LTD521-25-XX-PF LIGITEK | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
DOC. NO : QW0905- REV. : A DATE : - 2006 DATA SHEET LTD521/25-XX-PF TRIPLE DIGIT LED DISPLAY (0.56 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 12 - Mar. LTD521/25-XX-PF Lead-Free Parts Pb
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions PART NO. LTD521/25-XX-PF Page1/9 8.1 (0.319") 37.6 (1.481") LTD521/25-XX-PF LIGITEK PIN NO.1 4.1±0.5 14.2 (0.56") DIG.1 DIG.2 19.0 (0.748") ψ1.7(0.067") DIG.3 15.28 (0.602") A B C G F E D DP Ø 0.51 TYP
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page2/9LTD521/25-XX-PF PART NO. DP 19D6 B E G F C D 18 G A DP DIG.3 F E G DIG.2A C B DP 3,26 C E F D B A DIG.1 LTD5215-XX-PF G14 DP DIG.3A D F E C B G DP E F D 19 F DIG.2 B A G DP DIG.1 C D E A B 3,26 LTD5225-XX-PF
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD5215-XX-PFPIN NO. Electrical Connection PIN NO. 3/9PageLTD521/25-XX-PF PART NO. Anode Dig.1 E Anode Dig.1 D Common Cathode Dig.1 Anode Dig.1 C Anode Dig.1 DP Anode Dig.2 E Anode Dig.2 D Anode Dig.2 C Anode Dig.2 DP Anode Dig.3 E Anode Dig.3 D Anode Dig.3 G Anode Dig.3 C Anode Dig.3 DP Anode Dig.3 B Anode Dig.3 A Anode Dig.3 F Common Cathode Dig.3 Common Cathode Dig.2 Anode Dig.2 B Anode Dig.2 A Anode Dig.2 G Anode Dig.2 F Anode Dig.1 B Anode Dig.1 A Common Cathode Dig.1 Anode Dig.1 F Anode Dig.1 G
PART NO.LTD521/25-XX-PF Page 4/9 PIN NO. Electrical Connection PIN NO.LTD5225-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD5225-XX-PF Cathode Dig.1 E Cathode Dig.1 D Common Anode Dig.1 Cathode Dig.1 C Cathode Dig.1 DP Cathode Dig.2 E Cathode Dig.2 D Cathode Dig.2 C Cathode Dig.2 DP Cathode Dig.3 E Cathode Dig.3 D Cathode Dig.3 G Cathode Dig.3 C Cathode Dig.3 DP Cathode Dig.3 B Cathode Dig.3 A Cathode Dig.3 F Common Anode Dig.3 Common Anode Dig.2 Cathode Dig.2 B Cathode Dig.2 A Cathode Dig.2 G Cathode Dig.2 F Cathode Dig.1 B Cathode Dig.1 A Common Anode Dig.1 Cathode Dig.1 F Cathode Dig.1 G
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Part Selection And Application Information(Ratings at 25)℃ λP (nm) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. PART NO LTD5215-XX-PF Emitted Red GaAlAs Material CHIP Common Cathode Common Anode 660 common cathode or anode Storage Temperature Operating Temperature Forward Current Per Chip Reverse Current Per Any Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) PD Topr Tstg Ir Parameter IFP Symbol IF IV-M 2:1 Electrical Vf(v) 201.51.8 (nm) Typ.Min. 4.02.46.1 Iv(mcd) Min.Max. Typ. Ratings mW100 -25 ~ +85 -25 ~ +85 μA 100 SR mA mA UNIT LTD5225-XX-PF 5/9PageLTD521/25-XX-PF PART NO.
Test Condition For Each Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Parameter Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Peak Wavelength Unit volt mcd μA IV-M Ir Iv λp Symbol Vf Vr=5V Test Condition If=20mA If=20mA If=10mA If=20mA nm nm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page6/9LTD521/25-XX-PF PART NO.
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 7/9LTD521/25-XX-PF PART NO.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 260°C3sec Max 5°/sec max 260° 120° Temp(°C) Time(sec) 15050 100 2°/sec max25° Preheat0
60 Seconds Max
LTD521/25-XX-PF PART NO.
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reliability Test: 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test ItemTest Condition JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference StandardDescription 9/9PageLTD521/25-XX-PF PART NO.