This pin operates as PPG04 when it is used in PPG 0 output modes. RTO05_1 (PPG04_1) - - 81

Document Number: 002-05612 Rev. *D October 23, 2017 Page 35 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 Multi Function Timer DTTI1X_0 Input signal controlling wave form generator outputs RTO10 to RTO15 of multi-function timer 1. DTTI1X_1 39 K6 44 FRCK1_0 16-bit free-run timer ch.1 external clock input pin. 87 D7 102 FRCK1_1 44 J7 49 IC10_0 16-bit input capture ch.0 input pin of multi-function timer 1. ICxx describes channel number. IC10_1 40 J6 45 IC11_0 89 B6 104 IC11_1 41 L7 46 IC12_0 90 C6 105 IC12_1 42 K7 47 IC13_0 91 A5 106 IC13_1 43 H6 48 RTO10_0 (PPG10_0) Wave form generator output of multi-function timer 1. This pin operates as PPG10 when it is used in PPG 1 output modes. RTO10_1 (PPG10_1) 27 J4 32 RTO11_0 (PPG10_0) Wave form generator output of multi-function timer 1. This pin operates as PPG10 when it is used in PPG 1 output modes. RTO11_1 (PPG10_1) 28 L5 33 RTO12_0 (PPG12_0) Wave form generator output of multi-function timer 1. This pin operates as PPG12 when it is used in PPG 1 output modes. RTO12_1 (PPG12_1) 29 K5 34 RTO13_0 (PPG12_0) Wave form generator output of multi-function timer 1. This pin operates as PPG12 when it is used in PPG 1 output modes. RTO13_1 (PPG12_1) 30 J5 35 RTO14_0 (PPG14_0) Wave form generator output of multi-function timer 1. This pin operates as PPG14 when it is used in PPG 1 output modes. RTO14_1 (PPG14_1) 31 H5 36 RTO15_0 (PPG14_0) Wave form generator output of multi-function timer 1. This pin operates as PPG14 when it is used in PPG 1 output modes. RTO15_1 (PPG14_1) 32 L6 37

Document Number: 002-05612 Rev. *D October 23, 2017 Page 36 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 Quadrature Position/ Revolution Counter AIN0_0 QPRC ch.0 AIN input pin. AIN0_1 40 J6 45 AIN0_2 2 C1 2 BIN0_0 QPRC ch.0 BIN input pin. BIN0_1 41 L7 46 BIN0_2 3 C2 3 ZIN0_0 QPRC ch.0 ZIN input pin. ZIN0_1 42 K7 47 ZIN0_2 4 B3 4 Quadrature Position/ Revolution Counter AIN1_1 QPRC ch.1 AIN input pin. AIN1_2 43 H6 48 BIN1_1 QPRC ch.1 BIN input pin. BIN1_2 44 J7 49 ZIN1_1 QPRC ch.1 ZIN input pin. ZIN1_2 45 K8 50 USB UDM0 USB Device / HOST D – pin. 98 A3 118 UDP0 USB Device / HOST D + pin. 99 A2 119 UHCONX USB external pull-up control pin. 95 B4 115

Document Number: 002-05612 Rev. *D October 23, 2017 Page 37 of 112 MB9B300B Series Module Pin name Function Pin No. LQFP-100 BGA-112 LQFP-120 Reset INITX External Reset Input. A reset is valid when INITX=L. 38 K4 43 Mode MD0 Mode 0 pin. During normal operation, MD0=L must be input. During serial programming to flash memory, MD0=H must be input.

47 L8 57

MD1 Mode 1 pin. Input must always be at the "L" level. 46 K9 56 Power VCC Power Pin.

1 B1 1

USBVCC 3.3V Power supply port for USB I/O. 97 A4 117 GND VSS GND Pin. - B2 - VSS 25 L1 30 VSS - K2 - VSS - J3 - VSS - H4 - VSS 34 L4 39 VSS 50 L11 60 VSS - K10 - VSS - J9 - VSS - H8 - VSS - B10 - VSS - C9 - VSS 75 A11 90 VSS - D8 - VSS - D4 - VSS - C3 - VSS 100 A1 120 Clock X0 Main clock (oscillation) input pin. 48 L9 58 X0A Sub clock (oscillation) input pin. 36 L3 41 X1 Main clock (oscillation) I/O pin. 49 L10 59 X1A Sub clock (oscillation) I/O pin. 37 K3 42 CROUT Built-in High-speed CR-osc clock output port. 74 C10 89 Analog Power AVCC A/D converter analog power pin. 60 H11 70 AVRH A/D converter analog reference voltage input pin. 61 F11 71 Analog GND AVSS A/D converter GND pin. 62 G11 72 C-pin C Power stabilization capacity pin. 33 L2 38 Note: − While this device contains a Test Access Port (TAP) based on the IEEE 1149.1-2001 JTAG standard, it is not fully compliant to all requirements of that standard. This device may contain a 32-bit device ID that is the same as the 32-bit device ID in other devices with different functionality. The TAP pins may also be configurable for purposes other than access to the TAP controller.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 38 of 112 MB9B300B Series 5. I/O Circuit Type Type Circuit Remarks A

• Oscillation feedback resistor : Approximately 1 MΩ
• With Standby mode control B
• CMOS level hysteresis input
• pull-up resistor : Approximately 50 kΩ C
• CMOS level hysteresis input Clock input Standby mode control Pull-up resistor Digital input Mode input

Document Number: 002-05612 Rev. *D October 23, 2017 Page 39 of 112 MB9B300B Series Type Circuit Remarks D It is possible to select the sub oscillation / GPIO function When the sub oscillation is selected.

• Oscillation feedback resistor : Approximately 20 MΩ
• With Standby mode control When the GPIO is selected.
• CMOS level output.
• CMOS level hysteresis input
• With pull-up resistor control
• With standby mode control
• pull-up resistor : Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA P-ch P-ch N-ch R R P-ch P-ch N-ch X0A X1A Pull-up resistor Feedback resistor Pull-up resistor Digital output Digital output Pull-up resistor control Digital input Standby mode control Clock input Standby mode control Digital input Standby mode control Digital output Digital output Pull-up resistor control

Document Number: 002-05612 Rev. *D October 23, 2017 Page 40 of 112 MB9B300B Series Type Circuit Remarks E

• CMOS level output
• CMOS level hysteresis input
• With pull-up resistor control
• With standby mode control
• pull-up resistor : Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the digital output P-ch transistor is always off
• +B input is available F
• CMOS level output
• CMOS level hysteresis input
• With input control
• Analog input
• With pull-up resistor control
• With standby mode control
• pull-up resistor : Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the digital output P-ch transistor is always off
• +B input is available P-chP-ch N-ch R P-chP-ch N-ch R Digital output Digital output Pull-up resistor control Digital input Standby mode control Digital output Digital output Pull-up resistor control Digital input Standby mode control Analog input Input control

Document Number: 002-05612 Rev. *D October 23, 2017 Page 41 of 112 MB9B300B Series Type Circuit Remarks G

• CMOS level output
• CMOS level hysteresis input
• With pull-up resistor control
• With standby mode control
• pull-up resistor : Approximately 50 kΩ
• IOH = -12 mA, IOL = 12 mA
• +B input is available H It is possible to select the USB IO / GPIO function. When the USB IO is selected.
• Full-speed, Low-speed control When the GPIO is selected.
• CMOS level output
• CMOS level hysteresis input
• With standby mode control
• IOH = -25.3 mA, IOL = 19.7 mA P-chP-ch N-ch R UDP0/P81 UDM0/P80 Differential Digital output Digital output Pull-up resistor control Digital input Standby mode control GPIO Digital output GPIO Digital input/output direction GPIO Digital input GPIO Digital input circuit control UDP output UDP input Differential input USB/GPIO select UDM input UDM output USB Digital input/output direction GPIO Digital output GPIO Digital input/output direction GPIO Digital input GPIO Digital input circuit control

Document Number: 002-05612 Rev. *D October 23, 2017 Page 42 of 112 MB9B300B Series 6. Handling Precautions Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor devices.

6.1 Precautions for Product Design

This section describes precautions when designing electronic equipment using semiconductor devices. Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings. Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the datasheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand. Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. 1. Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. 2. Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. 3. Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin. Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: 1. Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. 2. Be sure that abnormal current flows do not occur during the power-on sequence. Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products. Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 43 of 112 MB9B300B Series Precautions Related to Usage of Devices Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval.

6.2 Precautions for Package Mounting

Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Cypress recommended conditions. For detailed information about mount conditions, contact your sales representative. Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting. Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended conditions. Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use. Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: 1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. 2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. 3. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. 4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust. Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended conditions for baking. Condition: 125°C/24 h

Document Number: 002-05612 Rev. *D October 23, 2017 Page 44 of 112 MB9B300B Series Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: 1. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. 2. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. 3. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. 4. Ground all fixtures and instruments, or protect with anti-static measures. 5. Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.

6.3 Precautions for Use Environment

Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: 1. Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. 2. Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. 3. Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. 4. Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. 5. Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Cypress products in other special environmental conditions should consult with sales representatives.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 45 of 112 MB9B300B Series 7. Handling Devices Power supply pins In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected within the device in order to prevent malfunctions such as latch-up. However, all of these pins should be connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels, to prevent abnormal operation of strobe signals caused by the rise in the ground level, and to conform to the total output current rating. Moreover, connect the current supply source with each Power supply pin and GND pin of this device at low impedance. It is also advisable that a ceramic capacitor of approximately 0.1 µF be connected as a bypass capacitor between each Power supply pin and GND pin, between AVCC pin and AVSS pin near this device. Stabilizing power supply voltage A malfunction may occur when the power supply voltage fluctuates rapidly even though the fluctuation is within the recommended operating conditions of the VCC power supply voltage. As a rule, with voltage stabilization, suppress the voltage fluctuation so that the fluctuation in VCC ripple (peak-to-peak value) at the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the VCC value in the recommended operating conditions, and the transient fluctuation rate does not exceed 0.1 V/μs when there is a momentary fluctuation on switching the power supply. Crystal oscillator circuit Noise near the X0/X1 and X0A/X1A pins may cause the device to malfunction. Design the printed circuit board so that X0/X1, X0A/X1A pins, the crystal oscillator (or ceramic oscillator), and the bypass capacitor to ground are located as close to the device as possible. It is strongly recommended that the PC board artwork be designed such that the X0/X1 and X0A/X1A pins are surrounded by ground plane as this is expected to produce stable operation. Evaluate oscillation of your using crystal oscillator by your mount board. Using an external clock When using an external clock, the clock signal should be input to the X0,X0A pin only and the X1,X1A pin should be kept open. Handling when using Multi function serial pin as I2C pin If it is using multi function serial pin as I2C pins, P-ch transistor of digital output is always disable. However, I2C pins need to keep the electrical characteristic like other pins and not to connect to external I2C bus system with power OFF. Device X0(X0A) X1(X1A) Open

