LSSD205-63H-XX LIGITEK | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
DOC. NO : QW0905-LSSD205/63H-XX REV. : A DATE : 18 - Jun. - 2009 DATA SHEET LSSD205/63H-XX SINGLE DIGIT SMD DISPLAY(0.28") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb 發行 DCC 立碁電子
7.5(0.295") 7.0 (0.28") Note : The tolerances unless mentioned is ±0.1mm Recommended Soldering Pad Dimensions Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions PART NO. LSSD205/63H-XX DP ψ0.9(0.035") 10.0 (0.394") 10.8 (0.425") 8.5 12.7 1.27X6=7.62 1.0 2.1 R0.4 (0.25") BF E D C G A 0.6(0.024") 0.98(0.039") 1.0 (0.039") Page 1/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
3,10 C A B D E 2 4511 12 DPGF 9 7 1 LSSD2053H-XX C AB ED 3,10 Internal Circuit Diagram DPGF Page 2/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/63H-XX
11 Anode A
12 Anode B
12 Cathode B
9 Cathode F
PIN NO. Anode C Common Cathode Anode D LSSD2053H-XX Anode DP Electrical Connection Common Anode LSSD2063H-XX Cathode C2 Cathode D PIN NO.
1 Cathode DP
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/63H-XX
Part Selection And Application Information(Ratings at 25 )℃ common cathode or anode Common Anode Common Cathode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSSD2063H-XX LSSD2053H-XX AIGaInP Yellow PART NO CHIP Material Emitted 15595 2.6 1.7 (nm) λD (nm) Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PD Power Dissipation Per Chip Topr Operating Temperature Storage Temperature Tstg Electrostatic Discharge Reverse Current Per Chip @5V Forward Current Per Chip Peak Forward Current Per Chip Duty 1/10@10KHz ESD Ir I F IFP Parameter Symbol 78 mW -25 ~ +85 ℃ -25 ~ +85 ℃ 2000 V μA mA mA Ratings UNIT Page 4/9 IV(mcd) Min. Electrical 10.5 Vf(v) Max.Min. 21.5 2:1 IV-M Typ. PART NO. LSSD205/63H-XX
Test Condition For Each Parameter IV-M Luminous Intensity Matching Ratio Reverse Current Any Chip Forward Voltage Per Chip Spectral Line Half-Width Dominant Wavelegth Luminous Intensity Per Chip Parameter nmλD nm μAIr mcd volt Iv Vf If=20mA Vr=5V If=20mA If=10mA If=20mA Test ConditionUnit Page 5/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSSD205/63H-XX
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 0.0 0.5 1.0 1.5 2.0 2.5 3.0 80 100 0.8 0.9 -20-40 402008 0 1 0 0 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 HY CHIP Page6/9 PART NO. LSSD205/63H-XX
28.6±0.5 13.5±0.5 2.5±0.2 LOT NO. : GS1-960038 BIN/HUE : U Q'TY(PCS) : 1300 PCS PART NO. : LSSD2053H-20 立碁電子工業股份有限公司 L I GI T E K E L ECT RONI C S C O . , L T D . 330±2.099.5±1.5 24±0.5 11.124.0±0.3 11.5 Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. 1300PCS / REEL Package Dimensions 12.0 4.15 7.8 2.0±0.2 Carrier Type Dimensions 1.751.54.0 0.3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page7/9 PART NO. LSSD205/63H-XX
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Time 60 sec Max Reflow Soldering should not be done more than two times. 120 sec Max 180 Above 220°C 10 sec Max Preheat 1.Hand Solder : Soldering Iron:30W Max Temperature 280°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2. PB-Free Reflow Solder Temp. (℃) 200 220 260 260°C/10 sec Max rise +5°c/sec cooling -5°c/sec Recommended Soldering Conditions PART NO. LSSD205/63H-XX
1.T.Sol=235 ℃±5℃ 2.Immersion time 2 ±0.5sec 3.Coverage ≧95% of the dipped surface Environmental Test 1.T=260°C Max. 10sec.Max. 2. 6 Min 30mins 5mins 30mins 5mins
2.10 Cyeles
1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=10mA 3.t=1000 hrs (-24hrs, + 72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Operating Life Test Endurance Test (10min) (10min) 2.total 300 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=1000hrs ±2hrs Thermal Shock Test Solderability Test High Temperature High Humidity Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) Low Temperature Storage Test High Temperature Storage Test Classification Reliability Test: Test Item Test Condition Page 9/9 PART NO. LSSD205/63H-XX