LFD355-61-XX-PF

LFD355-61-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : B DATE : - 200602 - Sep. DATA SHEET LFD355/61-XX-PF LFD355/61-XX-PF FOUR DIGIT LED DISPLAY (0.33 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb

Ø 0.51 TYP Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LFD355/61-XX-PF Package Dimensions PART NO. Page1/8 DIG.1 DP6DP5 DP4 DP3 DP2 DP1 8.4 (0.33") 10.16 (0.4") 7.0 (0.28") 14.0 (0.55') 30.0(1.18") DIG.2 DIG.3 DIG.4 LFD355/61-XX-PF LIGITEK PIN 2.54*9=22.86(0.9") 4.0±0.5 A F G B C D DP E

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LFD355/61-XX-PF DP3 DP1 C DIG. 1 B B DIG. 2 D F E C G11 A DP2191 5DP4DP4 5

119 DP2

A 11 G C E F D DIG. 2B B DIG. 1 C DP1 DP3 B D C A DIG. 3 G F A C B DIG. 4 E G F D E 6 DP5 DP6 1010 DP6 DP5 D F G E DIG. 4B C A F G DIG. 3A C D B

Common Cathode DP3,4 Anode DP5 7 Cathode G Cathode DP5 Common Anode DP3,4 Cathode DP5 Electrical Connection PIN NO.1 PIN NO.1LFD3551-XX-PF Common Cathode Dig.1 LFD3561-XX-PF Common Anode Dig.1 Page 3/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LFD355/61-XX-PF Anode F Anode DP3,4 Anode DP219 Cathode DP2 Anode DP1 Anode E Cathode E18 Cathode DP1 Cathode DP3,4 Cathode F Anode DP2 Cathode DP2 Anode D Cathode D Anode C Cathode C Common Cathode Dig.3 Common Anode Dig.3 Cathode DP6 Anode DP6 Anode DP6 Cathode DP6 Common Cathode Dig.4 Common Anode Dig.4 Common Cathode Dig.2 Common Anode Dig.2

H 40 mW mA mA UNITSymbol IF IFP PD Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) 2:1 IV-MIv(mcd)Vf(v) Electrical Typ.Min. 0.350.2 Typ.Min. 2.11.72.6 Max. Topr Tstg 90697 common cathode or anode λP (nm) (nm) CHIP Emitted Red GaP Material -25 ~ +85 -25 ~ +85 Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PART NO LFD3561-XX-PF LFD3551-XX-PF Storage Temperature Operating Temperature μA10Ir Reverse Current Per Any Chip PART NO.LFD355/61-XX-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only If=20mA Test Condition If=20mA If=20mA If=10mA voltVf Unit nm μA nm λP Iv mcd Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Peak Wavelength Luminous Intensity Per Chip Parameter Test Condition For Each Parameter Symbol Luminous Intensity Matching Ratio IV-M IrVr=5V PART NO.LFD355/61-XX-PF

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/8Page PART NO.LFD355/61-XX-PF

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 25° Temp(°C) 120° 260° 5°/sec max 260°C3sec Max

60 Seconds Max

2°/sec max Time(sec) 100 150 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8 PART NO.LFD355/61-XX-PF

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Solder Resistance Test This test intended to see soldering well performed or not. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 Test Condition 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reliability Test: Test Item Description Reference Standard Page8/8 PART NO.LFD355/61-XX-PF