LTD315-62-XX-PF

LTD315-62-XX-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : A DATE : - 200710 - Mar. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TRIPLE DIGIT LED DISPLAY (0.36 Inch) Lead-Free Parts Pb

14.0 (0.551") 10.16 (0.4") DIG.3 6.1±0.5 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. ψ1.0 LTD315/62-XX-PF LIGITEK Ø 0.51 TYP 2.54X5= 12.7(0.5") PIN NO.1 DIG.1 9.14 (0.36") DIG.2 B DPD F E G C A 22.5 (0.886") PART NO. Package Dimensions LTD315/62-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 7.25 (0.283") Page1/8

LTD315/62-XX-PF PART NO. DIG.3DIG.2DIG.1 E DP DP LTD3162-XX-PF DIG.1 BA C D FE G A CB D E F G G 5117 4 1021 C DIG.2 A B E D F DIG.3 DP A CB D G 54710 1211 CA B ED F BDP A C DE GF DP GF DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD3152-XX-PF Internal Circuit Diagram 1298 2/8Page

Common Cathode Dig.3 Common Cathode Dig.2 Common Cathode Dig.1

11 A Anode

B F Anode Anode DP C No Connect G Anode Anode Anode DP C B No Connect Common Anode Dig.3 Common Anode Dig.2 F A Common Anode Dig.1 G Cathode Cathode Cathode Cathode Cathode Cathode LTD3152-XX-PFPIN NO. Electrical Connection PART NO. E D Anode Anode E D LTD3162-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO. Cathode Cathode Page3/8LTD315/62-XX-PF

30IF Forward Current Per Chip LTD3162-XX-PF LTD3152-XX-PF Operating Temperature Storage Temperature Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Reverse Current Per Any Chip Power Dissipation Per Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ PART NO Part Selection And Application Information(Ratings at 25)℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Common Anode CHIP Material GaP Emitted Green common cathode or anode Common Cathode 565 λP (nm) Ir Tstg Topr PD IFP 2.6 Max. Electrical 1.7 Min. (nm) Typ. 2.1 Vf(v) Typ. Iv(mcd) Min. 1.02.02:1 IV-M -25 ~ +85 -25 ~ +85 100 120 μA mW mA mA Parameter Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Symbol Ratings G UNIT Page PART NO.LTD315/62-XX-PF

If=20mAvoltVf Forward Voltage Per Chip Peak Wavelength Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Luminous Intensity Per Chip Ir IV-M λp Iv If=20mA If=20mA If=10mA Vr=5VμA nm nm mcd LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter Test Condition For Each Parameter Symbol Test ConditionUnit Page5/8 PART NO.LTD315/62-XX-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity @20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 6/8 PART NO.LTD315/62-XX-PF

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25° Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO.LTD315/62-XX-PF

Description

The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard Reliability Test: Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test PART NO.LTD315/62-XX-PF