• Example of Using an External Clock

Document Number: 002-05612 Rev. *D October 23, 2017 Page 46 of 112 MB9B300B Series C Pin This series contains the regulator. Be sure to connect a smoothing capacitor (CS) for the regulator between the C pin and the GND pin. Please use a ceramic capacitor or a capacitor of equivalent frequency characteristics as a smoothing capacitor. However, some laminated ceramic capacitors have the characteristics of capacitance variation due to thermal fluctuation (F characteristics and Y5V characteristics). Please select the capacitor that meets the specifications in the operating conditions to use by evaluating the temperature characteristics of a capacitor. A smoothing capacitor of about 4.7 μF would be recommended for this series. Mode pins (MD0, MD1) Connect the MD pin (MD0, MD1) directly to VCC or VSS pins. Design the printed circuit board such that the pull-up/down resistance stays low, as well as the distance between the mode pins and VCC pins or VSS pins is as short as possible and the connection impedance is low, when the pins are pulled-up/down such as for switching the pin level and rewriting the Flash memory data. It is because of preventing the device erroneously switching to test mode due to noise. Notes on power-on Turn power on/off in the following order or at the same time. If not using the A/D converter, connect AVCC =VCC and AVSS = VSS. Turning on : VCC →USBVCC VCC → AVCC → AVRH Turning off : AVRH → AVCC → VCC USBVCC → VCC Serial Communication There is a possibility to receive wrong data due to the noise or other causes on the serial communication. Therefore, design a printed circuit board so as to avoid noise. Consider the case of receiving wrong data due to noise, perform error detection such as by applying a checksum of data at the end. If an error is detected, retransmit the data. Differences in features among the products with different memory sizes and between FLASH products and MASK products The electric characteristics including power consumption, ESD, latch-up, noise characteristics, and oscillation characteristics among the products with different memory sizes and between FLASH products and MASK products are different because chip layout and memory structures are different. If you are switching to use a different product of the same series, please make sure to evaluate the electric characteristics. Device C VSS CS GND

Document Number: 002-05612 Rev. *D October 23, 2017 Page 47 of 112 MB9B300B Series 8. Block Diagram AHB-APB Bridge : APB2 ( Max.40MHz) AHB-APB Bridge : APB1 (Max.40MHz) AHB-AHB Bridge AHB-APB Bridge: APB0(Max.40MHz) Multi-layer AHB (Max.80MHz) Flash I/FCortex-M3 Core @80MHz(Max.) Clock Reset Generator Dual-Timer WatchDog Timer (Hardware) DMAC 8ch. On-Chip Flash 256/384/512K byte Multi Function Timer x2 Multi-Function Serial I/F 8ch. (with FIFO ch.4～7) *HW flow control(ch.4) 16-bit FreeRun Timer 3ch. 16-bit Output Compare 6ch. 16-bit Input Capture 4ch. Waveform Generator 3ch. A/D Activation Compare 3ch. 16-bit PPG 3ch. Watch Counter Unit 0 GPIO USB 2.0 (Host /Func) PHY CSV LVD External Interrupt Controller 16-pin + NMI Power On Reset TPIU ROM Table ETM SRAM0 16/24/32 Kbyte SWJ-DP SRAM1 16/24/32 Kbyte I D Sys MB9BF304B/305B/306B Base Timer 16-bit 8ch. /32-bit 4ch. MPU NVIC WatchDog Timer (Software) Security 12-bit A/D Converter Unit 1 Unit 2 TRSTX,TC KTDI,TMS TRACED[3:0], TRACECLK AVCC, AVSS,AVRH AN[15:0] TIOA[7:0] TIOB[7:0] IC0[3:0] DTTI[1:0]X RTO0[5:0] FRCK[1:0] UDP0,UDM0 C TDO X0A X1A SCK[7:0] SIN[7:0] SOT[7:0] INT[15:0] NMIX P0[F:0], P1[F:0], Px[x:0], INITX USBVCC MODE-Ctrl IRQ-Monitor PIN-Function-Ctrl MD[1:0] Regulator QPRC 2ch. AIN[1:0] BIN[1:0] ZIN[1:0] LVD Ctrl CRC Accelerator IC1[3:0] USB Clock ctrl PLL ADTG[8:0] RTS4 CTS4 External Bus IF MAD[24:0] MDATA[15:0] MCSX[7:0], MOEX,MWEX, MNALE, MNCLE MNWEX, MNREX, MDQM[1:0] UHCONX RTO1[5:0] PLL CLK CR 100kHz Source Clock CROUT Main Osc Sub Osc CR 4MHz (Host /Device)

Document Number: 002-05612 Rev. *D October 23, 2017 Page 48 of 112 MB9B300B Series 9. Memory Size See “Memory size” in “1. Product Lineup” to confirm the memory size. 10. Memory Map Memory Map (1) Flash 0x0000_0000 0x0010_0000 0x2000_0000 0x1FF8_0000 SRAM0 SRAM10x2008_0000 Reserved 0x2200_0000 Reserved 32Mbyte Bit band alias 0x2400_0000 Reserved 0x4000_0000 Peripherals 0x4200_0000 0x6000_0000 0xE000_0000 Cortex-M3 Private Peripherals 0xE010_0000 Reserved 0xFFFF_FFFF 32Mbyte Bit band alias Reserved 0x4400_0000 0x4000_0000 0x41FF_FFFF Flash I/F0x4000_1000 Reserved 0x4001_0000 Clock/Reset 0x4001_2000 0x4001_1000 SW WDT HW WDT 0x4001_5000 Reserved 0x4001_3000 Dual Timer0x4001_6000 Reserved 0x4002_0000 Peripherals Area MFT unit00x4002_1000 MFT unit10x4002_2000 Reserved PPG 0x4002_4000 0x4002_5000 Base Timer0x4002_6000 QPRC0x4002_7000 A/DC0x4002_8000 Reserved 0x4003_0000 EXTI0x4003_1000 Int-Req. Read0x4003_2000 0x4003_3000 0x4003_4000 0x4003_5000 0x4003_6000 0x4003_7000 Reserved GPIO LVD USB Clock Ctrl 0x4003_8000 MFS0x4003_9000 CRC0x4003_A000 Watch Counter0x4003_B000 Reserved 0x4004_0000 EXT-bus I/F USB ch.0 0x4005_0000 0x4006_0000 0x4006_1000 0x4006_2000 DMAC 0x4006_3000 Reserved 0x4003_F000 Reserved Reserved 0x4002_E000 CR Trim0x4002_F000 Reserved 0x4006_4000 Reserved Security/CR Trim0x0010_2000 Please refer to the next page for the memory size details. Reserved Reserved Reserved External Device Area 0x7000_0000 Reserved

Document Number: 002-05612 Rev. *D October 23, 2017 Page 49 of 112 MB9B300B Series Memory Map (2) SA10-11(64KBx2) SA8-9(48KBx2) SA4-7(8KBx4) SA10-13(64KBx4) SA8-9(48KBx2) SA4-7(8KBx4) SA10-15(64KBx6) SA8-9(48KBx2) SA4-7(8KBx4)0x0000_0000 0x2000_0000 0x1FFF_8000 SRAM0 32Kbyte SRAM1 32kbyte 0x2008_0000 Reserved Security0x0010_0000 0x0008_0000 Reserved 0x2000_8000 CR trimming 0x0010_1000 0x0010_2000 Reserved SRAM1 16kbyte SRAM0 16kbyte 0x0000_0000 0x0000_0000 0x1FFF_A000 Reserved Security0x0010_0000 0x0006_0000 CR trimming 0x0010_1000 0x0010_2000 Reserved 0x1FFF_C000 Reserved Security0x0010_0000 0x0004_0000 CR trimming Reserved 0x2008_0000 Reserved 0x2000_4000 0x2000_0000 0x0010_1000 0x0010_2000 SRAM1 24kbyte SRAM0 24kbyte 0x2000_6000 0x2000_0000 0x2008_0000 Reserved MB9BF306NB/RB MB9BF305NB/RB MB9BF304NB/RB Flash 512Kbyte Flash 384Kbyte Flash 256Kbyte *: See "MB9B500/400/300/100/MB9A100 Series Flash Programming Manual" for sector structure of Flash.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 50 of 112 MB9B300B Series Peripheral Address Map Start address End address Bus Peripherals 0x4000_0000 0x4000_0FFF AHB Flash Memory I/F register 0x4000_1000 0x4000_FFFF Reserved 0x4001_0000 0x4001_0FFF APB0 Clock/Reset Control 0x4001_1000 0x4001_1FFF Hardware Watchdog timer 0x4001_2000 0x4001_2FFF Software Watchdog timer 0x4001_3000 0x4001_4FFF Reserved 0x4001_5000 0x4001_5FFF Dual-Timer 0x4001_6000 0x4001_FFFF Reserved 0x4002_0000 0x4002_0FFF APB1 Multi-function timer unit0 0x4002_1000 0x4002_1FFF Multi-function timer unit1 0x4002_2000 0x4002_3FFF Reserved 0x4002_4000 0x4002_4FFF PPG 0x4002_5000 0x4002_5FFF Base Timer 0x4002_6000 0x4002_6FFF Quadrature Position/Revolution Counter 0x4002_7000 0x4002_7FFF A/D Converter 0x4002_8000 0x4002_DFFF Reserved 0x4002_E000 0x4002_EFFF Internal CR trimming 0x4002_F000 0x4002_FFFF Reserved 0x4003_0000 0x4003_0FFF APB2 External Interrupt Controller 0x4003_1000 0x4003_1FFF Interrupt Request Batch-Read Function 0x4003_2000 0x4003_2FFF Reserved 0x4003_3000 0x4003_3FFF GPIO 0x4003_4000 0x4003_4FFF Reserved 0x4003_5000 0x4003_5FFF Low Voltage Detector 0x4003_6000 0x4003_6FFF USB clock generator 0x4003_7000 0x4003_7FFF Reserved 0x4003_8000 0x4003_8FFF Multi-function serial Interface 0x4003_9000 0x4003_9FFF CRC 0x4003_A000 0x4003_AFFF Watch Counter 0x4003_B000 0x4003_EFFF Reserved 0x4003_F000 0x4003_FFFF External Memory interface 0x4004_0000 0x4004_FFFF AHB USB ch.0 0x4005_0000 0x4005_FFFF Reserved 0x4006_0000 0x4006_0FFF DMAC register 0x4006_1000 0x4006_1FFF Reserved 0x4006_2000 0x4006_2FFF Reserved 0x4006_3000 0x4006_3FFF Reserved 0x4006_4000 0x41FF_FFFF Reserved

Document Number: 002-05612 Rev. *D October 23, 2017 Page 51 of 112 MB9B300B Series 11. Pin Status in Each CPU State The terms used for pin status have the following meanings.  INITX=0 This is the period when the INITX pin is the "L" level.  INITX=1 This is the period when the INITX pin is the "H" level.  SPL=0 This is the status that standby pin level setting bit (SPL) in standby mode control register (STB_CTL) is set to "0".  SPL=1 This is the status that standby pin level setting bit (SPL) in standby mode control register (STB_CTL) is set to "1".  Input enabled Indicates that the input function can be used.  Internal input fixed at "0" This is the status that the input function cannot be used. Internal input is fixed at "L".  Hi-Z Indicates that the output drive transistor is disabled and the pin is put in the Hi-Z state.  Setting disabled Indicates that the setting is disabled.  Maintain previous state Maintains the state that was immediately prior to entering the current mode. If a built-in peripheral function is operating, the output follows the peripheral function. If the pin is being used as a port, that output is maintained.  Analog input is enabled Indicates that the analog input is enabled.  Trace output Indicates that the trace function can be used.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 52 of 112 MB9B300B Series List of Pin Status Pin status type Function group Power-on reset or low voltage detection state INITX input state Device internal reset state Run mode or sleep mode state Timer mode or sleep mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX=0 INITX=1 INITX=1 INITX=1 - - - - SPL=0 SPL=1 A Main crystal oscillator input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled B Main crystal oscillator output pin H output/ Internal input fixed at "0"/ or Input enabled H output/ Internal input fixed at "0" H output/ Internal input fixed at "0" Maintain previous state/ H output at oscillation stop*1 / Internal input fixed at "0" Maintain previous state/ H output at oscillation stop*1/ Internal input fixed at "0" Maintain previous state/ H output at oscillation stop*1/ Internal input fixed at "0" C INITX input pin Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled D Mode input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled E JTAG selected Hi-Z Pull-up/ Input enabled Pull-up/ Input enabled Maintain previous state Maintain previous state Maintain previous state GPIO selected Setting disabled Setting disabled Setting disabled Hi-Z/ Internal input fixed at "0" F Trace selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Trace output External interrupt enabled selected Maintain previous state GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0" G Trace selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Trace output GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0" H External interrupt enabled selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0"

Document Number: 002-05612 Rev. *D October 23, 2017 Page 53 of 112 MB9B300B Series Pin status type Function group Power-on reset or low voltage detection state INITX input state Device internal reset state Run mode or sleep mode state Timer mode or sleep mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX=0 INITX=1 INITX=1 INITX=1 - - - - SPL=0 SPL=1 I GPIO selected, resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" J NMIX selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0" K Analog input selected Hi-Z Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled GPIO selected, or other than above resource selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" L External interrupt enabled selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state Analog input selected Hi-Z Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled GPIO selected, or other than above resource selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" M GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" Sub crystal oscillator input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled

Document Number: 002-05612 Rev. *D October 23, 2017 Page 54 of 112 MB9B300B Series Pin status type Function group Power-on reset or low voltage detection state INITX input state Device internal reset state Run mode or sleep mode state Timer mode or sleep mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX=0 INITX=1 INITX=1 INITX=1 - - - - SPL=0 SPL=1 N GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" Sub crystal oscillator output pin Hi-Z/ Internal input fixed at "0" Hi-Z/ Internal input fixed at "0" Hi-Z/ Internal input fixed at "0" Maintain previous state Maintain previous state/ Hi-Z at oscillation stop*2/ Internal input fixed at "0" Maintain previous state/ Hi-Z at oscillation stop*2/ Internal input fixed at "0" O GPIO selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" USB I/O pin Setting disabled Setting disabled Setting disabled Maintain previous state Hi-Z at transmission/ Input enabled/ Internal input fixed at "0" at reception Hi-Z at transmission/ Input enabled/ Internal input fixed at "0" at reception *1: Oscillation is stopped at sub timer mode, Low speed CR timer mode, and stop mode. *2: Oscillation is stopped at stop mode.

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12.1 Absolute Maximum Ratings

Parameter Symbol Rating Unit Remarks Min Max Power supply voltage*1, *2 Vcc Vss - 0.5 Vss + 6.5 V Power supply voltage (for USB)*1, *3 USBVcc Vss - 0.5 Vss + 6.5 V Analog power supply voltage*1, *4 AVcc Vss - 0.5 Vss + 6.5 V Analog reference voltage*1, *4 AVRH Vss - 0.5 Vss + 6.5 V Input voltage*1 VI Vss - 0.5 Vcc + 0.5 (≤ 6.5V) V Except for USB pin Vss - 0.5 USBVcc + 0.5 (≤ 6.5V) V USB pin Analog pin input voltage*1 VIA Vss - 0.5 AVcc + 0.5 (≤ 6.5V) V Output voltage*1 VO Vss - 0.5 Vcc + 0.5 (≤ 6.5V) V Clamp maximum current ICLAMP -2 +2 mA *8 Clamp total maximum current Σ[ICLAMP] +20 mA *8 "L" level maximum output current*5 IOL - 10 mA 4 mA type 20 mA 12 mA type 39 mA P80, P81 "L" level average output current*6 IOLAV - 4 mA 4 mA type 12 mA 12 mA type 19.7 mA P80, P81 "L" level total maximum output current ∑IOL - 100 mA "L" level total average output current*7 ∑IOLAV - 50 mA "H" level maximum output current*5 IOH - - 10 mA 4 mA type - 20 mA 12 mA type - 39 mA P80, P81 "H" level average output current*6 IOHAV - - 4 mA 4 mA type - 12 mA 12 mA type - 25.3 mA P80, P81 "H" level total maximum output current ∑IOH - - 100 mA "H" level total average output current*7 ∑IOHAV - - 50 mA Power consumption PD - 800 mW Storage temperature TSTG - 55 + 150 C *1: These parameters are based on the condition that Vss = AVss = 0.0 V. *2: Vcc must not drop below Vss - 0.5 V. *3: USBVcc must not drop below Vss - 0.5 V. *4: Be careful not to exceed Vcc + 0.5 V, for example, when the power is turned on. *5: The maximum output current is the peak value for a single pin. *6: The average output is the average current for a single pin over a period of 100 ms. *7: The total average output current is the average current for all pins over a period of 100 ms.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 56 of 112 MB9B300B Series *8:

• See “4. List of Pin Functions” and “5. I/O Circuit Type” about +B input available pin.
• Use within recommended operating conditions.
• Use at DC voltage (current) the +B input.
• The +B signal should always be applied a limiting resistance placed between the +B signal and the device.
• The value of the limiting resistance should be set so that when the +B signal is applied the input current to the device pin does not exceed rated values, either instantaneously or for prolonged periods.
• Note that when the device drive current is low, such as in the low-power consumption modes, the +B input potential may pass through the protective diode and increase the potential at the VCC and AVCC pin, and this may affect other devices.
• Note that if a +B signal is input when the device power supply is off (not fixed at 0 V), the power supply is provided from the pins, so that incomplete operation may result.
• The following is a recommended circuit example (I/O equivalent circuit). WARNING: − Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. R +B input (0V to 16V) Protection Diode P-ch VCC VCC Limiting resistor N-ch AVCC Analog input Digital input Digital output

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12.2 Recommended Operating Conditions

(Vss = AVss = 0.0 V) Parameter Symbol Conditions Value Unit Remarks Min Max Power supply voltage Vcc - 2.7 *4 5.5 V Power supply voltage for USB USBVcc - 3.0 3.6 (≤ Vcc) V 2.7 5.5 (≤ Vcc) *2 Analog power supply voltage AVcc - 2.7 5.5 V AVcc = Vcc Analog reference voltage AVRH - 2.7 AVcc V Smoothing capacitor CS - 1 10 μF For built-in regulator *3 Operating Temperature LQM120 LQI100 LBC112 TA When mounted on four-layer PCB - 40 + 85 C When mounted on double-sided single-layer PCB - 40 + 85 C Icc ≤ 100 mA - 40 + 70 C Icc > 100 mA *1: When P81/UDP0 and P80/UDM0 pin are used as USB (UDP0, UDM0). *2: When P81/UDP0 and P80/UDM0 pin are used as GPIO (P81, P80). *3: See "C Pin" in "7. Handling Devices" for the connection of the smoothing capacitor. *4: In between less than the minimum power supply voltage and low voltage reset/interrupt detection voltage or more, instruction execution and low voltage detection function by built-in High-speed CR (including Main PLL is used) or built-in Low-speed CR is possible to operate only. WARNING: − The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the datasheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand.

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12.3 DC Characteristics

12.3.1 Current Rating

(Vcc = AVcc = USBVcc = 2.7 V to 5.5 V, Vss = AVss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ *3 Max *4 RUN mode current Icc VCC PLL RUN mode CPU: 80 MHz, Peripheral: 40 MHz, FLASH 2 Wait FRWTR.RWT = 10 FSYNDN.SD = 000 96 118 mA *1, *5 CPU: 60 MHz, Peripheral: 30 MHz, FLASH 0 Wait FRWTR.RWT = 00 FSYNDN.SD = 000 76 94 mA *1, *3 CPU: 80 MHz, Peripheral: 40 MHz, FLASH 5 Wait FRWTR.RWT = 10 FSYNDN.SD = 011 66 82 mA *1, *5 CPU: 60 MHz, Peripheral: 30 MHz, FLASH 3Wait FRWTR.RWT = 00 FSYNDN.SD = 011 52 65 mA *3, *5 High-speed CR RUN mode CPU/Peripheral: 4 MHz*2 FLASH 0Wait FRWTR.RWT = 00 FSYNDN.SD = 000 6.0 9.2 mA *1 Sub RUN mode CPU/Peripheral: 32 kHz FLASH 0Wait FRWTR.RWT = 00 FSYNDN.SD = 000 0.2 2.24 mA *1, *6 Low-speed CR RUN mode CPU/Peripheral: 100 kHz FLASH 0Wait FRWTR.RWT = 00 FSYNDN.SD = 000 0.3 2.36 mA *1 SLEEP mode current Iccs PLL SLEEP mode Peripheral: 40 MHz 43 54 mA *1, *5 High-speed CR SLEEP mode Peripheral: 4 MHz*2 3.5 6.2 mA *1 Sub SLEEP mode Peripheral: 32 kHz 0.15 2.18 mA *1, *6 Low-speed CR SLEEP mode Peripheral: 100 kHz 0.22 2.27 mA *1 *1: When all ports are fixed. *2: When setting it to 4 MHz by trimming. *3: TA=+25°C, VCC=3.3 V *4: TA=+85°C, VCC=5.5 V *5: When using the crystal oscillator of 4 MHz (Including the current consumption of the oscillation circuit) *6: When using the crystal oscillator of 32 kHz (Including the current consumption of the oscillation circuit)

Document Number: 002-05612 Rev. *D October 23, 2017 Page 59 of 112 MB9B300B Series (Vcc = AVcc = USBVcc = 2.7 V to 5.5 V, Vss = AVss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ *2 Max *3 TIMER mode current ICCT VCC Main TIMER mode Ta = + 25C, When LVD is off 2.4 2.5 mA *1, *4 Ta = + 85C, When LVD is off - 5.4 mA *1, *4 Sub TIMER mode Ta = + 25C, When LVD is off 110 300 μA *1, *5 Ta = + 85C, When LVD is off - 2.2 mA *1, *5 STOP mode current ICCH STOP mode Ta = + 25C, When LVD is off 50 200 μA *1 Ta = + 85C, When LVD is off - 2 mA *1 *1: When all ports are fixed. *2: VCC=3.3 V *3: VCC=5.5 V *4: When using the crystal oscillator of 4 MHz (Including the current consumption of the oscillation circuit) *5: When using the crystal oscillator of 32 kHz (Including the current consumption of the oscillation circuit) Low-Voltage Detection Current (VCC = 2.7 V to 5.5 V, VSS = 0 V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Low-Voltage detection circuit (LVD) power supply current ICCLVD VCC At operation for interrupt 2 10 μA At not detect Flash Memory Current (VCC = 2.7 V to 5.5 V, VSS = 0 V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Flash memory write/erase current ICCFLASH VCC At Write/Erase 13 24 mA A/D Converter Current (VCC = AVCC = 2.7 V to 5.5 V, VSS = AVSS = AVRL = 0 V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Power supply current ICCAD AVCC At 1unit operation 2.3 3.6 mA At stop 0.1 2 μA Reference power supply current ICCAVRH AVRH At 1unit operation AVRH=5.5V 2.2 3.0 mA At stop 0.03 0.6 μA

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12.3.2 Pin Characteristics

(Vcc = AVcc = 2.7 V to 5.5 V, Vss = AVss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Typ Max "H" level input voltage (hysteresis input) VIHS CMOS hysteresis input pin, MD0,1 - Vcc× 0.8 - Vcc+ 0.3 V "L" level input voltage (hysteresis input) VILS CMOS hysteresis input pin, MD0,1 - Vss- 0.3 - Vcc× 0.2 V "H" level output voltage VOH 4mA type Vcc 4.5 V IOH = - 4 mA Vcc- 0.5 - Vcc V Vcc < 4.5 V IOH = - 2 mA 12 mA type Vcc 4.5 V IOH = - 12 mA Vcc- 0.5 - Vcc V Vcc 4.5 V IOH = - 8 mA P80, P81 Vcc  4.5 V IOH = - 25.3 mA Vcc- 0.4 - Vcc V Vcc < 4.5 V IOH = - 13.4 mA "L" level output voltage VOL 4mA type Vcc  4.5 V IOL = 4 mA Vss - 0.4 V Vcc < 4.5 V IOL = 2 mA 12mA type Vcc 4.5 V IOL = 12 mA Vss - 0.4 V Vcc  4.5 V IOL = 8 mA P80, P81 Vcc  4.5 V IOL = 19.7 mA Vss - 0.4 V Vcc < 4.5 V IOL = 11.9 mA Input leak current IIL - - - 5 - 5 μA Pull-up resistance value RPU Pull-up pin Vcc  4.5 V 25 50 100 kΩ Vcc 4.5 V 30 80 200 Input capacitance CIN Other than Vcc, Vss, AVcc, AVss, AVRH - - 5 15 pF

