LTD385-62-XX-RP75-PF

LTD385-62-XX-RP75-PF LIGITEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

28 - Dec. TRIPLE DIGIT LED DISPLAY (0.3 Inch) LTD385/62-XX/RP75-PF LTD385/62-XX/RP75-PF DATA SHEET DOC. NO : QW0905- REV. : A DATE : - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

PIN NO.1 ψ1.0(0.039") 7.5±0.5 22.5(0.886") LIGITEK ψ 0.51 TYP 2.54X5=12.7 (0.5") 7.62 (0.3") LTD385/62-XX/RP75-PF 7.2(0.283") 13.9 (0.547") 11.2 (0.441") A E D DP C F BG LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1/8Page PART NO.LTD385/62-XX/RP75-PF Package Dimensions Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.

D D DIG.1 AB C CBA DIG.1 11710 241 35 LTD3862-XX/RP75-PF B DIG.2 DPFE G A FDC E G DP DIG.3 DBA C E FG DP 117 10124 35 B DIG.2 ADPGFE DPGCDEF GCDEABF DIG.3 DP LTD385/62-XX/RP75-PF PART NO. Page2/8 Internal Circuit Diagram LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

Common Anode Dig.1 Common Cathode Dig.1 Common Anode Dig.2 Common Cathode Dig.2 Cathode G Cathode C Anode G Anode C Cathode E Anode E Cathode D Anode D LTD385/62-XX/RP75-PF PART NO. Cathode B7 Anode B7 Cathode DP3 Anode DP3 3/8Page PIN NO.

6 No Connect

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Common Cathode Dig.3 Common Anode Dig.38 Electrical Connection PIN NO.

Reverse Current Per Any Chip Ir 10 μA Operating Temperature Storage Temperature LTD3852-XX/RP75-PF LTD3862-XX/RP75-PF PART NO Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Cathode -25 ~ +85 -25 ~ +85 Material GaP Green Emitted CHIP △λ (nm) λP (nm) common cathode or anode 56530 Tstg Topr Max. 2.61.72.1 Min. Typ. 1.01.75 Min. Typ. Electrical Vf(v)Iv(mcd) IV-M 2:1 Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Forward Current Per Chip Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter PD IFP IF Symbol UNIT mA mA mW100 120 G Page4/8 Common Anode LTD385/62-XX/RP75-PF PART NO.

Vr=5VIr IV-M Luminous Intensity Matching Ratio Symbol Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Peak Wavelength Forward Voltage Per Chip Spectral Line Half-Width Reverse Current Any Chip mcdIv λP nm μA nm Unit Vf volt If=10mA If=20mA If=20mA Test Condition If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8LTD385/62-XX/RP75-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 6/8LTD385/62-XX/RP75-PF PART NO.

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

25° 120° Temp(°C) 260° 50Preheat 2°/sec max 100 5°/sec max 260°C3sec Max 150 Time(sec) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8LTD385/62-XX/RP75-PF PART NO.

MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

Description

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Item Operating Life Test Reliability Test: Test Condition 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Thermal Shock Test Solder Resistance Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec LTD385/62-XX/RP75-PF PART NO.