LTD415-64-XX-PF LIGITEK | Alldatasheet
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TRIPLE DIGIT LED DISPLAY (0.4 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 29 - Aug. DOC. NO : QW0905- REV. : B DATE : - 2007 DATA SHEET LTD415/64-XX-PF LTD415/64-XX-PF
B DPD F E G C A Ø 0.51 TYP 12.7 (0.5") 16.0 (0.63") ψ1.2(0.047") 7.0(0.276") DIG.2 10.2 (0.40") LTD415/64-XX-PF LIGITEK DIG.1 2.54X5=12.7 (0.5") PIN NO.1 5.0±0.5 DIG.3 30.1(1.19") 1/8Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD415/64-XX-PF Package Dimensions PART NO. Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
PART NO.LTD415/64-XX-PF Page2/8 8912 Internal Circuit Diagram LTD4154-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DPF G DPF G EDCADP B FD EBA C 1121 107 4 5 G D B CADP DIG.3 FD EBA DIG.2 C 12 1047115 G GFEDB CA GE FDCA B DIG.1 LTD4164-XX-PF DP DP E DIG.1DIG.2 DIG.3
PART NO.LTD415/64-XX-PF 3/8Page Cathode Cathode PIN NO.1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD4164-XX-PF D E Anode Anode D E Electrical Connection PIN NO.1 LTD4154-XX-PF Cathode Cathode Cathode Cathode Cathode Cathode G Common Anode Dig.1 A F Common Anode Dig.2 Common Anode Dig.3 No Connect B C DP Anode Anode Anode G No Connect C DP Anode Anode F B Anode A11 Common Cathode Dig.1 Common Cathode Dig.2 Common Cathode Dig.3
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Min. 1.0 Electrical Part Selection And Application Information(Ratings at 25)℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PART NO LTD4154-XX-PF LTD4164-XX-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode or Anode Common Anode Common Cathode CHIP Material GaAsP/GaP Orange Emitted 635 45 λP (nm) (nm) 2.11.72.6 Vf(v) Typ.Min. Max. Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Reverse Current Per Any Chip Operating Temperature Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Storage Temperature SymbolParameter IFP PD Topr Tstg Ir IF -25 ~ +85 -25 ~ +85 100 120 E Ratings 1.752:1 Typ. Iv(mcd) IV-M UNIT μA mA mW mA Page4/8LTD415/64-XX-PF PART NO.
Test Condition For Each Parameter Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Test ConditionUnitSymbol IV-M Ir μA Iv λp Vf mcd nm nm volt Vr=5V If=10mA If=20mA If=20mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/8Page Peak Wavelength LTD415/64-XX-PF PART NO.
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 E CHIP Page6/8LTD415/64-XX-PF PART NO.
Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Page 7/8 150100 Time(sec) 2.Wave Soldering Profile
500 Preheat
2°/sec max
60 Seconds Max
260° 120° Temp(°C) 25° LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 260°C3sec Max 5°/sec max LTD415/64-XX-PF PART NO.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test ConditionTest Item Reliability Test: High Temperature Storage Test Low Temperature Storage Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. LTD415/64-XX-PF PART NO.