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12.4 AC Characteristics

12.4.1 Main Clock Input Characteristics

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input frequency FCH Vcc  4.5 V 4 48 MHz When crystal oscillator is connected Vcc  4.5 V 4 20 Vcc  4.5 V 4 48 MHz When using external clock Vcc  4.5 V 4 20 Input clock cycle tCYLH Vcc  4.5 V 20.83 250 ns When using external clock Vcc  4.5 V 50 250 Input clock pulse width - PWH/tCYLH PWL/tCYLH 45 55 % When using external clock Input clock rise time and fall time tCF tCR - - 5 ns When using external clock Internal operating clock*1 frequency FCM - - - 80 MHz Master clock FCC - - - 80 MHz Base clock (HCLK/FCLK) FCP0 - - - 40 MHz APB0 bus clock *2 FCP1 - - - 40 MHz APB1 bus clock *2 FCP2 - - - 40 MHz APB2 bus clock *2 Internal operating clock *1 cycle time tCYCC - - 12.5 - ns Base clock (HCLK/FCLK) tCYCP0 - - 25 - ns APB0 bus clock *2 tCYCP1 - - 25 - ns APB1 bus clock *2 tCYCP2 - - 25 - ns APB2 bus clock *2 *1: For more information about each internal operating clock, see "Chapter 2-1: Clock" in "FM3 Family Peripheral Manual". *2: For about each APB bus which each peripheral is connected to, see "8. Block Diagram" in this datasheet.

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12.4.2 Sub Clock Input Characteristics

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Typ Max Input frequency FCL X0A X1A - - 32.768 - kHz When crystal oscillator is connected - 32 - 100 kHz When using external clock Input clock cycle tCYLL - 10 - 31.25 μs When using external clock Input clock pulse width - PWH/tCYLL PWL/tCYLL 45 - 55 % When using external clock

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12.4.3 Built-in CR Oscillation Characteristics

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Clock frequency FCRH TA = + 25C 3.92 4 4.08 MHz When trimming *1 TA = 0C to + 70C 3.84 4 4.16 TA = - 40C to + 85C 3.8 4 4.2 TA = - 40C to + 85C 3 4 6 When not trimming Frequency stability time tCRWT - - - 50 μs *2 *1: In the case of using the values in CR trimming area of Flash memory at shipment for frequency trimming. *2: Frequency stable time is time to stable of the frequency of the High-speed CR clock after the trim value is set. After setting the trim value, the period when the frequency stability time passes can use the High-speed CR clock as a source clock. Built-in low-speed CR (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Clock frequency FCRL - 50 100 150 kHz

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12.4.4 Operating Conditions of Main and USB PLL (In the case of using main clock for input of PLL)

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Value Unit Remarks Min Typ Max PLL oscillation stabilization wait time (LOCK UP time) *1 tLOCK 100 - - μs PLL input clock frequency fPLLI 4 - 30 MHz PLL multiple rate - 4 - 30 multiple PLL macro oscillation clock frequency fPLLO 60 - 120 MHz Main PLL clock frequency *2 FCLKPLL - - 80 MHz USB clock frequency *3 FCLKSPLL - - 48 MHz After the M frequency division *1: Time from when the PLL starts operating until the oscillation stabilizes. *2: For more information about Main PLL clock (CLKPLL), see "Chapter 2-1: Clock" in "FM3 Family Peripheral Manual". *3: For more information about USB clock, see "Chapter 2-2: USB Clock Generation" in "FM3 Family Peripheral Manual Communication Macro Part".

12.4.5 Operating Conditions of Main PLL (In the case of using built-in high speed CR)

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Value Unit Remarks Min Typ Max PLL oscillation stabilization wait time (LOCK UP time) *1 tLOCK 100 - - μs PLL input clock frequency fPLLI 3.8 4 4.2 MHz PLL multiple rate - 15 - 28 multiple PLL macro oscillation clock frequency fPLLO 57 - 120 MHz Main PLL clock frequency *2 FCLKPLL - - 80 MHz *1: Time from when the PLL starts operating until the oscillation stabilizes. *2: For more information about Main PLL clock (CLKPLL), see "Chapter 2-1: Clock" in "FM3 Family Peripheral Manual". Note: − Make sure to input to the main PLL source clock, the high-speed CR clock (CLKHC) that the frequency has been trimmed.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 65 of 112 MB9B300B Series Main clock (CLKMO) K divider PLL input clock USB PLL M divider USB clock N divider USB PLL connection PLL macro oscillation clock K divider PLL input clock Main PLL PLL macro oscillation clock M divider Main PLL clock (CLKPLL) N divider Main PLL connection Main clock (CLKMO) High-speed CR clock (CLKHC)

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12.4.6 Reset Input Characteristics

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Reset input time tINITX INITX - 500 - ns

12.4.7 Power-on Reset Timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Value Unit Remarks Min Max Power supply rising time Tr VCC 0 - ms Power supply shut down time Toff 1 - ms Time until releasing Power-on reset Tprt 0.422 0.704 ms 0.2V VDH_minimum VCC_minimum Tprt Internal RST VCC CPU Operation start RST Active Release Tr 0.2V 0.2V Toff Glossary VCC_minimum: Minimum VCC of recommended operating conditions VDH_minimum: Minimum release voltage of Low-Voltage detection reset. See "12.7. Low-Voltage Detection Characteristics"

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12.4.8 External Bus Timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max MOEX Min pulse width tOEW MOEX Vcc ≥ 4.5 V THCLK×1 - 3 - ns Vcc  4.5 V MOEX   Address delay time tOEL - AV MOEX MAD24 to 00 Vcc ≥ 4.5 V 0 10 ns Vcc  4.5 V 0 20 MOEX   Address delay time tOEH - AX MOEX MAD24 to 00 Vcc ≥ 4.5 V 0 10 ns Vcc  4.5 V 0 20 MOEX   MCSX  delay time tOEL - CSL MOEX MCSX Vcc ≥ 4.5 V 0 10 ns Vcc  4.5 V MOEX   MCSX  delay time tOEH - CSH MOEX MCSX Vcc ≥ 4.5 V 0 10 ns Vcc  4.5 V Data set up MOEX  time tDS - OE MOEX MDATA15 to 0 Vcc ≥ 4.5 V 20 - ns Vcc  4.5 V 38 - MOEX   Data hold time tDH - OE MOEX MDATA15 to 0 Vcc ≥ 4.5 V 0 - ns Vcc  4.5 V MCSX   MWEX  delay time tCSL - WEL MCSX MWEX Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 10 - MWEX   MCSX  delay time tWEH - CSH MCSX MWEX Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 10 - Address  MWEX  delay time tAV - WEL MWEX MAD24 to 00 Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - MWEX   Address delay time tWEH - AX MWEX MAD24 to 00 Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - MWEX   MDQM  delay time tWEL - DQML MWEX MDQM0 to 1 Vcc ≥ 4.5 V 0 5 ns Vcc  4.5 V 0 10 MWEX   MDQM  delay time tWEH - DQMH MWEX MDQM0 to 1 Vcc ≥ 4.5 V 0 5 ns Vcc  4.5 V 0 10 MWEX Min pulse width tWEW MWEX Vcc ≥ 4.5 V THCLK×1 - 3 - ns Vcc  4.5 V MWEX   Data delay time tWEL - DV MWEX MDATA15 to 0 Vcc ≥ 4.5 V - 5 5 ns Vcc  4.5 V -15 15 MWEX   Data delay time tWEH - DX MWEX MDATA15 to 0 Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - Note: − When the external load capacitance = 50 pF.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 68 of 112 MB9B300B Series VIL VIH VOH MCSX0 to 7 MAD24 to 00 MOEX MDATA15 to 0 tOEW VOL VOL VOH tOEL-AV VOL VOH tOEL-CSL VOL VOH VIH VIL tDS-OE tDH-OE tOEH-AX Read SRAM read HCLK tCYC VOH VOH tOEH-CSH MWEX MDATA15 to 0 VOH VOL VOL VOH Write MCSX0 to 7 MAD24 to 00 VOL VOL VOH VOL VOH SRAM write HCLK tCYC VOH MDQM0 to 1 VOH tWEL-DQML VOL VOL VOH tWEH-DX tWEH-AX tCSL-WEL tWEW tWEH-CSH tWEH-DQMH tWEL-DV tAV-WEL

Document Number: 002-05612 Rev. *D October 23, 2017 Page 69 of 112 MB9B300B Series NAND FLASH mode (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max MNREX Min pulse width tNREW MNREX Vcc ≥ 4.5 V THCLK×1 - 3 - ns Vcc  4.5 V Data set up  MNREX  tiime tDS - NRE MNREX MDATA15 to 0 Vcc ≥ 4.5 V 20 - ns Vcc  4.5 V 38 - MNREX   Data hold time tDH - NRE MNREX MDATA15 to 0 Vcc ≥ 4.5 V 0 - ns Vcc  4.5 V 0 - MNALE   MNWEX delay time tALEH - NWEL MNALE MNWEX Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - MNWEX   MNALE delay time tNWEH - ALEL MNALE MNWEX Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - MNCLE   MNWEX delay time tCLEH - NWEL MNCLE MNWEX Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - MNWEX   MNCLE delay time tNWEH - CLEL MNCLE MNWEX Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - MNWEX Min pulse width tNWEW MNWEX Vcc ≥ 4.5 V THCLK×1 - 3 - ns Vcc  4.5 V MNWEX   Data delay time tNWEL - DV MNWEX MDATA15 to 0 Vcc ≥ 4.5 V - 5 + 5 ns Vcc  4.5 V -15 +15 MNWEX   Data delay time tNWEH - DX MNWEX MDATA15 to 0 Vcc ≥ 4.5 V THCLK×1 - 5 - ns Vcc  4.5 V THCLK×1 - 15 - Note: − When the external load capacitance = 50 pF.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 70 of 112 MB9B300B Series VIL VIH MNREX MDATA15 to 0 VOL VOH VIH VIL tDS-NRE tDH-NRE Read NAND FLASH read tNREW HCLK tCYC VOH VOH MDATA15 to 0 VOH VOL VOL VOH Write NAND FLASH write HCLK tCYC MNWEX VOH VOL tNWEW VOL VOH tNWEH-DX VOH VOL MNCLE MNALE tALEH-NWEL tNWEL-DV tNWEH-ALEL tCLEH-NWEL tNWEH-CLEL

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12.4.9 Base Timer Input Timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tTIWH tTIWL TIOAn/TIOBn (when using as ECK,TIN) - 2tCYCP - ns Trigger input timing (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tTRGH tTRGL TIOAn/TIOBn (when using as TGIN) - 2tCYCP - ns Note: − tCYCP indicates the APB bus clock cycle time. About the APB bus number which the Base Timer is connected to, see “8. Block Diagram” in this datasheet. tTIWH VIHS VIHS VILS VILS tTIWL VIHS VILS TGIN tTRGH VIHS VILS tTRGL

