LWK63233

LWK63233 LIGITEK | Alldatasheet

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DOC. NO : QW0905-LWK63233 REV. : A DATE : 15 - Dec. - 2006 DATA SHEET LWK63233 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts ROUND TYPE LED LAMPS

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PART NO. LWK63233 Page 1/6 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 60° 100%50%100%75% -60° 25%025%50%75% -30° 30° 4.8 5.8 0.6 4.4 R2.4 2.54TYP 1.0MIN 1.5MAX □0.5TYP 25.0MIN + -

Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. 900550 Typ. Electrostatic Discharge( * ) ESD150 V 0.280.28 YX Chromaticity Coordinates (Typ.) UNIT Ratings WK mW mA100 120 μA -20~ +80 mA30 Page 2/6 Typ.Min. 102 Max. 3.54.0 Forward voltage @20mA(V) Viewing angle 2θ 1/2 (deg) Luminous intensity @20mA(mcd) -30~ +100 SymbolParameter IFP PD Ir Topr Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Forward Current IF COLOR Lens Water Clear White InGaN/GaN Emitted LWK63233 MATERIALPART NO Storage Temperature Tstg Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK63233

0.4000.35 0.3600.35 0.3450.34 0.3850.34 0.3850.34 0.3450.34 0.3300.33 0.3700.33 0.3700.33 0.3300.33 0.3150.32 0.3550.32 0.3550.32 0.3150.32 0.3000.31 0.3400.310.26 0.265 0.26 0.225 0.27 0.240 0.27 0.280 0.27 0.280 0.27 0.240 0.28 0.255 0.28 0.295 0.28 0.295 0.28 0.255 0.29 0.270 0.29 0.310 0.29 0.310 0.29 0.270 0.30 0.285 0.30 0.325 0.30 0.325 0.30 0.285 0.31 0.300 0.31 0.3400.2650.26 0.2250.26 0.2100.25 0.2500.25 0.2500.25 0.2100.25 0.1950.24 0.2350.24 0.2350.24 0.1950.24 0.1800.23 0.2200.23 0.2200.23 0.1800.23 0.1650.22 0.2050.22 0.2050.22 0.1650.22 0.1500.21 0.1900.21 B5A5 C4B4A4 C3B3A3 A2 B2C2 C1B1 YXX Y LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/6 BINBINYBIN . Chromaticity Coordinates Specifications for Bin Grading X . CIE Chromaticity Diagram PART NO. LWK63233

Fig.5 Luminous Spectrum(Ta=25℃) Typical Electro-Optical Characteristics Curve 1.03.04.0 0 1 Intensity Wavelength (nm) 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 WK CHIP SPECTRAL RADIANCE 400500600 100 700800 Page 4/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK63233

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 150 260°C3sec Max 100 5°/sec max 50Preheat 2°/sec max 260° 120° 0° 0 25° Temp(°C) PART NO. LWK63233

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DescriptionTest ConditionTest Item The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard Page 6/6 Reliability Test: The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 PART NO. LWK63233