LTD315/62V-XX/RP12-PF

LTD315-62V-XX-RP12-PF LIGITEK | Alldatasheet

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TRIPLE DIGIT LED DISPLAY (0.36 Inch) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : QW0905- REV. : A DATE : - 2007 DATA SHEET LTD315/62V-XX/RP12-PF 13 - Mar. LTD315/62V-XX/RP12-PF Lead-Free Parts Pb

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions PART NO. A C G E F D DP B DIG.2DIG.1 PIN NO.1 LTD315/62V-XX/RP12-PF LIGITEK Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. DIG.3 14.0 (0.551") 10.16 (0.4") 9.14 (0.36") 2.54X5= 12.7(0.5") 12.0±0.5Ø 0.51 TYP ψ1.0 22.5 (0.886") LTD315/62V-XX/RP12-PF 7.25 (0.283") Page1/8

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DPFG DPFG EDCADPB FDEBAC 1121 107 4 5 G D BCADP DIG.3 FD EBA DIG.2 C 12 1047115 G GFEDBCA GEFDCAB DIG.1 LTD3162V-XX/RP12-PF DP DP E DIG.1DIG.2DIG.3 PART NO. 2/8LTD315/62V-XX/RP12-PF Page

PIN NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD3162V-XX/RP12-PF Anode Anode PART NO. Electrical Connection PIN NO.LTD3152V-XX/RP12-PF Cathode Cathode Cathode Cathode Cathode Cathode Common Anode Dig.1 Common Anode Dig.2 Common Anode Dig.3 No Connect Anode Anode Anode No Connect Anode Anode Anode 11 Common Cathode Dig.1 Common Cathode Dig.2 Common Cathode Dig.3 GG A F B F A B LTD315/62V-XX/RP12-PF C DP D E DP C E D Page3/8

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ LTD3162V-XX/RP12-PF LTD3152V-XX/RP12-PF PART NO GaP Green Material Emitted CHIP Electrical Max. 565302.12.6 1.7 (nm) λP (nm) Min. Typ. Vf(v) 2:11.352.35 IV-M Min. Typ. Iv(mcd) Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PD Ir Tstg Topr IF Symbol IFP Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Reverse Current Per Any Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Storage Temperature Operating Temperature Parameter mA30 -25 ~ +85 -25 ~ +85 100 120 mW μA mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only VG Ratings Page4/8 UNIT LTD315/62V-XX/RP12-PF PART NO.

Test Condition For Each Parameter Luminous Intensity Per Chip Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Peak Wavelength Forward Voltage Per Chip Parameter Test Condition IV-M Ir μA nm λp Iv Vf Symbol mcd nm volt Unit If=20mA Vr=5V If=10mA If=20mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/8PageLTD315/62V-XX/RP12-PF PART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 VG CHIP 3.5 Page6/8LTD315/62V-XX/RP12-PF PART NO.

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 25° 120° Temp(°C) 260° 50Preheat 2°/sec max 100 5°/sec max 260°C3sec Max 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/8

60 Seconds Max

LTD315/62V-XX/RP12-PF PART NO.

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Test Item Operating Life Test High Temperature Storage Test Low Temperature Storage Test Reliability Test: Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.

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