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12.4.10 CSIO/UART Timing

CSIO (SPI = 0, SCINV = 0) (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Vcc  4.5 V Vcc ≥ 4.5 V Unit Min Max Min Max Baud Rate - - - - 8 - 8 Mbps Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK   SOT delay time tSLOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN  SCK  setup time tIVSHI SCKx SINx 50 - 30 - ns SCK   SIN hold time tSHIXI SCKx SINx 0 - 0 - ns Serial clock "L" pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock "H" pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK   SOT delay time tSLOVE SCKx SOTx - 50 - 30 ns SIN  SCK  setup time tIVSHE SCKx SINx 10 - 10 - ns SCK   SIN hold time tSHIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: − The above characteristics apply to CLK synchronous mode. − tCYCP indicates the APB bus clock cycle time. − About the APB bus number which Multi-function Serial is connected to, see "8. Block Diagram" in this datasheet. − These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. − When the external load capacitance = 50 pF.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 73 of 112 MB9B300B Series Master mode Slave mode tSCYC VOH VOH VOL VOL VOL VIH VIL VIH VIL tSLOVI tIVSHI tSHIXI tSLSH tSHSL VIH tF tR VIH VOH VIH VIL VIL VOL VIH VIL VIH VIL tSLOVE tIVSHE tSHIXE SCK SOT SIN SCK SOT SIN

Document Number: 002-05612 Rev. *D October 23, 2017 Page 74 of 112 MB9B300B Series CSIO (SPI = 0, SCINV = 1) (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Vcc  4.5 V Vcc ≥ 4.5 V Unit Min Max Min Max Baud Rate - - - - 8 - 8 Mbps Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK   SOT delay time tSHOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN  SCK  setup time tIVSLI SCKx SINx 50 - 30 - ns SCK   SIN hold time tSLIXI SCKx SINx 0 - 0 - ns Serial clock "L" pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock "H" pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK   SOT delay time tSHOVE SCKx SOTx - 50 - 30 ns SIN  SCK  setup time tIVSLE SCKx SINx 10 - 10 - ns SCK   SIN hold time tSLIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: − The above characteristics apply to CLK synchronous mode. − tCYCP indicates the APB bus clock cycle time. About the APB bus number which Multi-function serial is connected to, see “8. Block Diagram” in this datasheet. − These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. − When the external load capacitance = 50 pF.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 75 of 112 MB9B300B Series Master mode Slave mode tSCYC VOH VOH VOH VOL VOL VIH VIL VIH VIL tSHOVI tIVSLI tSLIXI tSHSL tSLSH VIH tFtR VIH VOH VILVIL VIL VOL VIH VIL VIH VIL tSHOVE tIVSLE tSLIXE SCK SOT SIN SCK SOT SIN

Document Number: 002-05612 Rev. *D October 23, 2017 Page 76 of 112 MB9B300B Series CSIO (SPI = 1, SCINV = 0) (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Vcc  4.5 V Vcc ≥ 4.5 V Unit Min Max Min Max Baud Rate - - - - 8 - 8 Mbps Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK   SOT delay time tSHOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN  SCK  setup time tIVSLI SCKx SINx 50 - 30 - ns SCK   SIN hold time tSLIXI SCKx SINx 0 - 0 - ns SOT  SCK  delay time tSOVLI SCKx SOTx 2tCYCP - 30 - 2tCYCP - 30 - ns Serial clock "L" pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock "H" pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK   SOT delay time tSHOVE SCKx SOTx - 50 - 30 ns SIN  SCK  setup time tIVSLE SCKx SINx 10 - 10 - ns SCK   SIN hold time tSLIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: − The above characteristics apply to CLK synchronous mode. − tCYCP indicates the APB bus clock cycle time. About the APB bus number which Multi-function Serial is connected to, see "8. Block Diagram" in this datasheet. − These characteristics only guarantees the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. − When the external load capacitance = 50 pF.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 77 of 112 MB9B300B Series Master mode Slave mode *: Changes when writing to TDR register tSOVLI tSCYC tSHOVI VOL VOL VOH VOH VOL VOH VOL VIH VIL VIH VIL tIVSLI tSLIXI tF tR tSLSH tSHSL tSHOVE VIL VIL VIH VIH VIH VOH VOL VOH VOL VIH VIL VIH VIL tIVSLE tSLIXE SCK SOT SIN SCK SOT SIN

Document Number: 002-05612 Rev. *D October 23, 2017 Page 78 of 112 MB9B300B Series CSIO (SPI = 1, SCINV = 1) (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Vcc  4.5 V Vcc ≥ 4.5 V Unit Min Max Min Max Baud Rate - - - - 8 - 8 Mbps Serial clock cycle time tSCYC SCKx Master mode 4tCYCPp - 4tCYCP - ns SCK   SOT delay time tSLOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN  SCK  setup time tIVSHI SCKx SINx 50 - 30 - ns SCK  SIN hold time tSHIXI SCKx SINx 0 - 0 - ns SOT  SCK  delay time tSOVHI SCKx SOTx 2tCYCP - 30 - 2tCYCP - 30 - ns Serial clock "L" pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock "H" pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK   SOT delay time tSLOVE SCKx SOTx - 50 - 30 ns SIN  SCK  setup time tIVSHE SCKx SINx 10 - 10 - ns SCK   SIN hold time tSHIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: − The above characteristics apply to CLK synchronous mode. − tCYCP indicates the APB bus clock cycle time. About the APB bus number which Multi-function Serial is connected to, see "8. Block Diagram" in this datasheet. − These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. − When the external load capacitance = 50 pF.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 79 of 112 MB9B300B Series Master mode Slave mode UART external clock input (EXT = 1) (Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Conditions Min Max Unit Remarks Serial clock "L" pulse width tSLSH CL = 50 pF tCYCP + 10 - ns Serial clock "H" pulse width tSHSL tCYCP + 10 - ns SCK fall time tF - 5 ns SCK rise time tR - 5 ns tSCYC tSLOVI VOL VOH VOH VOH VOL VOH VOL VIH VIL VIH VIL tIVSHI tSHIXI tSOVHI t SHSL tR t SLSH t SLOVE V IL V IL V IL V IH V IH V IH V OH V OL V OH V OL V IH V IL V IH V IL t IVSHE t SHIXE tF SCK SOT SIN SCK SOT SIN t SHSL V I L V I L V I L V IH V IH V IH tR tF t SLSH SCK

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12.4.11 External Input Timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tINH tINL ADTG - 2tCYCP *1 - ns A/D converter trigger input FRCKx Free-run timer input clock ICxx Input capture DTTIxX - 2tCYCP *1 - ns Wave form generator INTxx, NMIX Except Timer mode, Stop mode 2tCYCP + 100 *1 - ns External interrupt NMI Timer mode, Stop mode 500 - ns *1: tCYCP indicates the APB bus clock cycle time. About the APB bus number which the A/D converter, Multi-function Timer, External interrupt are connected to, see "8. Block Diagram" in this datasheet. tINH VILS VIHS VIHS VILS tINL

Document Number: 002-05612 Rev. *D October 23, 2017 Page 81 of 112 MB9B300B Series

12.4.12 Quadrature Position/Revolution Counter timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Conditions Value Unit Min Max AIN pin "H" width tAHL - 2tCYCP *1 - ns AIN pin "L" width tALL - BIN pin "H" width tBHL - BIN pin "L" width tBLL - BIN rise time from AIN pin "H" level tAUBU PC_Mode2 or PC_Mode3 AIN fall time from BIN pin "H" level tBUAD PC_Mode2 or PC_Mode3 BIN fall time from AIN pin "L" level tADBD PC_Mode2 or PC_Mode3 AIN rise time from BIN pin "L" level tBDAU PC_Mode2 or PC_Mode3 AIN rise time from BIN pin "H" level tBUAU PC_Mode2 or PC_Mode3 BIN fall time from AIN pin "H" level tAUBD PC_Mode2 or PC_Mode3 AIN fall time from BIN pin "L" level tBDAD PC_Mode2 or PC_Mode3 BIN rise time from AIN pin "L" level tADBU PC_Mode2 or PC_Mode3 ZIN pin "H" width tZHL QCR:CGSC="0" ZIN pin "L" width tZLL QCR:CGSC="0" AIN/BIN rise and fall time from determined ZIN level tZABE QCR:CGSC="1" Determined ZIN level from AIN/BIN rise and fall time tABEZ QCR:CGSC="1" *1: tCYCP indicates the APB bus clock cycle time. About the APB bus number which the Quadrature Position/Revolution Counter is connected to, see "8. Block Diagram" in this datasheet. AIN BIN tAUBU tBUAD tADBD tBDAU tAHL tALL tBHL tBLL

Document Number: 002-05612 Rev. *D October 23, 2017 Page 82 of 112 MB9B300B Series BIN tBUAU tAUBD tBDAD tADBU tBHL tBLL tAHL tALL AIN ZIN ZIN AIN/BIN

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12.4.13 I2C Timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Conditions Standard-mode Fast-mode Unit Remarks Min Max Min Max SCL clock frequency FSCL CL = 50 pF, R = (Vp/IOL) *1 0 100 0 400 kHz (Repeated) START condition hold time SDA   SCL  tHDSTA 4.0 - 0.6 - μs SCLclock "L" width tLOW 4.7 - 1.3 - μs SCLclock "H" width tHIGH 4.0 - 0.6 - μs (Repeated) START setup time SCL   SDA  tSUSTA 4.7 - 0.6 - μs Data hold time SCL   SDA   tHDDAT 0 3.45 *2 0 0.9 *3 μs Data setup time SDA    SCL  tSUDAT 250 - 100 - ns STOP condition setup time SCL   SDA  tSUSTO 4.0 - 0.6 - μs Bus free time between "STOP condition" and "START condition" tBUF 4.7 - 1.3 - μs Noise filter tSP - 2 tCYCP *4 - 2 tCYCP *4 - ns *1: R and C represent the pull-up resistance and load capacitance of the SCL and SDA lines, respectively. Vp indicates the power supply voltage of the pull-up resistance and IOL indicates VOL guaranteed current. *2: The maximum tHDDAT must satisfy that it doesn't extend at least "L" period (tLOW) of device's SCL signal. *3: Fast-mode I2C bus device can be used on Standard-mode I2C bus system as long as the device satisfies the requirement of "tSUDAT ≥ 250 ns". *4: tCYCP is the APB bus clock cycle time. About the APB bus number that I2C is connected to, see "8. Block Diagram" in this datasheet. To use Standard-mode, set the APB bus clock at 2 MHz or more. To use Fast-mode, set the APB bus clock at 8 MHz or more. SDA SCL

Document Number: 002-05612 Rev. *D October 23, 2017 Page 84 of 112 MB9B300B Series

12.4.14 ETM Timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Data hold tETMH TRACECLK TRACED3 - 0 Vcc ≥ 4.5 V 2 9 ns Vcc  4.5 V 2 15 TRACECLK Frequency 1/tTRACE TRACECLK Vcc ≥ 4.5 V - 50 MHz Vcc < 4.5 V - 32 MHz TRACECLK clock cycle time tTRACE Vcc ≥ 4.5 V 20 - ns Vcc < 4.5 V 31.25 - ns Note: − When the external load capacitance = 50 pF. HCLK TRACECLK TRACED[3:0]

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12.4.15 JTAG Timing

(Vcc = 2.7 V to 5.5 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max TMS,TDI setup time tJTAGS TCK TMS,TDI Vcc ≥ 4.5 V 15 - ns Vcc  4.5 V TMS,TDI hold time tJTAGH TCK TMS,TDI Vcc ≥ 4.5 V 15 - ns Vcc  4.5 V TDO delay time tJTAGD TCK TDO Vcc ≥ 4.5 V - 25 ns Vcc  4.5 V - 45 Note: − When the external load capacitance = 50 pF. TCK TMS/TDI TDO

