LTD315-61-XX-PF

LTD315-61-XX-PF LIGITEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

DOC. NO : QW0905- REV. : A DATE : - 200710 - Mar. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TRIPLE DIGIT LED DISPLAY (0.36 Inch) Lead-Free Parts Pb

14.0 (0.551") 10.16 (0.4") DIG.3 6.1±0.5 Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. ψ1.0 LTD315/61-XX-PF LIGITEK Ø 0.51 TYP 2.54X5= 12.7(0.5") PIN NO.1 DIG.1 9.14 (0.36") DIG.2 B DPD F E G C A 22.5 (0.886") PART NO. Package Dimensions LTD315/61-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 7.25 (0.283") Page1/8

LTD315/61-XX-PF PART NO. DIG.3DIG.2DIG.1 E DP DP LTD3161-XX-PF DIG.1 BA C D FE G A CB D E F G G 5117 4 1021 C DIG.2 A B E D F DIG.3 DP A CB D G 547 101211 CA B ED F BDP A C DE GF DP GF DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LTD3151-XX-PF Internal Circuit Diagram 1298 2/8Page

Common Cathode Dig.3 Common Cathode Dig.2 Common Cathode Dig.1

11 A Anode

B F Anode Anode DP C No Connect G Anode Anode Anode DP C B No Connect Common Anode Dig.3 Common Anode Dig.2 F A Common Anode Dig.1 G Cathode Cathode Cathode Cathode Cathode Cathode LTD3151-XX-PFPIN NO. Electrical Connection PART NO. E D Anode Anode E D LTD3161-XX-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO. Cathode Cathode Page 3/8LTD315/61-XX-PF

Iv(mcd) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25)℃ LTD3161-XX-PF LTD3151-XX-PF PART NO λP (nm) common cathode or anode Red Emitted GaP Material CHIP Common Cathode Common Anode Electrical 1.7 Min. 90697 (nm) 2.62.10.2 Max.Typ. Vf(v) Min. Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Absolute Maximum Ratings at Ta=25 ℃ Forward Current Per Chip Power Dissipation Per Chip Reverse Current Per Any Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Storage Temperature Operating Temperature SymbolParameter Tstg Topr Ir PD IFP IF -25 ~ +85 -25 ~ +85 H Ratings 2:10.5 IV-M Typ. UNIT μA mW mA mA Page4/8LTD315/61-XX-PF PART NO.

Test Condition For Each Parameter Parameter Luminous Intensity Per Chip Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio Peak Wavelength Forward Voltage Per Chip Test ConditionSymbol Unit IV-M Ir μA Iv λp Vf mcd nm nm volt Vr=5V If=10mA If=20mA If=20mA If=20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/8PageLTD315/61-XX-PF PART NO.

Relative Intensity@20mA 600 0.0 0.5 Wavelength (nm) 700800900 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -20 Ambient Temperature(℃) 806040200-40 100 0.0 806002040100 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1.0 1000 H CHIP Relative Intensity Normalize @20mA Forward Voltage(V) 0.0 1.5 1.0 0.5 2.0 2.5 Forward Current(mA) 101001000 Fig.2 Relative Intensity vs. Forward Current 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1000 6/8PageLTD315/61-XX-PF PART NO.

60 Seconds Max

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25° Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 °C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LTD315/61-XX-PF PART NO.

Description

The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Condition 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard Reliability Test: Low Temperature Storage Test High Temperature Storage Test Operating Life Test Test Item The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test Solder Resistance Test High Temperature High Humidity Test Thermal Shock Test LTD315/61-XX-PF PART NO.