LSRVG2092-PF

LSRVG2092-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS LSRVG2092-PF DATA SHEET - 2008 A 16 - Jun. DOC. NO : QW0905- REV. : DATE : LSRVG2092-PF Pb Lead-Free Parts

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LSRVG2092-PF Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 18.0MIN 1 2 3 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED 2.54TYP2.54TYP 2.0MIN 2.0MIN 5.2 6.7±0.5 4.2 VG □0.5 TYP 1.5 MAX SR 4.03.0 -60° -30° 30° 60°

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Ratings PART NO. Absolute Maximum Ratings at Ta=25 ℃ 100 120 μA mW mA100 100 IFP Ir PD Topr Tstg -40 ~ +85 -40 ~ +100 Viewing angle 2θ 1/2 (deg) Typ.Min. Luminous intensity @20mA(mcd) Min.Max. Forward voltage @20mA(V) 6.5 3.0 1.7 1.5 2.6 2.4 Lens Peak wave length λPnm 565 660 Emitted MATERIAL Green Red GaP GaAlAs COLOR Spectral halfwidth △λnm Operating Temperature LSRVG2092-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO Storage Temperature Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation 30 mA30 Forward Current IF White Diffused

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 3/6 PART NO. LSRVG2092-PF

Fig.4 Relative Intensity vs. Temperature 1.0 Relative Intensity@20mA Wavelength (nm) 500 0.0 0.5 550600650 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ -40 0.8 -20 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ 804020060100 0.0 2.5 1.5 1.0 2.0 3.0 Ambient Temperature(℃) -40-2002060 40100 80 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Typical Electro-Optical Characteristics Curve PART NO. 2.0 Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) 100 Forward Current(mA) 1.0 0.1 1.0 VG CHIP 1000 Relative Intensity Normalize @20mA 3.04.05.0 4/6Page Forward Current(mA) 1.0101001000 LSRVG2092-PF

60 Seconds Max

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 5°/sec max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 0° 0 25° 120° Preheat 50 100 2°/sec max Temp(°C) 260° 260°C3sec Max Time(sec) 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 5/6 PART NO. LSRVG2092-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=85℃ 2.RH=85% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. PART NO. LSRVG2092-PF