Document Number: 002-05612 Rev. *D October 23, 2017 Page 86 of 112 MB9B300B Series 12.5 12-bit A/D Converter Electrical characteristics for the A/D converter (Vcc = AVcc = 2.7 V to 5.5 V, Vss = AVss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Value Unit Remarks Min Typ Max Resolution - - - - 12 bit Integral Nonlinearity - - - ± 2 ± 4.5 LSB AVRH = 2.7 V to 5.5 V Differential Nonlinearity - - - ± 2 ± 2.5 LSB Zero transition voltage VZT ANxx - ± 5 ± 20 mV Full-scale transition voltage VFST ANxx - AVRH ± 10 AVRH ± 20 mV Conversion time - - 1.0 *1 - - μs AVcc ≥ 4.5 V 2.666 *1 - - AVcc < 4.5 V Sampling time Ts - *2 - - ns AVcc ≥ 4.5 V *2 - - AVcc < 4.5 V Compare clock cycle *3 Tcck - 55.5 - 10000 ns AVcc ≥ 4.5 V 166.6 *4 AVcc < 4.5 V State transition time to operation permission Tstt - - - 2.5 μs Analog input capacity CAIN - - - 14.5 pF Analog input resistance RAIN - - - 0.93 kΩ AVcc ≥ 4.5 V 2.04 AVcc < 4.5 V Interchannel disparity - - - - 4 LSB Analog port input leak current - ANxx - - 5 μA Analog input voltage - ANxx AVSS - AVRH V Reference voltage - AVRH 2.7 - AVCC V *1: The Conversion time is the value of sampling time(Ts) + compare time(Tc). The condition of the minimum conversion time is the following. AVcc ≥ 4.5 V, HCLK=72 MHz sampling time: 0.222 μs compare time: 0.778 μs AVcc < 4.5 V, HCLK=54 MHz sampling time: 0.333 μs compare time: 2.333 μs Ensure that it satisfies the value of the sampling time (Ts) and compare clock cycle (Tcck). For setting of the sampling time and compare clock cycle, see "Chapter 1-1: A/D Converter" in "FM3 Family Peripheral Manual Analog Macro Part". The registers setting of the A/D Converter are reflected in the operation according to the APB bus clock timing. The sampling clock and compare clock is generated from the Base clock (HCLK). About the APB bus number which the A/D Converter is connected to, see "8. Block Diagram" in this datasheet. *2: A necessary sampling time changes by external impedance. Ensure that it set the sampling time to satisfy (Equation 1) *3: The Compare time (Tc) is the value of (Equation 2) *4: When 12-bit A/D converter is used at AVcc<4.5 V, there is a limitation as follows. Please set the HCLK frequency under 54 MHz.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 87 of 112 MB9B300B Series (Equation 1) Ts ≥ ( RAIN + Rext ) × CAIN × 9 Ts: Sampling time RAIN: Input resistance of A/D = 0.93 kΩ 4.5 V ≤ AVCC ≤ 5.5 V Input resistance of A/D = 2.04 kΩ 2.7 V ≤ AVCC < 4.5 V CAIN: Input capacity of A/D = 14.5 pF 2.7 V ≤ AVCC ≤ 5.5 V Rext: Output impedance of external circuit (Equation 2) Tc = Tcck × 14 Tc: Compare time Tcck: Compare clock cycle Rext RAIN CAIN Analog signal source ANxx Analog input pin Comparator

Document Number: 002-05612 Rev. *D October 23, 2017 Page 88 of 112 MB9B300B Series Definition of 12-bit A/D Converter Terms  Resolution: Analog variation that is recognized by an A/D converter.  Integral Nonlinearity: Deviation of the line between the zero-transition point (0b000000000000 ←→ 0b000000000001) and the full-scale transition point (0b111111111110 ←→ 0b111111111111) from the actual conversion characteristics.  Differential Nonlinearity: Deviation from the ideal value of the input voltage that is required to change the output code by 1 LSB Integral Nonlinearity of digital output N = VNT - {1LSB × (N - 1) + VZT} [LSB] 1LSB Differential Nonlinearity of digital output N = V(N + 1) T - VNT - 1 [LSB] 1LSB 1LSB = VFST – VZT 4094 N: A/D converter digital output value. VZT: Voltage at which the digital output changes from 0x000 to 0x001. VFST: Voltage at which the digital output changes from 0xFFE to 0xFFF. VNT: Voltage at which the digital output changes from 0x(N − 1) to 0xN. Integral Nonlinearity Differential Nonlinearity Digital output Digital output Actual conversion characteristics Actual conversion characteristics Ideal characteristics (Actually- measured value) Actual conversion characteristics Actual conversion characteristics (Actually-measured value) (Actually-measured value) Ideal characteristics (Actually-measured value) Analog input Analog input (Actually-measured value) 0x001 0x002 0x003 0x004 0xFFD 0xFFE 0xFFF AVSS AVRH AVSS AVRH 0x(N-2) 0x(N-1) 0x(N+1) 0xN {1 LSB(N-1) + VZT} VNT VFST VZT VNT V(N+1)T

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12.6 USB Characteristics

(Vcc = 2.7 V to 5.5 V, USBVcc = 3.0V to 3.6 V, Vss = 0 V, TA = - 40C to + 85C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input charact- eristics Input High level voltage VIH UDP0, UDM0 - 2.0 USBVcc + 0.3 V *1 Input Low level voltage VIL - Vss - 0.3 0.8 V *1 Differential input sensitivity VDI - 0.2 - V *2 Different common mode input voltage VCM - 0.8 2.5 V *2 Output charact- erstics Output High level voltage VOH External pull- down resistance = 15 kΩ 2.8 3.6 V *3 Output Low level voltage VOL External pull-up resistance = 1.5 kΩ 0.0 0.3 V *3 Crossover voltage VCRS - 1.3 2.0 V *4 Rise time tFR Full Speed 4 20 ns *5 Fall time tFF Full Speed 4 20 ns *5 Rise/ fall time matching tFRFM Full Speed 90 111.11 % *5 Output impedance ZDRV Full Speed 28 44 Ω *6 Rise time tLR Low Speed 75 300 ns *7 Fall time tLF Low Speed 75 300 ns *7 Rise/ fall time matching tLRFM Low Speed 80 125 % *7 *1: The switching threshold voltage of Single-End-Receiver of USB I/O buffer is set as within VIL (Max) = 0.8 V, VIH (Min) = 2.0 V (TTL input standard). There are some hystereses to lower noise sensitivity. *2: Use differential-Receiver to receive USB differential data signal. Differential-Receiver has 200 mV of differential input sensitivity when the differential data input is within 0.8 V to 2.5 V to the local ground reference level. Above voltage range is the common mode input voltage range. 0.2 0.8 1.0 2.5 Common mode input voltage [V] Minimum differential input sensitivity [V]

Document Number: 002-05612 Rev. *D October 23, 2017 Page 90 of 112 MB9B300B Series *3: The output drive capability of the driver is below 0.3 V at Low-State (VOL) (to 3.6 V and 1.5 kΩ load), and 2.8 V or above (to the VSS and 1.5 kΩ load) at High-State (VOH). *4: The cross voltage of the external differential output signal (D + /D −) of USB I/O buffer is within 1.3 V to 2.0 V. *5: They indicate rise time (Trise) and fall time (Tfall) of the full-speed differential data signal. They are defined by the time between 10% and 90% of the output signal voltage. For full-speed buffer, Tr/Tf ratio is regulated as within  10% to minimize RFI emission. Min 1.3V Max 2.0V VCRS specified range Trise 10% 90% Tfall Rising time Falling time 10% 90% Full-speed Buffer Rs = 27Ω TxD+ TxD- 3-State Enable CL = 50pF CL = 50pF. Rs = 27Ω

Document Number: 002-05612 Rev. *D October 23, 2017 Page 91 of 112 MB9B300B Series *6: USB Full-speed connection is performed via twist pair cable shield with 90 Ω ± 15% characteristic impedance (Differential Mode). USB standard defines that output impedance of USB driver must be in range from 28 Ω to 44 Ω. So, discrete series resistor (Rs) addition is defined in order to satisfy the above definition and keep balance. When using this USB I/O, use it with 25 Ω to 30 Ω (recommendation value 27 Ω) series resistor Rs. *7: They indicate rise time (Trise) and fall time (Tfall) of the low-speed differential data signal. They are defined by the time between 10% and 90% of the output signal voltage. See “Low-Speed Load (Compliance Load)” for conditions of the external load. Full-speed Buffer Rs Rs TxD+ TxD- 3-State Enable 28Ω to 44Ω Equiv. Imped. 28Ω to 44Ω Equiv. Imped. Mount it as external resistance. Rs series resistor 25Ω to 30Ω Series resistor of 27Ω(recommendation value) must be added. And, use "resistance with an uncertainty of 5% by E24 sequence". Trise 10% 90% Tfall Rising time Falling time 10% 90%

Document Number: 002-05612 Rev. *D October 23, 2017 Page 92 of 112 MB9B300B Series Low-Speed Load (Upstream Port Load) - Reference 1 Low-Speed Load (Downstream Port Load) - Reference 2 Low-Speed Load (Compliance Load) Low-speed Buffer Rs = 27Ω TxD+ TxD- 3-State Enable CL = 50 to 150pF CL =50 to 150pF Rs = 27Ω Rpd=15kΩ Rpd Rpd Rpu=1.5kΩ VTERM=3.6V VTERM Rpu Low-speed Buffer Rs=27Ω Rs=27Ω TxD+ TxD- 3-State Enable CL=200 to 600pF CL=200 to 600pF Low-speed Buffer Rs = 27Ω TxD+ TxD- 3-State Enable CL = 200 to 450pF CL =200 to 450pF Rs = 27Ω

Document Number: 002-05612 Rev. *D October 23, 2017 Page 93 of 112 MB9B300B Series

12.7 Low-Voltage Detection Characteristics

12.7.1 Low-Voltage Detection Reset

(TA = - 40C to + 85C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Detected voltage VDL - 2.20 2.40 2.60 V When voltage drops Released voltage VDH - 2.30 2.50 2.70 V When voltage rises

12.7.2 Interrupt of Low-Voltage Detection

(TA = - 40C to + 85C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Detected voltage VDL SVHI = 0000 2.58 2.8 3.02 V When voltage drops Released voltage VDH 2.67 2.9 3.13 V When voltage rises Detected voltage VDL SVHI = 0001 2.76 3.0 3.24 V When voltage drops Released voltage VDH 2.85 3.1 3.34 V When voltage rises Detected voltage VDL SVHI = 0010 2.94 3.2 3.45 V When voltage drops Released voltage VDH 3.04 3.3 3.56 V When voltage rises Detected voltage VDL SVHI = 0011 3.31 3.6 3.88 V When voltage drops Released voltage VDH 3.40 3.7 3.99 V When voltage rises Detected voltage VDL SVHI = 0100 3.40 3.7 3.99 V When voltage drops Released voltage VDH 3.50 3.8 4.10 V When voltage rises Detected voltage VDL SVHI = 0111 3.68 4.0 4.32 V When voltage drops Released voltage VDH 3.77 4.1 4.42 V When voltage rises Detected voltage VDL SVHI = 1000 3.77 4.1 4.42 V When voltage drops Released voltage VDH 3.86 4.2 4.53 V When voltage rises Detected voltage VDL SVHI = 1001 3.86 4.2 4.53 V When voltage drops Released voltage VDH 3.96 4.3 4.64 V When voltage rises LVD stabilization wait time TLVDW - - - 2040 × tcycp *1 μs *1: tCYCP indicates the APB2 bus clock cycle time.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 94 of 112 MB9B300B Series

12.8 Flash Memory Write/Erase Characteristics

12.8.1 Write / Erase time

(Vcc = 2.7 V to 5.5 V, TA = - 40C to + 85C) Parameter Value Unit Remarks Typ *1 Max *1 Sector erase time Large Sector 1.6 7.5 s Includes write time prior to internal erase Small Sector 0.4 2.1 Half word (16 bit) write time 25 400 μs Not including system-level overhead time. Chip erase time 16 76.8 s Includes write time prior to internal erase *1: The typical value is immediately after shipment, the maximum value is guarantee value under 100,000 cycle of erase/write.

