LWK12243-A-A03

LWK12243-A-A03 LIGITEK | Alldatasheet

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DOC. NO : QW0905-LWK12243/A-A03 REV. : A DATA SHEET LWK12243/A-A03 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts ROUND TYPE LED LAMPS DATE : 23 -Sep. - 2014 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PART NO. LWK12243/A-A03 Page 1/7 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.2±MIN 25.0±MIN + - 3.0 4.0 1.0 □0.5 TYP 1.5MAX 2.54TYP 5.3 30° 60° -30° -60°

Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Electrostatic Discharge( * ) ESD 500 V 0.320.31 UNIT Ratings WK mW mA100 80≤PD≤120 μA -20~ +80 mA30 Page 2/7 Max. 3.03.4 Forward voltage @20mA(V) Viewing angle 2θ 1/2 (deg) -30~ +100 SymbolParameter IFP PD Ir Topr Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Forward Current IF COLOR Lens Water White Emitted LWK12243/A-A03 MATERIALPART NO Storage Temperature Tstg Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK12243/A-A03 Chromaticity Coordinates (Typ.) X Y Typ. InGaN Luminous intensity @20mA(mcd) Min. 5000 Typ. 9500

.Bin Code PART NO. LWK12243/A-A03 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7 A319500 7700 11500 A33 9500 Max. 14000 Min. 6200A29 A32 11500 Group Luminous Intensity(mcd) at 20 mA 77006200A30 5000 14000A34 17000

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page4/7 . Chromaticity Coordinates Specifications for Bin Grading . CIE Chromaticity Diagram PART NO.LWK12243/A-A03 Color Coordinates Measurement allowance is ±0.01. 0.33 0.33 C2 0.32 0.29 0.310 0.32 0.30 0.325 0.29 0.30 0.270 0.285 BIN X Y 0.32 0.32 0.31 0.31 0.340 0.300 0.315 0.355 0.370 0.330 0.315 0.355 0.31 0.31 0.30 0.30 0.325 0.285 0.300 0.340

PART NO. LWK12243/A-A03 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 WK CHIP 1000 100 3.0 2.5 Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000100 2.0 1.5 1.0 0.5 0.0 1015.02.0 Forward Voltage(V) Forward Current(mA) Forward Current(mA) Relative Intensity Normalize @20mA 3.01.2 Fig.3 Forward Voltage vs. Temperature 2.0 1.0 1.5 1.1 0.9 1.0 2.5 Fig.4 Relative Intensity vs. Temperature 408010060 0.0 20406080100-20 -400 0.8 -40-200 Ambient Temperature(℃) Ambient Temperature(℃) Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 0.5 0 1 4.03.01.0 Typical Electro-Optical Characteristics Curve Fig.5 Luminous Spectrum(Ta=25℃) 800700 100 600500400 SPECTRAL RADIANCE Wavelength (nm) Intensity

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 150 260°C3sec Max 100 5°/sec max 50Preheat 2°/sec max 260° 120° 0° 0 25° Temp(°C) PART NO. LWK12243/A-A03

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DescriptionTest ConditionTest Item The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=5mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard Page 7/7 Reliability Test: The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not. 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 PART NO. LWK12243/A-A03