LSSD205/6DGL-XX

LSSD205-6DGL-XX LIGITEK | Alldatasheet

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SINGLE DIGIT SMD DISPLAY(0.28") DOC. NO : QW0905-LSSD205/6DGL-XX REV. : A DATE : 16 - Jun. - 2009 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSSD205/6DGL-XX DATA SHEET Lead-Free Parts Pb 發行 DCC 立碁電子

PART NO. LSSD205/6DGL-XX Package Dimensions Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions Note : The tolerances unless mentioned is ±0.1mm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/9 7.0 (0.28") 7.5(0.295") ψ0.9(0.035") 10.8 (0.425") 10.0 (0.394") DP 8.5 12.7 1.27X6=7.62 1.0 2.1 R0.4 1.27X5=6.35 (0.25") 3.75(0.148") F D E C G B A 0.6(0.024") 0.98(0.039") 1.0 (0.039")

3,10 11 12 42 5 B A DC E 791 DPF G LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSSD205DGL-XX 1211 542 B A 3,10 DC E 179 DPF G Page 2/9 PART NO. LSSD205/6DGL-XX

8 N c

PIN NO.

12 Cathode B

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PIN NO. Cathode D Common Anode Cathode F Nc No Pin Cathode G Cathode E LSSD206DGL-XX Common Anode Cathode DP Cathode C PART NO. LSSD205/6DGL-XX

Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Part Selection And Application Information(Ratings at 25 )℃ Page 4/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGL-XX IV-M mW mA mA μA UNIT Vf(v) IV(mcd)△λ (nm) common cathode or anode λD (nm)PART NO Emitted Green InGaN/SiC LSSD206DGL-XX LSSD205DGL-XX Material 32505 Common Anode Common Cathode 434.0 21.53.5 Max.Typ. Min. Typ. CHIP Operating Temperature Storage Temperature Electrical Tstg Topr -25 ~ +85 -25 ~ +85 Power Dissipation Per Chip Electrostatic Discharge Reverse Current Per Chip @5V Forward Current Per Chip Peak Forward Current Per Chip Duty 1/10@10KHz Parameter 80PD IF ESD Ir IFP 500 100 Symbol Ratings 2:1 V

Luminous Intensity Matching Ratio Test Condition For Each Parameter Luminous Intensity Per Chip Reverse Current Any Chip Dominant Wavelegth Spectral Line Half-Width Forward Voltage Per Chip Parameter Page 5/9 nm nm μA Unit mcd volt IV-M Ir Symbol Iv λD Vf Vr=5V If=20mA If=20mA If=10mA If=20mA Test Condition LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/6DGL-XX

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 DGL CHIP Page 6/9 450 0.0 0.5 1.0 500 550 600 PART NO. LSSD205/6DGL-XX

330±2.0 13.5±0.5 2.5±0.2 BIN/HUE : Y LOT NO. : GS1-960032 PART NO. : LSSD205DGL-20 Q'TY(PCS) : 1300 PCS 立碁電子工業股份有限公司 L I GI T E K E L ECT RONI C S C O . , L T D . 99.5±1.5 28.6±0.5 24±0.5 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. Package Dimensions 1300PCS / REEL PART NO. LSSD205/6DGL-XX Carrier Type Dimensions 7/9Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 11.124.0±0.3 11.5 12.0 7.8 4.15 2.0±0.2 1.75 4.0 1.5 0.3

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time 200 60 sec Max Reflow Soldering should not be done more than two times. 120 sec Max 180 Above 220°C 10 sec Max Preheat 1.Hand Solder : Soldering Iron:30W Max Temperature 280°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2. PB-Free Reflow Solder Temp. (℃) 220 260 260°C/10 sec Max rise +5°c/sec cooling -5°c/sec Recommended Soldering Conditions PART NO. LSSD205/6DGL-XX

1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface Environmental Test 1.T=260°C Max. 10sec.Max. 2. 6 Min 1.105 30mins 5mins 30mins 5mins

2.10 Cyeles

1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Endurance Test (10min) (10min) 2.total 300 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=1000hrs ±2hrs Thermal Shock Test High Temperature High Humidity Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) High Temperature Storage Test Low Temperature Storage Test Operating Life Test Classification Reliability Test: PART NO. LSSD205/6DGL-XX Test Item Test Condition Page 9/9