MACH110-12

MACH110-12 AMD | Alldatasheet

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Publication# 14127 Rev. I Amendment /0 Issue Date: May 1995 Advanced Micro Devices MACH110-12/15/20 High-Density EE CMOS Programmable Logic FINAL COM’L: -12/15/20 IND: -14/18/24 DISTINCTIVE CHARACTERISTICS ■ 44 Pins ■ 32 Macrocells ■ 12 ns tPD Commercial 14 ns tPD Industrial ■ 77 MHz fCNT ■ 38 Inputs ■ 32 Outputs ■ 32 Flip-flops; 2 clock choices ■ 2 “PAL22V16” Blocks ■ Pin-compatible with MACH111, MACH210, MACH211, MACH215 GENERAL DESCRIPTION The MACH110 is a member of AMD’s high-performance EE CMOS MACH 1 family. This device has approxi- mately three times the logic macrocell capability of the popular PAL22V10 without loss of speed. The MACH110 consists of two PAL blocks intercon- nected by a programmable switch matrix. The two PAL blocks are essentially “PAL22V16” structures complete with product-term arrays and programmable macro- cells. The switch matrix connects the PAL blocks to each other and to all input pins, providing a high degree of connectivity between the fully-connected PAL blocks. This allows designs to be placed and routed efficiently. The MACH110 macrocell provides either registered or combinatorial outputs with programmable polarity. If a registered configuration is chosen, the register can be configured as D-type or T-type to help reduce the number of product terms. The register type decision can be made by the designer or by the software. All macrocells can be connected to an I/O cell. If a buried macrocell is desired, the internal feedback path from the macrocell can be used, which frees up the I/O pin for use as an input.

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I/O0 – I/O15 I0 – I1, I3 – I4 I/O Cells Macrocells Switch Matrix Macrocells I/O Cells I/O16 – I/O31 CLK 1/I5, CLK 0/I2 14127I-1 1616 1616 OE OE

CLK/I = Clock or Input GND = Ground I = Input I/O = Input/Output V CC = Supply Voltage Note: Pin-compatible with MACH111, MACH210, MACH211, and MACH215.

MACH110-12/15/20 (Com’l)4

ORDERING INFORMATION

The Valid Combinations table lists configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. AMD programmable logic products for commercial applications are available with several ordering options. The order number (Valid Combination) is formed by a combination of: OPERATING CONDITIONS C = Commercial (0°C to +70°C) FAMILY TYPE MACH = Macro Array CMOS High-Speed SPEED -12 = 12 ns tPD -15 = 15 ns tPD -20 = 20 ns tPD MACH110-12 MACH110-15 MACH110-20 MACH -12 J C Valid Combinations OPTIONAL PROCESSING Blank = Standard Processing 110 DEVICE NUMBER 110 = 32 Macrocells, 44 Pins PACKAGE TYPE J = 44-Pin Plastic Leaded Chip Carrier (PL 044) JC

5MACH110-14/18/25 (Ind) The Valid Combinations table lists configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations. AMD programmable logic products for Industrial applications are available with several ordering options. The order number (Valid Combination) is formed by a combination of: OPERATING CONDITIONS I = Industrial (–40°C to +85°C) FAMILY TYPE MACH = Macro Array CMOS High-Speed SPEED -14 = 14 ns tPD -18 = 18 ns tPD -24 = 24 ns tPD MACH110-14 MACH110-18 JI MACH110-24 MACH -14 I Valid Combinations OPTIONAL PROCESSING Blank = Standard Processing 110 DEVICE NUMBER 110 = 32 Macrocells, 44 Pins J PACKAGE TYPE J = 44-Pin Plastic Leaded Chip Carrier (PL 044)

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be used as dedicated inputs. effectively like an independent “PAL22V16”. bank is allocated two of the output enable product terms. when fitting a design into the device. control the last eight macrocells. Figure 1 for cluster and macrocell numbers. Table 1. Logic Allocation output for use in driving a bus.

