LTD511-21-XX LIGITEK | Alldatasheet

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13 - Feb. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TRIPLE DIGIT LED DISPLAY (0.56 Inch) LTD511/21-XX LTD511/21-XX DATA SHEET DOC. NO : QW0905- REV. : B DATE : - 2006

DIG.2 DIG.3 PART NO. DIG.1 LTD511/21-XX Package Dimensions 37.6 (1.48") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 8.1 (0.319") A B C G F E D DP 2.54X5= 12.7(0.5") 4.2±0.5 PIN NO.1 LTD511/21-XX LIGITEK Ø 0.51 TYP Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted. 2.Specifications are subject to change without notice. ψ1.7(0.067") 14.2 (0.56") 19.0 (0.748") 15.24 (0.6")

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page2/7 DPG DIG.3 DBAC EF DIG.2 BAF DCE G DP G DP 35101247 EFCDBA DIG.3 GEFCAB DIG.2 D DP 101 5372 4 PART NO. Internal Circuit Diagram LTD511/21-XX DP DC FEGA B DIG.1 DPGF ECDA B DIG.1 LTD5121-XX LTD5111-XX

PIN NO. Electrical Connection

1 Anode E

3 Anode DP

2 Anode D

PIN NO. LTD5111-XX No Connect Cathode G Cathode B Cathode F Cathode A

6 No Connect

Common Cathode Dig.1 Common Cathode Dig.2 Common Cathode Dig.3 Common Anode Dig.1 Common Anode Dig.2 Common Anode Dig.3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD5121-XX LTD511/21-XX PART NO.

Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Electrical LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only common cathode or anode λP (nm) (nm) LTD5111-XX LTD5121-XX Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Anode Common Cathode Material GaP GaP Red Red Emitted 69790 69790 1.72.1 2.6 2.1 Typ. 1.7 Min. 2.6 Max. PART NO Storage Temperature Absolute Maximum Ratings at Ta=25 ℃ Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Reverse Current Per Any Chip Power Dissipation Per Chip Operating Temperature Forward Current Per Chip PD40 Tstg Topr CHIP Ir Vf(v) -25 ~ +85 -25 ~ +85 IFP SymbolParameter IF Ratings H 2:10.50.8 0.8 Typ. 0.5 Min. 2:1 mW Iv(mcd) IV-M μA mA mA UNIT Page4/7LTD511/21-XX PART NO.

Test Condition For Each Parameter Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Peak Wavelength Luminous Intensity Per Chip Parameter IV-M Ir μA Vr=5V Test Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Iv λp Symbol Vf nm nm mcd volt Unit If=10mA If=20mA If=20mA If=20mA 5/7PageLTD511/21-XX PART NO.

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/7PageLTD511/21-XX PART NO.

Reliability Test: MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Page7/7LTD511/21-XX PART NO.