12.8.2 Erase/write cycles and data hold time

(cycle) Data hold time (year) Remarks 1,000 20 *1 10,000 10 *1 100,000 5 *1 *1: At average + 85°C

Document Number: 002-05612 Rev. *D October 23, 2017 Page 95 of 112 MB9B300B Series

12.9 Return Time from Low-Power Consumption Mode

12.9.1 Return Factor: Interrupt

The return time from Low-Power consumption mode is indicated as follows. It is from receiving the return factor to starting the program operation. Return Count Time (VCC = 2.7 V to 5.5 V, TA = - 40°C to + 85°C) Parameter Symbol Value Unit Remarks Typ Max *1 SLEEP mode Ticnt tCYCC ns High-speed CR TIMER mode, Main TIMER mode, PLL TIMER mode 33 100 μs Low-speed CR TIMER mode 445 1061 μs Sub TIMER mode 445 1061 μs STOP mode 445 1061 μs *1: The maximum value depends on the accuracy of built-in CR. Operation example of return from Low-Power consumption mode (by external interrupt *1) Ext.INT Ticnt Interrupt factor accept CPU Operation Start Active Interrupt factor clear by CPU *1: External interrupt is set to detecting fall edge.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 96 of 112 MB9B300B Series Operation example of return from Low-Power consumption mode (by internal resource interrupt *1) Internal Resource INT Ticnt Interrupt factor accept CPU Operation Start Active Interrupt factor clear by CPU *1: Internal resource interrupt is not included in return factor by the kind of Low-Power consumption mode. Notes: − The return factor is different in each Low-Power consumption modes. See "Chapter 6: Low Power Consumption Mode" and "Operations of Standby Modes" in FM3 Family Peripheral Manual about the return factor from Low-Power consumption mode. − When interrupt recoveries, the operation mode that CPU recoveries depend on the state before the Low-Power consumption mode transition. See "Chapter 6: Low Power Consumption Mode" in "FM3 Family Peripheral Manual"

Document Number: 002-05612 Rev. *D October 23, 2017 Page 97 of 112 MB9B300B Series

12.9.2 Return Factor: Reset

The return time from Low-Power consumption mode is indicated as follows. It is from releasing reset to starting the program operation. Return Count Time (VCC = 2.7 V to 5.5 V, TA = - 40°C to + 85°C) Parameter Symbol Value Unit Remarks Typ Max *1 SLEEP mode Trcnt 82 181 μs High-speed CR TIMER mode, Main TIMER mode, PLL TIMER mode 82 181 μs Low-speed CR TIMER mode 431 1003 μs Sub TIMER mode 431 1003 μs STOP mode 431 1003 μs *1: The maximum value depends on the accuracy of built-in CR. Operation example of return from Low-Power consumption mode (by INITX) INITX Trcnt Internal RST CPU Operation Start RST Active Release

Document Number: 002-05612 Rev. *D October 23, 2017 Page 98 of 112 MB9B300B Series Operation example of return from low power consumption mode (by internal resource reset *1) Internal Resource RST Trcnt Internal RST CPU Operation Start RST Active Release *1: Internal resource reset is not included in return factor by the kind of Low-Power consumption mode. Notes: − The return factor is different in each Low-Power consumption modes. See "Chapter 6: Low Power Consumption Mode" and "Operations of Standby Modes" in FM3 Family Peripheral Manual. − When interrupt recoveries, the operation mode that CPU recoveries depend on the state before the Low-Power consumption mode transition. See "Chapter 6: Low Power Consumption Mode" in "FM3 Family Peripheral Manual" − The time during the power-on reset/low-voltage detection reset is excluded. See "12.4.7. Power-on Reset Timing 12.4. AC Characteristics in 12. Electrical Characteristics" for the detail on the time during the power-on reset/low -voltage detection reset − When in recovery from reset, CPU changes to the high-speed CR run mode. When using the main clock or the PLL clock, it is necessary to add the main clock oscillation stabilization wait time or the main PLL clock stabilization wait time. − The internal resource reset means the watchdog reset and the CSV reset.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 99 of 112 MB9B300B Series 13. Example of Characteristic Power supply current (PLL run mode, PLL sleep mode) Power supply current (Sub run mode) Power supply current (Sub sleep mode) Icc normal operation(PLL) temperature characteristics Vcc:5.5V, CPU:80MHｚ, Peripheral:40MHｚ,FLASH 2Wait 100 110 120 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [mA] Iccs sleep operation(PLL) temperature characteristics Vcc:5.5V, Peripheral:40MHｚ -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [mA] Icc normal operation(sub oscillation) temperature characteristics Vcc:5.5V, CPU/Peripheral:32KHz 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] Icc normal operation(sub oscillation) temperature characteristics(semi-log) Vcc:5.5V, CPU/Peripheral:32KHz 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] (log) Iccs sleep operation(sub oscillation) temperature characteristics Vcc:5.5V, Peripheral:32KHz 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] Iccs sleep operation(sub oscillation) temperature characteristics(semi-log) Vcc:5.5V, Peripheral:32KHz 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] (log)

Document Number: 002-05612 Rev. *D October 23, 2017 Page 100 of 112 MB9B300B Series Power supply current (Sub timer mode) Power supply current (Stop mode) ICCT timer mode(sub oscillation) temperature characteristics Vcc:5.5V, LVD is Off 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] ICCT timer mode(sub oscillation) temperature characteristics(semi-log) Vcc:5.5V, LVD is Off 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] (log) ICCH stop mode (sub oscillation) temperature characteristics Vcc:5.5V, LVD is Off 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] ICCH stop mode (sub oscillation) temperature characteristics(semi-log) Vcc:5.5V, LVD is Off 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature Ta[℃] Power supply current [μA] (log)

Document Number: 002-05612 Rev. *D October 23, 2017 Page 101 of 112 MB9B300B Series 14. Ordering Information Part Number On-chip Flash Memory On-chip MB9BF304NBPMC-G-JNE2

256 Kbyte 32 KB

Plastic・LQFP(0.5 mm pitch),100-pin (LQI100) Tray MB9BF304NBPMC-G-UNE1 MB9BF305NBPMC-G-JNE2 384 Kbyte 48 KB MB9BF306NBPMC-G-UNE1

512 Kbyte 64 KB

Plastic・LQFP(0.5 mm pitch),120-pin (LQM120) MB9BF304RBPMC-G-UNE1 MB9BF305RBPMC-G-JNE2 384 Kbyte 48 KB MB9BF306RBPMC-G-JNE2 512 Kbyte 64 KB MB9BF304NBBGL-GK6E1 256 Kbyte 32 KB Plastic・FBGA(0.8 mm pitch),112-pin (LBC112) MB9BF305NBBGL-GK6E1 384 Kbyte 48 KB MB9BF306NBBGL-GK6E1 512 Kbyte 64 KB

Document Number: 002-05612 Rev. *D October 23, 2017 Page 102 of 112 MB9B300B Series 15. Package Dimensions Package Type Package Code LQFP 100 LQI100 NOTES : 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DATUM PLANE H IS LOCATED AT THE BOTTOM OF THE MOLD PARTING LINE COINCIDENT WITH WHERE THE LEAD EXITS THE BODY. 3. DATUMS A-B AND D TO BE DETERMINED AT DATUM PLANE H. 4. TO BE DETERMINED AT SEATING PLANE C. 5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25mm PRE SIDE. DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE H. 6. DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. 7. REGARDLESS OF THE RELATIVE SIZE OF THE UPPER AND LOWER BODY SECTIONS. DIMENSIONS D1 AND E1 ARE DETERMINED AT THE LARGEST FEATURE OF THE BODY EXCLUSIVE OF MOLD FLASH AND GATE BURRS. BUT INCLUDING ANY MISMATCH BETWEEN THE UPPER AND LOWER SECTIONS OF THE MOLDER BODY. 8. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. THE DAMBAR PROTRUSION (S) SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED b MAXIMUM BY MORE THAN 0.08mm. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD FOOT. 9. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10mm AND 0.25mm FROM THE LEAD TIP. 10. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT OF THE PACKAGE BODY. DIMENSIONS SYMBOL MIN. NOM. MAX. A 1.70 A1 0.05 0.15 b 0.15 0.27 c 0.09 0.20 D 16.00 BSC D1 14.00 BSC e 0.50 BSC E L 0.45 0.60 0.75 L1 0.30 0.50 0.70

16.00 BSC

14.00 BSC

A A10.250.08 C 100 D E1 E e

0.08 C A-B D

0.20 C A-B D

0.10 C A-B D

b SECTION A-A' c A 5 7 L b D E1 E 5 7 5175 SIDE VIEW TOP VIEW BOTTOM VIEW DETAIL A 125 5715 100 PACKAGE OUTLINE, 100 LEAD LQFP 14.0X14.0X1.7 MM LQI100 REV*A 002-11500 *A

Document Number: 002-05612 Rev. *D October 23, 2017 Page 103 of 112 MB9B300B Series Package Type Package Code LQFP 120 LQM120 MIN. NOM. MAX. 07.1A A1 0.05 0.15 b 0.17 0.22 0.27 c 0.115 0.195 D 18.00 BSC D1 16.00 BSC e 0.50 BSC E L 0.45 0.60 0.75

18.00 BSC

D e EE1

0.08 C A-B Db

0.08 C SEATI NG PLA NE A A A10.25 10 L b SECTION A -A' 5 7 752 6190 130 0916 PACKAGE OUTLINE, 120 LEAD LQFP 18.0X18.0X1.7 MM LQM120 REV 002-16172

Document Number: 002-05612 Rev. *D October 23, 2017 Page 104 of 112 MB9B300B Series Package Type Package Code FBGA 112 LBC112 N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW, DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. "SD" AND "SE" ARE MEASUREDWITH RESPECT TO DATUMS A AND B AND SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION. "e" REPRESENTSTHE SOLDER BALL GRID PITCH. DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A SOLDER BALL POSITION DESIGNATIO N PER JEP95, SECTION 3, SPP-020. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. SD b eE eD ME N 0.35 0.00

0.80 BSC

0.45 112 0.55 DIMENSIONS MD E D A SYMBOL 0.25 MIN.

8.00 BSC

10.00 BSC

NOM. - 1.45 0.45 MAX. SE 0.00 0.35 METALIZED MARK, INDENTATION OR OTHER MEANS. "SD" = eD/2 AND "SE" = eE/2. PLANE PARALLEL TO DATUM C. "SD" OR "SE" = 0. SIZE MD X ME. BALLS. A 0.20 C B 0.20 C INDEX MARKPIN A1 CORNER 7 ABCDEFGHJKL 112xφb

0.08 C A B

0.10 C C

10.00X10.00X1.45 MM LBC112 REV PACKAGE OUTLINE, 112 BALL FBGA 002-13225

Document Number: 002-05612 Rev. *D October 23, 2017 Page 105 of 112 MB9B300B Series 16. Errata This chapter describes the errata for MB9B300R and MB9B300RA series. Details include errata trigger conditions, scope of impact, available workaround, and silicon revision applicability. Contact your local Cypress Sales Representative if you have questions.