Figure 1. MACH110 PAL Block

MACH110-12/15/20 (Com’l)8 ABSOLUTE MAXIMUM RATINGS Ambient Temperature Supply Voltage with DC Output or I/O Latchup Current Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. Pro- gramming conditions may differ. OPERATING RANGES Commercial (C) Devices Ambient Temperature (TA) Supply Voltage (VCC ) Operating ranges define those limits between which the func- tionality of the device is guaranteed. DC CHARACTERISTICS over COMMERCIAL operating ranges unless otherwise specified Parameter Symbol Parameter Description Test Conditions Min Typ Max Unit VOH Output HIGH Voltage I OH = –3.2 mA, VCC = Min 2.4 V VIN = VIH or VIL VOL Output LOW Voltage I OL = 16 mA, VCC = Min 0.5 V VIN = VIH or VIL VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V Voltage for all Inputs (Note 1) VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V Voltage for all Inputs (Note 1) IIH Input HIGH Current V IN = 5.25 V, VCC = Max (Note 2) 10 µA IIL Input LOW Current V IN = 0 V, VCC = Max (Note 2) –10 µA IOZH Off-State Output Leakage V OUT = 5.25 V, VCC = Max 10 µA Current HIGH V IN = VIH or VIL (Note 2) IOZL Off-State Output Leakage V OUT = 0 V, VCC = Max –10 µA Current LOW V IN = VIH or VIL (Note 2) ISC Output Short-Circuit Current VOUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA ICC Supply Current (Typical) V CC = 5 V, TA=25°C, 95 mA f = 25 MHz (Note 4) Notes: 1. These are absolute values with respect to device ground and all overshoots due to system and/or tester noise are included. 2. I/O pin leakage is the worst case of IIL and IOZL (or IIH and IOZH ). 3. Not more than one output should be shorted at a time. Duration of the short-circuit should not exceed one second. VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation. 4. Measured with a 16-bit up/down counter program. This pattern is programmed in each PAL block and is capable of being loaded, enabled, and reset.

9MACH110-12/15/20 (Com’l) CAPACITANCE (Note 1) Parameter Symbol Parameter Description Test Conditions Typ Unit C IN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C6 p F C OUT Output Capacitance V OUT = 2.0 V f = 1 MHz 8 pF SWITCHING CHARACTERISTICS over COMMERCIAL operating ranges (Note 2) Parameter Symbol Parameter Description Min Max Min Max Min Max Unit tPD Input, I/O, or Feedback to Combinatorial 12 15 20 ns Output (Note 3) 71 0 1 3 n s 81 1 1 4 n s t H Hold Time 0 0 0 ns tCO Clock to Output (Note 3) 8 10 12 ns tWL 668 n s tWH 668 n s 66.7 50 40 MHz 62.5 47.6 38.5 MHz f MAX 76.9 66.6 47.6 MHz 71.4 55.5 43.5 MHz No Feedback 1/(t WL + tWH ) 83.3 83.3 62.5 MHz tAR Asynchronous Reset to Registered Output 16 20 25 ns tARW Asynchronous Reset Width (Note 1) 12 15 20 ns tARR Asynchronous Reset Recovery Time (Note 1) 8 10 15 ns tAP Asynchronous Preset to Registered Output 16 20 25 ns tAPW Asynchronous Preset Width (Note 1) 12 15 20 ns tAPR Asynchronous Preset Recovery Time (Note 1) 8 10 15 ns tEA Input, I/O, or Feedback to Output Enable (Note 3) 12 15 20 ns tER Input, I/O, or Feedback to Output Disable (Note 3) 12 15 20 ns Notes: 1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified where capacitance may be affected. 2. See Switching Test Circuit, for test conditions. 3. Parameters measured with 16 outputs switching. Setup Time from Input, I/O, or Feedback to Clock -12 -20 Clock Width D-type T-type D-type T-type LOW HIGH D-type T-type Maximum Frequency (Note 1) External Feedback 1/(t S + tCO ) Internal Feedback (fCNT ) tS -15

