LTD205-62-XX-S1-PF LIGITEK | Alldatasheet
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P Lead-Free Parts Pb LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET LTD205/62-XX/S1-PF LTD205/62-XX/S1-PF TRIPLE DIGIT LED DISPLAY (0.28 Inch) DOC. NO : QW0905- REV. : A DATE : - 200704 - Sep.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 6.1(0.24") DIG.3DIG.2 DIG.1 22.6(0.89") Package Dimensions PART NO. A LTD205/62-XX/S1-PF LIGITEK ψ0.85(0.033") E G D DP C B PIN NO.1 2.54X7=17.78 (0.7") F Ø 0.45 TYP 3.5±0.5 7.62 (0.3") 7.0 (0.28") 10.0 (0.394") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. PIN 1 PIN 8 PIN 16 PIN 9
PART NO.LTD205/62-XX/S1-PFPage2/8 A C D B DIG.1 15A D C DIG.1B LTD2052-XX/S1-PF Internal Circuit Diagram LTD2062-XX/S1-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only G F A DP D C F G B DIG.2 A D C DIG.3B F G DP E 8 DP F A DP D C F G E 5 DIG.2B A D C DIG.3B F G DP E 8 DP
1 E 21 2E
PART NO.LTD205/62-XX/S1-PF 3/8Page
1 Cathode D
4 Cathode E
Common Anode Dig.2 Common Anode Dig.1 Cathode G Cathode C.L3 Nc Common Anode Dig.3
10 No Pin
12 Cathode B,L2
11 No Pin
14 No Pin
16 Cathode F
Cathode A,L115
13 Common Anode L1,L2,L3
PIN NO.LTD2052-XX/S1-PF Electrical Connection Anode DP3 Anode E4 Common Cathode Dig.1 Common Cathode Dig.2 Anode G Nc9 8 Common Cathode Dig.3 Anode C,L3 No Pin10 No Pin11 Anode B,L2 No Pin14 Anode F16
15 Anode A,L1
13 Common Cathode L1,L2,L3
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO.
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Part Selection And Application Information(Ratings at 25)℃ λP (nm) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. PART NO LTD2052-XX/S1-PF Emitted Green GaP Material CHIP Common Cathode Common Anode 565 common cathode or anode Storage Temperature Operating Temperature Forward Current Per Chip Reverse Current Per Any Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) PD Topr Tstg Ir Parameter IFP Symbol IF P IV-M 2:1 Electrical Vf(v) 301.72.1 (nm) Typ.Min. 3.052.65.0 Iv(mcd) Min.Max. Typ. Ratings mW100 -25 ~ +85 -25 ~ +85 μA 120 G mA mA UNIT Page 4/8 LTD2062-XX/S1-PF PART NO.LTD205/62-XX/S1-PF
Test Condition For Each Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Parameter Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Peak Wavelength Unit volt mcd μA IV-M Ir Iv λp Symbol Vf Vr=5V Test Condition If=20mA If=20mA If=10mA If=20mA nm nm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/8Page PART NO.LTD205/62-XX/S1-PF
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP Fig.6 Directive Radiation 6/8 PART NO.LTD205/62-XX/S1-PF
LTD205/62-XX/S1-PF PART NO.
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time(sec) 150 260°C3sec Max 5°/sec max 100 2°/sec max Preheat 50 260° Temp(°C) 120° 25° Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LTD205/62-XX/S1-PF PART NO. 8/8Page Reference StandardTest Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
Description
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Thermal Shock Test High Temperature High Humidity Test Operating Life Test Reliability Test: Low Temperature Storage Test High Temperature Storage Test Test Item MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not.Solderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1