16.1 Part Numbers Affected

MB9BF304RPMC-G-JNE2, MB9BF305RPMC-G-JNE2, MB9BF306RPMC-G-JNE2, MB9BF304NPMC-G-JNE2, MB9BF305NPMC-G-JNE2, MB9BF306NPMC-G-JNE2, MB9BF304NBGL-GE1, MB9BF305NBGL-GE1, MB9BF306NBGL-GE1, MB9BF306NBGL-GK6E1 Rev. A MB9BF304RAPMC-G-JNE2, MB9BF305RAPMC-G-JNE2, MB9BF306RAPMC-G-JNE2, MB9BF304NAPMC-G-JNE2, MB9BF305NAPMC-G-JNE2, MB9BF306NAPMC-G-JNE2, MB9BF304NABGL-GE1, MB9BF305NABGL-GE1, MB9BF306NABGL-GE1

16.2 Qualification Status

Product Status: In Production − Qual.

16.3 Errata Summary

This table defines the errata applicability to available devices. Items Part Number Silicon Revision Fix Status [1] Timer/Stop Mode Issue Refer to 16.1 Rev. initial rev. Fixed in Rev. A [2] USB HOST Issue Refer to 16.1 Rev. initial rev. Rev. A Fixed in Rev. B [3] Gap Between Watch Counter Value and Real Time at Return in Timer Mode Refer to 16.1 Rev. initial rev. Fixed in Rev. A

16.4 Errata Detail

16.4.1 Timer and Stop Mode Issue

 PROBLEM DEFINITION MCU does not return form timer or stop mode.  PARAMETERS AFFECTED N/A  TRIGGER CONDITION(S) The condition is that the timing of entering timer or stop mode and an interruption occurrence meet.  SCOPE OF IMPACT MCU does not return from time or stop mode.  WORKAROUND This error cannot be avoided by any software, except not using timer and stop mode.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 106 of 112 MB9B300B Series  FIX STATUS This issue was fixed in Rev. A.

16.4.2 USB HOST Issue

 PROBLEM DEFINITION Unexpected USB transfer is generated or USB HOST stops its operation.  PARAMETERS AFFECTED N/A  TRIGGER CONDITION(S) The condition is that all (1) and (2) and (3) and (4) meet. (1) The timing of rising edge of USB clock and the timing of rising edge of CPU clock meet (2) Endpoint processing is on-going (3) USB bus is differential 1 (4) One of these cases happens Case 1: TKNEN bits are set to 001 from 110. Case 2: TKNEN is set to 111.  SCOPE OF IMPACT USB HOST does not work properly.  WORKAROUND This error cannot be avoided by any software, except not using USB HOST.  FIX STATUS This issue was fixed in Rev. B.

16.4.3 Gap Between Watch Counter Value and Real Time at Return in Timer Mode

 PROBLEM DEFINITION There is a gap between the value of the counter and the real time at the return by the interrupt in the sub-timer mode or the low speed CR timer mode. When the watch counter using the sub -crystal oscillator is used in the sub timer mode or the low speed CR timer mode, the value of the watch counter has a “Low speed CR x 35clock” delay (about 350us at waiting for the stability of the regulator) at the return by the interrupt. As a result, a gap occurs between the value of the counter and the real time. The following figure shows the timing waveform.  ROOT CAUSE The internal regulator operates with low drive and low power consumption in the sub timer mode or the low speed CR timer mode. When the interrupt is requested, the mode of the internal regulator is switched to the normal drive mode. At this time, a switching time for the stability of the regulator is required. This MCU is designed for keeping down the voltage variation of the regulator by reducing the current. To achieve it, the clock to the watch counter is stopped in the period.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 107 of 112 MB9B300B Series At a result, the value of the watch counter delay until the time for the stability of the regulator is shown in the Figure. Therefore, a gap occurs between the value of the counter and the real time.  TRIGGER CONDITION(S) When both of (1) and (2) described in below is applicable, the gap occurs. (1) CPU Operation Mode The gap occurs in the sub timer mode or the low speed CR mode. It does not occur in the following modes:

• Run modes (PLL, main, high speed CR, sub, and low speed CR)
• Sleep modes (PLL, main, high speed CR, sub, low speed CR)
• PLL timer mode
• Main timer mode
• High speed CR timer mode
• Stop mode (2) Return Factor The gap occurs when any of the following interrupt is requested for the return in the sub timer mode or the low speed CR timer mode.
• NMI interrupt
• External interrupt
• Hardware Watchdog Timer interrupt
• USB Wakeup interrupt
• Watch Counter interrupt
• Low-voltage detection interrupt
• The gap does not occur in the standby return by the reset because the value of the counter is cleared  WORKAROUND When the extremely accuracy is required for the count time of the watch counter, use the sub sleep mode or the low speed CR sleep mode.  FIX STATUS This issue was fixed in Rev. A.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 108 of 112 MB9B300B Series 17. Major Changes Spansion Publication Number: DS706-00024 Page Section Change Results Revision 1.0 - - Initial release Revision 2.0 - - Corrected series name and part number: MB9B300A Series → MB9B300B Series, MB9BF304NA → MB9BF304NB, MB9BF304RA → MB9BF304RB, MB9BF305NA → MB9BF305NB, MB9BF305RA → MB9BF305RB, MB9BF306NA → MB9BF306NB, MB9BF306RA → MB9BF306RB Revision 2.1 - - Company name and layout design change Revision 3.0

2 FEATURES

USB Interface Added the description of PLL for USB

3 FEATURES

External Bus Interface Added the description of Maximum area size

8 PACKAGES Deleted the description of ES

17 LIST OF PIN FUNCTIONS

List of pin numbers Modified the Pin state type of P4E from I to H 32-35 LIST OF PIN FUNCTIONS List of pin functions Added LIN to the description of SOTxx

42 I/O CIRCUIT TYPE Added the description of I2C to the type of E and F

42, 43 I/O CIRCUIT TYPE Added about +B input

48 HANDLING DEVICES Added "Stabilizing power supply voltage"

48 HANDLING DEVICES

Crystal oscillator circuit Added the following description "Evaluate oscillation of your using crystal oscillator by your mount board."

49 HANDLING DEVICES

C Pin Changed the description

50 BLOCK DIAGRAM Modified the block diagram

50 MEMORY SIZE Changed to the following description

See "Memory size" in "PRODUCT LINEUP" to confirm the memory size.

51 MEMORY MAP

Memory map(1) Modified the area of "External Device Area"

52 MEMORY MAP

Memory map(2) Added the summary of Flash memory sector and the note 59, 60 ELECTRICAL CHARACTERISTICS 1. Absolute Maximum Ratings Added the Clamp maximum current Added the output current of P80 and P81 Added about +B input

61 ELECTRICAL CHARACTERISTICS

1. Recommended Operation Conditions Modified the minimum value of Analog reference voltage Added Smoothing capacitor Added the note about less than the minimum power supply voltage 62, 63

ELECTRICAL CHARACTERISTICS

1. DC Characteristics (1) Current rating Changed the table format Added Main TIMER mode current Added Flash Memory Current Moved A/D Converter Current
2. AC Characteristics (1) Main Clock Input Characteristics Added Master clock at Internal operating clock frequency
3. AC Characteristics (3) Built-in CR Oscillation Characteristics Added Frequency stability time at Built-in high-speed CR

Document Number: 002-05612 Rev. *D October 23, 2017 Page 109 of 112 MB9B300B Series Page Section Change Results

1. AC Characteristics (4-1) Operating Conditions of Main and USB PLL (4-2) Operating Conditions of Main PLL Added Main PLL clock frequency Added USB clock frequency Added the figure of Main PLL connection and USB PLL connection
2. AC Characteristics (6) Power-on Reset Timing Added Time until releasing Power-on reset Changed the figure of timing 74-81
3. AC Characteristics (7) CSIO/UART Timing Modified from UART Timing to CSIO/UART Timing Changed from Internal shift clock operation to Master mode Changed from External shift clock operation to Slave mode

88 ELECTRICAL CHARACTERISTICS

1. 12bit A/D Converter Added the typical value of Integral Nonlinearity, Differential Nonlinearity, Zero transition voltage and Full-scale transition voltage Added Conversion time at AVcc < 4.5 V Modified Stage transition time to operation permission Modified the minimum value of Reference voltage

91 ELECTRICAL CHARACTERISTICS

1. USB Characteristics Modified condition of Output Low level voltage

96 ELECTRICAL CHARACTERISTICS

1. Flash Memory Write/Erase Characteristics Change to the erase time of include write time prior to internal erase 97-100
2. Return Time from Low-Power Consumption Mode Added Return Time from Low-Power Consumption Mode

103 ORDERING INFORMATION Change to full part number

104 PACKAGE DIMENSIONS Deleted FPT-100P-M20 and FPT-120P-M21

Note: Please see “Document History” about later revised information.

Document Number: 002-05612 Rev. *D October 23, 2017 Page 110 of 112 MB9B300B Series Document History Document Title: MB9B300B Series 32-bit Arm® Cortex®-M3 FM3 Microcontroller Document Number: 002-05612 Revision ECN Orig. of Change Submission Date Description of Change ** – AKIH 12/15/2014 Migrated to Cypress and assigned document number 002-05612. No change to document contents or format. *A 5206321 AKIH 04/11/2016 Updated to Cypress format. *B 5486354 HTER 03/02/2017 Updated Cypress Logo. Corrected the following statement USB Function → USB Device in chapter: Features (Page 1) 1. Product Lineup (Page 6) 4. List of Pin Functions (Page 36) 8. Block Diagram (Page 47). Corrected the following statement J-TAG → JTAG in chapter 4. List of Pin Functions (Page 25) Added “Note” about TAP pins in chapter 4. List of Pin Functions (Page 37). Added the Baud rate spec in 12.4.10 CSIO Timing (Page 72-78) Corrected the following statement Analog port input current → Analog port input leak current in chapter 12.5 12-bit A/D Converter (Page 86). Corrected the following statement Comrare clock cycle → Compare clock cycle in chapter 12.5 12-bit A/D Converter (Page 87). Changed the package codes as the following table in chapter: 2. Packages (Page 7) 3. Pin Assignment (Page 8-10)

12.2 Recommended Operating Conditions (Page 57)

1. Ordering Information (Page 101) 15. Package Dimensions (Page 102-104). Before After FPT-100P-M23 LQI100 FPT-120P-M37 LQM120 BGA-112P-M04 LBC112 Added the Part numbers - MB9BF304RBPMC-G-UNE1 in chapter 14. Ordering Information (Page 101). Corrected the Part numbers - MB9BF304NBBGL-G-YE1 → MB9BF304NBBGL-GK6E1 - MB9BF305NBBGL-G-YE1 → MB9BF305NBBGL-GK6E1 - MB9BF306NBBGL-G-YE1 → MB9BF306NBBGL-GK6E1 in chapter 14. Ordering Information (Page 101). Added 16. Errata (Page 105-106) *C 5811601 YSAT 07/13/2017 Adapted new Cypress logo

Document Number: 002-05612 Rev. *D October 23, 2017 Page 111 of 112 MB9B300B Series Revision ECN Orig. of Change Submission Date Description of Change *D HUAL 10/24/2017 Corrected the following Clock frequency MAX value (When not trimming) 5MHz  6MHz in chapter 12.4.3 Built-in CR Oscillation Characteristics. Added the Part numbers in chapter 14. Ordering Information. - MB9BF304NBPMC-G-UNE1 - MB9BF306NBPMC-G-UNE1 Corrected the Part numbers in chapter 14. Ordering Information. - MB9BF306NBPMC-G-JNE2 → MB9BF306NBPMC-G-UNE2 Added the errata 002-06782 contents in chapter 16. Errata. 5942095

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