MACH110-14/18/20 (Ind)10 ABSOLUTE MAXIMUM RATINGS Ambient Temperature Supply Voltage with DC Output or I/O Latchup Current Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability. Programming conditions may differ. INDUSTRIAL OPERATING RANGES Ambient Temperature (TA) Supply Voltage (VCC) Operating ranges define those limits between which the func- tionality of the device is guaranteed. DC CHARACTERISTICS over INDUSTRIAL operating ranges unless otherwise specified Parameter Symbol Parameter Description Test Conditions Min Typ Max Unit VOH Output HIGH Voltage I OH = –3.2 mA, VCC = Min 2.4 V VIN = VIH or VIL VOL Output LOW Voltage I OL = 16 mA, VCC = Min 0.5 V VIN = VIH or VIL VIH Input HIGH Voltage Guaranteed Input Logical HIGH 2.0 V Voltage for all Inputs (Note 1) VIL Input LOW Voltage Guaranteed Input Logical LOW 0.8 V Voltage for all Inputs (Note 1) IIH Input HIGH Current V IN = 5.25 V, VCC = Max (Note 2) 10 µA IIL Input LOW Current V IN = 0 V, VCC = Max (Note 2) –10 µA IOZH Off-State Output Leakage V OUT = 5.25 V, VCC = Max 10 µA Current HIGH V IN = VIH or VIL (Note 2) IOZL Off-State Output Leakage V OUT = 0 V, VCC = Max –10 µA Current LOW V IN = VIH or VIL (Note 2) ISC Output Short-Circuit Current V OUT = 0.5 V, VCC = Max (Note 3) –30 –160 mA Supply Current (Typical) V CC = 5 V, TA = 25°C, f = 25 MHz (Note 4) 95 mA Notes: 1. These are absolute values with respect to device ground and all overshoots due to system and/or tester noise are included. 2. I/O pin leakage is the worst case of IIL and IOZL (or IIH and IOZH). 3. Not more than one output should be shorted at a time. Duration of the short-circuit should not exceed one second. VOUT = 0.5 V has been chosen to avoid test problems caused by tester ground degradation. 4. Measured with a 16-bit up/down counter pattern. This pattern is programmed in each PAL block and is capable of being loaded, enabled, and reset. ICC

11MACH110-14/18/20 (Ind) CAPACITANCE (Note 1) Parameter Symbol Parameter Description Test Conditions Typ Unit C IN Input Capacitance V IN = 2.0 V VCC = 5.0 V, TA = 25°C6 p F C OUT Output Capacitance V OUT = 2.0 V f = 1 MHz 8 pF SWITCHING CHARACTERISTICS over INDUSTRIAL operating ranges (Note 2) Parameter Symbol Parameter Description Min Max Min Max Min Max Unit tPD Input, I/O, or Feedback to Combinatorial 14.5 18 24 ns Output (Note 3) 8.5 12 16 ns 10 13.5 17 ns tH Hold Time 0 0 0 ns tCO Clock to Output (Note 3) 10 12 14.5 ns tWL 7.5 7.5 10 ns tWH 7.5 7.5 10 ns 53.5 40 32 MHz 50 38 30 MHz fMAX 61.5 53 38 MHz 57 44 34.5 MHz No Feedback 1/(tWL + tWH) 66.5 66.5 50 MHz tAR Asynchronous Reset to Registered Output 19.5 24 30 ns tARW Asynchronous Reset Width (Note 1) 14.5 18 24 ns tARR Asynchronous Reset Recovery Time (Note 1) 10 12 18 ns tAP Asynchronous Preset to Registered Output 19.5 24 30 ns tAPW Asynchronous Preset Width (Note 1) 14.5 18 24 ns tAPR Asynchronous Preset Recovery Time (Note 1) 10 12 18 ns tEA Input, I/O, or Feedback to Output Enable (Note 3) 14.5 18 24 ns tER Input, I/O, or Feedback to Output Disable (Note 3) 14.5 18 24 ns Notes: 1. These parameters are not 100% tested, but are evaluated at initial characterization and at any time the design is modified where capacitance may be affected. 2. See Switching Test Circuit, for test conditions. 3. Parameters measured with 16 outputs switching. Setup Time from Input, I/O, or Feedback to Clock -14 -24 Clock Width D-type T-type D-type T-type LOW HIGH D-type T-type Maximum Frequency (Note 1) External Feedback 1/(t S + tCO) Internal Feedback (fCNT) tS -18

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TYPICAL CURRENT VS. VOLTAGE (I-V) CHARACTERISTICS VCC = 5.0 V, TA = 25°C Input –40 –60 –80 –2 –1 123 Output, HIGH II (mA) VI (V) –20 IOH (mA) VOH (V) –50 –75 –100 –3 –2 –1 123 –25 –125 –150 –100 14127I-4Output, LOW .4 .6 1.0.8 –20 –40 –60 –80 IOL (mA) VOL (V) 14127I-5 14127I-6

TYPICAL ICC CHARACTERISTICS VCC = 5 V, TA = 25°C 14127I-7 MACH110 150 125 100 0 1 02 03 04 0 5 06 07 08 09 0 ICC (mA) Frequency (MHz) The selected “typical” pattern is a 16-bit up/down counter. This pattern is programmed in each PAL block and is capable of being loaded, enabled, and reset. Maximum frequency shown uses internal feedback and a D-type register.

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TYPICAL THERMAL CHARACTERISTICS Measured at 25°C ambient. These parameters are not tested. Parameter Symbol Parameter Description PLCC Unit θjc Thermal impedance, junction to case 14 °C/W θja Thermal impedance, junction to ambient 39 °C/W θjma Thermal impedance, junction to 200 lfpm air 33 °C/W 400 lfpm air 30 °C/W 600 lfpm air 27 °C/W 800 lfpm air 25 °C/W Plastic θjc Considerations The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a constant temperature. Therefore, the measurements can only be used in a similar environment. Typ ambient with air flow

Notes: 1. VT = 1.5 V. 2. Input pulse amplitude 0 V to 3.0 V. 3. Input rise and fall times 2 ns–4 ns typical. tPD Input, I/O, or Feedback Combinatorial Output VT VT Combinatorial Output VT Input, I/O, or Feed- back Registered Output Registered Output tS tCO VT tH VTClock tWH Clock Clock Width tWL VT Combinatorial Output Registered Input (MACH 2 and 4) tSIR tICO VT tHIR VT Input Register Clock Registered Input Latched Output (MACH 2, 3, and 4) Gate Gate Width (MACH 2, 3, and 4) tGWS VT VT VT VT tICS Input Register to Output Register Setup (MACH 2 and 4) Output Register Clock Input Register Clock Registered Input tPDL Input, I/O, or Feedback Latched Out Gate VT tHLtSL tGO VT VT 14127I-8 14127I-9 14127I-10 14127I-11 14127I-12 14127I-13 14127I-14

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Notes: 1. VT = 1.5 V. 2. Input pulse amplitude 0 V to 3.0 V. 3. Input rise and fall times 2 ns–4 ns typical. Latched Input (MACH 2 and 4) Latched Input and Output (MACH 2, 3, and 4) Latched In Output Latch Gate Latched Out tSLL Combinatorial Output Gate tHILtSIL tIGO Latched In tPDLL tIGOL tIGS Input Latch Gate VT VT VT VT VT VT 14127I-15 14127I-16

Input Register Clock Width (MACH 2 and 4) VT tWICL VT VT tARW VT tAR Asynchronous Reset Input, I/O, or Feedback Registered Output Clock tARR Asynchronous Preset Registered Output Clock VT VTOutputs Output Disable/Enable tER tEA VOH - 0.5V VOL + 0.5V Notes: 1. VT = 1.5 V. 2. Input pulse amplitude 0 V to 3.0 V. 3. Input rise and fall times 2 ns–4 ns typical. Input, I/O, or Feedback VT VT Input, I/O, or Feedback tAPW VT tAP tAPR Input Latch Gate Input Latch Gate Width (MACH 2 and 4) tWIGL VT 14127I-17 14127I-18 14127I-19 14127I-20 14127I-21

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KEY TO SWITCHING WAVEFORMS KS000010-PAL Must be Steady May Change from H to L May Change from L to H Does Not Apply Don’t Care, Any Change Permitted Will be Steady Will be Changing from H to L Will be Changing from L to H Changing, State Unknown Center Line is High- Impedance “Off” State WAVEFORM INPUTS OUTPUTS SWITCHING TEST CIRCUIT Measured Specification S 1 C L R 1 R 2 Output Value tPD , tCO Closed 1.5 V tEA Z → H: Open 35 pF 1.5 V Z → L: Closed 300 Ω 390 Ω tER H → Z: Open 5 pF H → Z: VOH – 0.5 V L → Z: Closed L → Z: VOL + 0.5 V Commercial 14127I-22 C L Output R 1 R 2 Test Point 5 V *Switching several outputs simultaneously should be avoided for accurate measurement.

