LTD205-62-XX-S1 LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET LTD205/62-XX/S1 LTD205/62-XX/S1DOC. NO : QW0905- REV. : A DATE : - 200423 - Dec TRIPLE DIGIT LED DISPLAY (0.28 Inch)
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. A D DP F E G C B Package Dimensions LTD205/62-XX/S1 PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 6.1(0.24") 7.62 (0.3") 22.6(0.89") LTD205/62-XX/S1 LIGITEK 2.54X7=17.78 (0.7") □0.45 TYP PIN NO.1 7.0 (0.28") L2 3.5±0.5 ψ0.85(0.033") 10.0 (0.394") DIG.1 DIG.2 DIG.3
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Internal Circuit Diagram PART NO. Page 2/7LTD205/62-XX/S1 DIG.3 L2 13 D C F G E DP DP7 F DP G B A A B D C DIG.2 B DIG.1 C D G F E 2 A D D DP E F G DIG.3 C B A E F DP G LSD2052-XX/S1 D DIG.2 A B C DP E G F DIG.1 C B A
PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/7LTD205/62-XX/S1 Nc9 No Pin10 No Pin14 PIN NO.LTD2052-XX/S1 Common Cathode Dig.1 Anode D1 PIN NO. Common Cathode L1,L2,L3 No Pin11 LTD2062-XX/S1 Cathode E Cathode DP Cathode G Cathode C.L3 Common Anode Dig.2 Common Anode Dig.3 Cathode B,L2 Cathode A,L1 Cathode F16 No Pin10 No Pin
11 No Pin
Common Anode Dig.12 Common Anode L1,L2,L3 Common Cathode Dig.2 Common Cathode Dig.3 Anode DP Anode E Anode C,L3 Anode G Anode B,L2 Anode A,L1 Anode F
Solder Temperature 1-16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Part Selection And Application Information(Ratings at 25 )℃ λP (nm) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. PART NO LTD2052-XX/S1 Emitted Green GaP Material CHIP Common Cathode Common Anode 565 common cathode or anode Storage Temperature Operating Temperature Forward Current Per Chip Reverse Current Per Any Chip Power Dissipation Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) PD Topr Tstg Ir Parameter IFP Symbol IF PART NO. P IV-M 2:1 Electrical Vf(v) 30 1.7 2.1 (nm) Typ.Min. 3.052.6 5.0 Iv(mcd) Min.Max. Typ. Ratings mW100 -25 ~ +85 -25 ~ +85 μA 120 G mA mA UNIT Page 4/7LTD205/62-XX/S1 LTD2062-XX/S1
Test Condition For Each Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Parameter Luminous Intensity Matching Ratio Reverse Current Any Chip Spectral Line Half-Width Peak Wavelength PART NO. Unit volt mcd μA IV-M Ir Iv λp Symbol Vf Vr=5V Test Condition If=20mA If=20mA If=10mA If=20mA nm nm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5/7PageLTD205/62-XX/S1
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. Fig.6 Directive Radiation 6/7LTD205/62-XX/S1
Reliability Test: Solderability Test Solder Resistance Test Test Item Low Temperature Storage Test Thermal Shock Test High Temperature High Humidity Test High Temperature Storage Test Operating Life Test PART NO. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Reference StandardDescriptionTest Condition This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/7LTD205/62-XX/S1