LTD511-25-XX-RP65-PF LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TRIPLE DIGIT LED DISPLAY (0.56 Inch) DATA SHEET LTD511/25-XX/RP65-PF DOC. NO : QW0905- REV. : A DATE : - 2008 LTD511/25-XX/RP65-PF-08 03 - Jun. Lead-Free Parts Pb
PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DIG.3 A BG F E DPD C DIG.2DIG.1 PIN 1 LTD511/25-XX/RP65-PF LIGITEK PIN NO.1 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. PIN 6 PIN 7PIN 12 15.24 (0.6") 37.6 (1.48") 2.54X5= 12.7(0.5") Ø 0.51 TYP 14.2 (0.56") ψ1.7(0.067") 19.0 (0.748") 6.5±0.5 8.1 (0.319") PageLTD511/25-XX/RP65-PF 1/8
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only GEFCDAB DP G DPECDFABGEF DP 1411725 103 LTD5125-XX/RP65-PF GEFDCBA DPG DPECDFBAGEF DP 1411725 103 DIG.2DIG.3 DIG.2DIG.3 PART NO. CBA CBA DIG.1 DIG.1 Internal Circuit Diagram D D PageLTD511/25-XX/RP65-PF 2/8
PIN NO. PART NO. Anode E PIN NO. Electrical Connection LTD5115-XX/RP65-PF Cathode D Cathode DP Cathode C Cathode G Cathode B No Connect6 Anode D Anode DP Anode C Anode G Anode B No Connect6 9 Common Cathode Dig.2 Common Cathode Dig.3 Cathode A 11 Anode A11 12 Common Cathode Dig.1 Anode F10 Cathode F 10 Common Anode Dig.1 Common Anode Dig.3 Common Anode Dig.2 LTD5125-XX/RP65-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PageLTD511/25-XX/RP65-PF 3/8
PART NO. Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LTD5115-XX/RP65-PF LTD5125-XX/RP65-PF PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaAlAs Red Emitted CHIP △λ (nm) λP (nm) common cathode or anode 66020 Tstg Topr 1.52.1 Min. Typ. 3.055.0 Min. Typ. Electrical Vf(v)Iv(mcd) IV-M 2:1 Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW50 Red Common Anode LTD511/25-XX/RP65-PF 4/8Page
PART NO. Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip mcdIv λP nm μA nm Unit Vfvolt If=10mA If=20mA If=20mA Test Condition If=10mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD511/25-XX/RP65-PF 5/8Page
PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.5 3.0 10010 Forward Current(mA) 1.5 2.0 0.5 1.0 1.0 0.0 5.0 Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current 1000 Page 3.0 2.0 1.0 1.5 2.5 Fig.4 Relative Intensity vs. Temperature 806020040 0.0 -4080100 Ambient Temperature(℃) -20 Relative Intensity@20mA Normalize @25℃ 0.5 100 750 1000 SR CHIP 3.02.01.0 Forward Voltage(V) 1.0 0.1 Forward Current(mA) 100 1.2 1.1 0.9 1.0 204060-40-200 0.8 Forward Voltage@20mA Normalize @25℃ 700600650 0.0 0.5 Wavelength (nm) Relative Intensity@20mA 1.0 Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage 4.0 LTD511/25-XX/RP65-PF 6/8
PART NO. Page 7/8 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 150 Time(sec) 5°/sec max 2°/sec max 50Preheat 260°C3sec Max 100 Temp(°C) 120° 25° 00° 260° Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C
60 Seconds Max
PART NO. Reference Standard Reliability Test: This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. Operating Life Test High Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test Low Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test ConditionTest Item Description LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 This test intended to see soldering well performed or not. Solder Resistance Test Solderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. LTD511/25-XX/RP65-PF Page8/8