LWK22842

LWK22842 LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts LWK22842 LWK22842 A - 200819 - Mar. DOC. NO : QW0905- REV. : DATE : DATA SHEET

Radiation Angle(0.5):H 100 Degree/V 125 Degree + - 4.0 25.0MIN 1.0MIN 2.54TYP □0.5 TYP 3.8 6.3 1.5MAX 1/6PageLWK22842PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 25% -60° 100% 75%50% 025% Vertical Axis 125° -30° 100%75%50% 60° Horizontal Axis 100° 30°

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Tstg Storage Temperature PART NO MATERIAL LWK22842 Emitted InGaN/GaN White Lens COLOR IF Forward Current Operating Temperature Reverse Current @5V Power Dissipation Peak Forward Current Duty 1/10@10KHz Topr Ir PD IFP Parameter Symbol -30~ +100 Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Forward voltage @20mA(V) 4.03.5 Max. 900450 Min. Typ. Page 2/6 30 mA -20~ +80 μA 120 100 mA mW WK Ratings UNIT Chromaticity Coordinates X Y 0.280.28 V150ESD Electrostatic Discharge Typ. PART NO. LWK22842 White Diffused Horizontal Axis 100° Vertical Axis 125°

0.4000.35 0.3600.35 0.3450.34 0.3850.34 0.3850.34 0.3450.34 0.3300.33 0.3700.33 0.3700.33 0.3300.33 0.3150.32 0.3550.32 0.3550.32 0.3150.32 0.3000.31 0.3400.310.26 0.265 0.26 0.225 0.27 0.240 0.27 0.280 0.27 0.280 0.27 0.240 0.28 0.255 0.28 0.295 0.28 0.295 0.28 0.255 0.29 0.270 0.29 0.310 0.29 0.310 0.29 0.270 0.30 0.285 0.30 0.325 0.30 0.325 0.30 0.285 0.31 0.300 0.31 0.3400.2650.26 0.2250.26 0.2100.25 0.2500.25 0.2500.25 0.2100.25 0.1950.24 0.2350.24 0.2350.24 0.1950.24 0.1800.23 0.2200.23 0.2200.23 0.1800.23 0.1650.22 0.2050.22 0.2050.22 0.1650.22 0.1500.21 0.1900.21 B5A5 C4B4A4 C3B3A3 A2 B2C2 C1B1 YXX Y LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/6 BINBINYBIN . Chromaticity Coordinates Specifications for Bin Grading X . CIE Chromaticity Diagram PART NO. LWK22842

Fig.5 Luminous Spectrum(Ta=25℃) Typical Electro-Optical Characteristics Curve 1.03.04.0 0 1 Intensity Wavelength (nm) 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 WK CHIP SPECTRAL RADIANCE 400500600 100 700800 Page 4/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK22842

260° Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 2°/sec max 0°0 25° 50Preheat 120° Time(sec) 150100 5°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 260°C3sec Max Temp(°C) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Page 5/6

60 Seconds Max

PART NO. LWK22842

The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Thermal Shock Test (10min) (10min) 2.total 10 cycles 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.

Description

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test: 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition Operating Life Test Test Item Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Page 6/6 PART NO. LWK22842