The parameter fMAX is the maximum clock rate at which the device is guaranteed to operate. Because the flexi- bility inherent in programmable logic devices offers a choice of clocked flip-flop designs, fMAX is specified for three types of synchronous designs. The first type of design is a state machine with feedback signals sent off-chip. This external feedback could go back to the device inputs, or to a second device in a multi-chip state machine. The slowest path defining the period is the sum of the clock-to-output time and the in- put setup time for the external signals (t S + tCO ). The re- ciprocal, fMAX , is the maximum frequency with external feedback or in conjunction with an equivalent speed de- vice. This fMAX is designated “fMAX external.” The second type of design is a single-chip state ma- chine with internal feedback only. In this case, flip-flop inputs are defined by the device inputs and flip-flop out- puts. Under these conditions, the period is limited by the internal delay from the flip-flop outputs through the inter- nal feedback and logic to the flip-flop inputs. This f MAX is designated “fMAX internal”. A simple internal counter is a good example of this type of design; therefore, this pa- rameter is sometimes called “fCNT.” The third type of design is a simple data path applica- tion. In this case, input data is presented to the flip-flop and clocked through; no feedback is employed. Under these conditions, the period is limited by the sum of the data setup time and the data hold time (t S + tH ). However, a lower limit for the period of each fMAX type is the mini- mum clock period (tWH + tWL ). Usually, this minimum clock period determines the period for the third fMAX , des- ignated “fMAX no feedback.” For devices with input registers, one additional fMAX pa- rameter is specified: fMAXIR . Because this involves no feedback, it is calculated the same way as fMAX no feed- back. The minimum period will be limited either by the sum of the setup and hold times (tSIR + tHIR) or the sum of the clock widths (tWICL + tWICH ). The clock widths are nor- mally the limiting parameters, so that fMAXIR is specified as 1/(tWICL + tWICH ). Note that if both input and output reg- isters are use in the same path, the overall frequency will be limited by tICS. All frequencies except fMAX internal are calculated from other measured AC parameters. fMAX internal is meas- ured directly. tHIRtSIR LOGIC REGISTER tt CLK (SECOND CHIP) SC O tS fMAX External; 1/(tS + tCO ) LOGIC REGISTER CLK fMAX Internal (fCNT ) LOGIC REGISTER t CLK S fMAX No Feedback; 1/(tS + tH ) or 1/(tWH + tWL ) 14127I-23 LOGICREGISTER CLK fMAXIR ; 1/(tSIR + tHIR) or 1/(tWICL + tWICH )

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The MACH families are manufactured using AMD’s advanced Electrically Erasable process. This technol- ogy uses an EE cell to replace the fuse link used in bipolar parts. As a result, the device can be erased and reprogrammed, a feature which allows 100% testing at the factory. Endurance Characteristics Parameter Symbol Parameter Description Min Units Test Conditions

10 Years Max Storage

20 Years Max Operating

N Max Reprogramming Cycles 100 Cycles Normal Programming Conditions tDR Min Pattern Data Retention Time

INPUT/OUTPUT EQUIVALENT SCHEMATICS Input I/O Preload Circuitry ESD Protection Feedback Input VCC VCC 1 kΩ 100 kΩ VCC VCC 100 kΩ 1 kΩ 14127I-24

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The MACH devices have been designed with the capa- bility to reset during system power-up. Following power- up, all flip-flops will be reset to LOW. The output state will depend on the logic polarity. This feature provides extra flexibility to the designer and is especially valuable in simplifying state machine initialization. A timing dia- gram and parameter table are shown below. Due to the synchronous operation of the power-up reset and the wide range of ways V CC can rise to its steady state, two conditions are required to insure a valid power-up reset. These conditions are: 1. The VCC rise must be monotonic. 2. Following reset, the clock input must not be driven from LOW to HIGH until all applicable input and feedback setup times are met. Parameter Symbol Parameter Descriptions Max Unit tPR Power-Up Reset Time 10 µs tS Input or Feedback Setup Time tWL Clock Width LOW See Switching Characteristics tPR tWL tS 4 V VCC Power Registered Output Clock 14127I-25 Power-Up Reset Waveform

