LFD3H5-65-XX-PF LIGITEK | Alldatasheet
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FOUR DIGIT LED DISPLAY (0.35 Inch) LFD3H5/65-XX-PF LFD3H5/65-XX-PF DATA SHEET 30 - Dec. DOC. NO : QW0905- REV. : C DATE : - 2008 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1/8Page PART NO. Package Dimensions LFD3H5/65-XX-PF Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 10.28(0.4") 9.0(0.35") 8.0 40.0(1.57") 14.0(0.55") 2.54*6=15.24(0.6") ψ0.45 TYP 3.5±0.5 LFD3H5/65-XX-PF LIGITEK 9.0(0.35") DP1 DP2 A B C D E F G DIG.1DIG.2DIG.3DIG.4 PIN NO.1
LFD3H65-XX-PFLFD3H55-XX-PF Page 2/8 Internal Circuit Diagram LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD3H5/65-XX-PF PART NO. G
13 DP2
C B A DIG.1 E F A C B DIG.2 E F G DP1 B A C DIG.3 D 92 F G B E D C A DIG.4 G F E D 12 PIN14: NC 12D E F G DIG.4A C D E B G F 2 9D DIG.3 C D 8 A B DP1 G F E DIG.2 B C A F E DIG.1A B C DP213 G
Common Anode Dig.1 Cathode A Cathode F Common Anode Dig.2 Common Anode Dig.3 Cathode B Common Anode Dig.4 Cathode G Cathode C Cathode DP1 Cathode D Cathode E Common Cathode Dig.1 Anode A Anode F Common Cathode Dig.2 Common Cathode Dig.3 Anode B Common Cathode Dig.4 Anode G Anode C Anode DP1 Anode D Anode E 3/8Page LFD3H65-XX-PFPIN NO.1 LFD3H55-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO.1 Electrical Connection LFD3H5/65-XX-PF PART NO. NO CONNECT Anode DP2 13 Cathode DP2 NO CONNECT1414
Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LFD3H55-XX-PF LFD3H65-XX-PF PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaAlAs Red Emitted CHIP △λ (nm) λP (nm) common cathode or anode 66020 Tstg Topr Max. 2.41.51.8 Min. Typ. 5.07.2 Min. Typ. Electrical Vf(v)Iv(mcd) IV-M 2:1 Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 100 SR Page4/8 Common Anode LFD3H5/65-XX-PF PART NO.
Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip mcdIv λP nm μA nm Unit Vfvolt If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8LFD3H5/65-XX-PF PART NO.
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 6/8LFD3H5/65-XX-PF PART NO.
PART NO.LFD3H5/65-XX-PF Page 7/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25°
60 Seconds Max
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
PART NO.LFD3H5/65-XX-PF 8/8Page DescriptionTest Condition This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Thermal Shock Test High Temperature High Humidity Test Solder Resistance Test Solderability Test Test Item Operating Life Test High Temperature Storage Test Low Temperature Storage Test Reliability Test: