LTD521/2SBKS-XX-PF

LTD521-2SBKS-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : A DATE : - 200620 - Oct. LTD521/2SBKS-XX-PF DATA SHEET TRIPLE DIGIT LED DISPLAY (0.56 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb

Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions PART NO. 14.2 (0.56") 19.0 (0.748") 15.28 (0.602") 4.1±0.5 ψ1.7(0.067") Ø 0.51 TYP PIN NO.1 LTD521/2SBKS-XX-PF LIGITEK C D DP A G E F B 37.6 (1.481") DIG.1 DIG.2 DIG.3 LTD521/2SBKS-XX-PF 8.1 (0.319") Page1/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

28 G 28 G

17 E 17 E

F 12 G DP F DIG.3 DIG.2 23 F A C D B DP G B D E C A DP 23 F DIG.3A C D B DP G B 19D E C DIG.2A DP 3,26 DIG.125 B E F C D A LTD521/2SBKS-XX-PF Internal Circuit Diagram LTD521SBKS-XX-PF PART NO. B 3,26 F E C D DIG.1A LTD522SBKS-XX-PF Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

519 Anode Dig.1 DP Common Cathode Dig.2 Anode Dig.2 B Anode Dig.2 A Anode Dig.2 G Anode Dig.2 F Anode Dig.1 B Anode Dig.1 A Common Cathode Dig.1 Anode Dig.1 F Anode Dig.1 G14 28 12 Anode Dig.3 G Anode Dig.3 C Anode Dig.3 DP Anode Dig.3 E Anode Dig.3 D11 Anode Dig.2 C Anode Dig.2 DP9 Anode Dig.2 E Anode Dig.2 D LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Anode Dig.3 B Anode Dig.3 A Anode Dig.3 F Common Cathode Dig.3 PART NO. PIN NO. Electrical Connection LTD521SBKS-XX-PFPIN NO. Common Cathode Dig.1 Anode Dig.1 C4 Anode Dig.1 E Anode Dig.1 D2 LTD521/2SBKS-XX-PF LTD521SBKS-XX-PF Page3/9

5 Cathode Dig.1 DP Cathode Dig.3 E Cathode Dig.3 D Cathode Dig.3 G Cathode Dig.3 C Cathode Dig.3 DP Cathode Dig.2 E Cathode Dig.2 D Cathode Dig.2 C Cathode Dig.2 DP PIN NO.LTD522SBKS-XX-PF Cathode Dig.1 E Cathode Dig.1 D Common Anode Dig.1 Cathode Dig.1 C4 LTD521/2SBKS-XX-PF Electrical Connection PART NO. 19 Common Anode Dig.2 Cathode Dig.1 B Cathode Dig.1 A Common Anode Dig.1 Cathode Dig.1 F Cathode Dig.1 G Cathode Dig.2 B Cathode Dig.2 A Cathode Dig.2 G Cathode Dig.2 F PIN NO.LTD522SBKS-XX-PF Cathode Dig.3 B Cathode Dig.3 A Cathode Dig.3 F Common Anode Dig.318 Page4/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Iv(mcd) LTD522SBKS-XX-PF Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LTD521SBKS-XX-PF PART NO λD (nm) common cathode or anodeEmitted Blue InGaN/SiC Material CHIP Common Anode Common Cathode Electrical 47526 (nm) 4.23.56.1 Max.Typ. Vf(v) Min. Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Reverse Current Per Any Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Storage Temperature Operating Temperature SymbolParameter Tstg Topr Ir PD IFP IF -25 ~ +85 -25 ~ +85 SBKS 100 120 Ratings 2:110.5 IV-M Typ. UNIT μA mW mA mA Page5/9 Electrostatic Discharge( * ) ESD 500 V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LTD521/2SBKS-XX-PF PART NO.

Test Condition For Each Parameter Luminous Intensity Matching Ratio Parameter Reverse Current Any Chip Dominant Wavelength Spectral Line Half-Width Luminous Intensity Per Chip Forward Voltage Per Chip Test ConditionUnitSymbol IV-M Ir μA Iv λD Vf mcd nm nm volt Vr=5V If=20mA If=20mA If=10mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page6/9LTD521/2SBKS-XX-PF PART NO.

Ambient Temperature(℃) Fig.3 Forward Current vs. Temperature Forward Current@20mA 680 630 530 430 480 480 380 580 Relative Intensity@20mA 1005075 Wavelength (nm) Fig.4 Relative Intensity vs. Wavelength 0.5 1.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) SBK-S CHIP 1.0 Relative Intensity Normalize @20mA Forward Current(mA) 543 0 5 Forward Voltage(V) 0.25 0.75 0.5 3025151020 Fig.2 Relative Intensity vs. Forward Current 1.5 1.25 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page7/9LTD521/2SBKS-XX-PF PART NO.

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C

60 Seconds Max

25° 120° Temp(°C) 260° 50Preheat 2°/sec max 100 5°/sec max 260°C3sec Max 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/9LTD521/2SBKS-XX-PF PART NO.

This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Thermal Shock Test High Temperature High Humidity Test Solder Resistance Test High Temperature Storage Test Low Temperature Storage Test The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Test ConditionTest Item Reliability Test:

Description

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 Reference Standard Page9/9LTD521/2SBKS-XX-PF PART NO.