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DEVELOPMENT SYSTEMS (subject to change) For more information on the products listed below, please consult the AMD FusionPLD Catalog. MANUFACTURER SOFTWARE DEVELOPMENT SYSTEMS Advanced Micro Devices, Inc. P.O. Box 3453, MS 1028 Sunnyvale, CA 94088-3543 (800) 222-9323 or (408) 732-2400 Advanced Micro Devices, Inc. P.O. Box 3453, MS 1028 Sunnyvale, CA 94088-3543 (800) 222-9323 or (408) 732-2400 Advanced Micro Devices, Inc. P.O. Box 3453, MS 1028 Sunnyvale, CA 94088-3543 (800) 222-9323 or (408) 732-2400 Advanced Micro Devices, Inc. P.O. Box 3453, MS 1028 Sunnyvale, CA 94088-3543 (800) 222-9323 or (408) 732-2400 Cadence Design Systems

555 River Oaks Pkwy

San Jose, CA 95134 (408) 943-1234 Capilano Computing 960 Quayside Dr., Suite 406 New Westminster, B.C. Canada V3M 6G2 (800) 444-9064 or (604) 552-6200 CINA, Inc. P.O. Box 4872 Mountain View, CA 94040 (415) 940-1723 Data I/O Corporation 10525 Willows Road N.E. P.O. Box 97046 Redmond, WA 98073-9746 (800) 332-8246 or (206) 881-6444 iNt GmbH Busenstrasse 6 D-8033 Martinsried, Munich, Germany (89) 857-6667 ISDATA GmbH Daimlerstr. 51 D7500 Karlsruhe 21 Germany Germany: 0721/75 10 87 Logic Modeling 19500 NW Gibbs Dr. P.O. Box 310 Beaverton, OR 97075 (503) 690-6900 Logical Devices, Inc. 692 S. Military Trail Deerfield Beach, FL 33442 (800) 331-7766 or (305) 428-6868 MACHXL  Software Ver. 2.0 ComposerPIC TM Designer (Requires MACH Fitter) Verilog, LeapFrog, RapidSim Simulators (Models also available from Logic Modeling) Ver. 3.3 LOG/iCTM Software (Requires MACH Fitter) ABEL TM -5 Software (Requires MACH Fitter) SynarioTM Software MacABEL TM Software (Requires SmartPart MACH Fitter) AMD-ABEL Software Data I/O MACH Fitters PROdeveloper/AMD Software PROsynthesis/AMD Software Design Center/AMD Software SmartModel Library SmartCAT Circuit Analyzer PLDSim 90 CUPL TM Software

MANUFACTURER TEST GENERATION SYSTEM Acugen Software, Inc. 427-3 Amherst St., Suite 391 Nashua, NH 03063 (603) 891-1995 iNt GmbH Busenstrasse 6 D-8033 Martinsried, Munich, Germany (87) 857-6667 DEVELOPMENT SYSTEMS (subject to change) (continued) Advanced Micro Devices is not responsible for any information relating to the products of third parties. The inclusion of such information is not a representation nor an endorsement by AMD of these products. ATGEN TM Test Generation Software MultiSIM Interactive Simulator LASAR PLDCheck 90 MANUFACTURER SOFTWARE DEVELOPMENT SYSTEMS Mentor Graphics Corp. 8005 S.W. Boeckman Rd. Wilsonville, OR 97070-7777 (800) 547-3000 or (503) 685-7000 MicroSim Corp.

20 Fairbanks

Irvine, CA 92718 (714) 770-3022 MINC Incorporated

6755 Earl Drive, Suite 200

Colorado Springs, CO 80918 (800) 755-FPGA or (719) 590-1155 OrCAD 3175 N.W. Aloclek Dr. Hillsboro, OR 97124 (503) 690-9881 SUSIE–CAD

10000 Nevada Highway, Suite 201

Boulder City, NV 89005 (702) 293-2271 Teradyne EDA 321 Harrison Ave. Boston, MA 02118 (800) 777-2432 or (617) 422-2793 Viewlogic Systems, Inc.

293 Boston Post Road West

Marlboro, MA 01752 (800) 442-4660 or (508) 480-0881 Programmable Logic Design Tools 386+ Schematic Design Tool 386+ Digital Simulation Tools ViewPLD or PROPLD (Requires PROSim Simulator MACH Fitter) ViewSim Simulator (Models for ViewSim also available from Logic Modeling) PLDesigner TM -XL Software (Requires MACH Fitter) PLDSynthesisTM (Requires MACH Fitter) QuickSim Simulator (Models also available from Logic Modeling) Design Center Software (Requires MACH Fitter) SUSIE TM Simulator

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APPROVED PROGRAMMERS (subject to change) For more information on the products listed below, please consult the AMD FusionPLD Catalog. MANUFACTURER PROGRAMMER CONFIGURATION Advin Systems, Inc. 1050-L East Duane Ave. Sunnyvale, CA 94086 (408) 243-7000 BP Microsystems 100 N. Post Oak Rd. Houston, TX 77055-7237 (800) 225-2102 or (713) 688-4600 Data I/O Corporation 10525 Willows Road N.E. P.O. Box 97046 Redmond, WA 98073-9746 (800) 332-8246 or (206) 881-6444 Logical Devices Inc./Digelec 692 S. Military Trail Deerfield Beach, FL 33442 (800) 331-7766 or (305) 428-6868 SMS North America, Inc.

16522 NE 135th Place

Redmond, WA 98052 (800) 722-4122 or SMS lm Grund 15 D-7988 Vangen Im Allgau, Germany 07522-5018 Stag Microsystems Inc. 1600 Wyatt Dr. Suite 3 Santa Clara, CA 95054 (408) 988-1118 or Stag House Martinfield, Welwyn Garden City Herfordshire UK AL7 1JT 707-332148 System General 510 S. Park Victoria Dr. Milpitas, CA 95035 (408) 263-6667 or 3F, No. 1, Alley 8, Lane 45 Bao Shing Rd., Shin Diau Taipei, Taiwan 2-917-3005 BP1200 Pilot U84 Model 3900 Turpro-1 UniSiteTM AutoSite Stag Quazar Sprint/Expert ALLPRO TM –88 MANUFACTURER PROGRAMMER CONFIGURATION Corelis, Inc.

12607 Hidden Creek Way, Suite H

Cerritos, California 70703 (310) 926-6727 Advanced Micro Devices P.O. Box 3453, MS-1028 Sunnyvale, CA 94088-3453 (800) 222-9323 MACHpro JTAG PROG APPROVED ON-BOARD PROGRAMMERS

PROGRAMMER SOCKET ADAPTERS (subject to change) MANUFACTURER PART NUMBER EDI Corporation P.O. Box 366 Patterson, CA 95363 (209) 892-3270 Emulation Technology 2344 Walsh Ave., Bldg. F Santa Clara, CA 95051 (408) 982-0660 Logical Systems Corp. P.O. Box 6184 Syracuse, NY 13217-6184 (315) 478-0722 Procon Technologies, Inc.

1333 Lawrence Expwy, Suite 207

Santa Clara, CA 95051 (408) 246-4456 Contact Manufacturer Contact Manufacturer Contact Manufacturer Contact Manufacturer

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PHYSICAL DIMENSIONS* PL 044 44-Pin Plastic Leaded Chip Carrier (measured in inches) TOP VIEW SEATING PLANE .685 .695 .650 .656 Pin 1 I.D. .685 .695 .650 .656 .026 .032 .050 REF .042 .056 .062 .083 .013 .021 .590 .630 .500 REF .009 .015 .165 .180 .090 .120 16-038-SQ PL 044 DA78 6-28-94 ae SIDE VIEW *For reference only. BSC is an ANSI standard for Basic Space Centering. Trademarks Copyright  1995 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, MACH, and PAL are registered trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.