LTD435-65-XX-RP38-PF LIGITEK | Alldatasheet
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LTD435/65-XX/RP38-PFDOC. NO : QW0905- REV. : A DATE : - 200817 - Apr. DATA SHEET LTD435/65-XX/RP38-PF TRIPLE DIGIT LED DISPLAY (0.39 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LTD435/65-XX/RP38-PF Package Dimensions PART NO.Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 12.8 (0.504") DIG.3DIG.2 10.0 (0.39") DIG.1 PIN NO.1 3.8±0.5 2.54X7=17.78 (0.7") LTD435/65-XX/RP38-PF LIGITEK 0.45 TYP 30.02 (1.182") 10.16 (0.4") 7.0 (0.276") PIN 1 PIN 8 PIN 15 PIN 11 A B C DPD E F G
F DP G DIG.1B11 DIG.2B C E D A B F DP G D E C DIG.3 A F G DP D E C LTD4355-XX/RP38-PF A F DP G B12 DIG.2B DIG.3C E D A B F DP G D E C A DIG.1 E G DP F D C LTD4365-XX/RP38-PF A LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram Page2/8 PART NO.LTD435/65-XX/RP38-PF
Cathode A,L1 Common Anode L1,L2,L3 Cathode DP Common Anode Dig.3 Cathode B,L2 1414
15 Anode F 15
10 NO Pin
Common Cathode L1,L2,L3 Anode A,L1 NO Pin Anode B,L2 Common Cathode Dig.3 Anode G NO Pin Anode DP Cathode E LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Cathode D Cathode C,L3 Common Anode Dig.2 Common Anode Dig.1 Electrical Connection PIN NO. 1 Common Cathode Dig.1 Common Cathode Dig.2 Anode D Anode C,L3 Anode E LTD4355-XX/RP38-PFPIN NO. Page LTD4365-XX/RP38-PF 3/8 PART NO.LTD435/65-XX/RP38-PF
Part Selection And Application Information(Ratings at 25)℃ LTD4355-XX/RP38-PF LTD4365-XX/RP38-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Anode Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Emitted Red PART NO GaAlAs Material CHIP common cathode or anode λP (nm) Common Cathode 660 Storage Temperature Tstg Min. 2.35 Iv(mcd)△λ (nm) 20 1.5 Min. 2.41.8 Max.Typ. Electrical Vf(v) IV-M 4.0 2:1 Typ. -25 ~ +85 ℃ Absolute Maximum Ratings at Ta=25 ℃ Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Reverse Current Per Any Chip Power Dissipation Per Chip Operating Temperature Ir Topr PD Forward Current Per Chip Parameter IFP IF Symbol -25 ~ +85 100 μA mW 100 Ratings SR mA mA UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only P 4/8Page PART NO.LTD435/65-XX/RP38-PF
Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Forward Voltage Per Chip Peak Wavelength Luminous Intensity Per Chip Parameter IV-M Ir μA nmIf=20mA Vr=5V voltVf Iv λp mcd nm Unit If=20mA If=20mA If=10mA Test Condition Test Condition For Each Parameter LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/8Page PART NO.LTD435/65-XX/RP38-PF
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page6/8 PART NO.LTD435/65-XX/RP38-PF
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 5°/sec max 260°C3sec Max
60 Seconds Max
Temp(°C) 120° 2°/sec max25° 0° 0 Preheat 50 260° Time(sec) 100 150 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Page 7/8 PART NO.LTD435/65-XX/RP38-PF
(10min) (10min) 2.total 10 cycles Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. High Temperature High Humidity Test Thermal Shock Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) Test ConditionTest Item High Temperature Storage Test Low Temperature Storage Test Operating Life Test Reliability Test: Description Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page8/8 PART NO.LTD435/65-XX/RP38-PF