LSRUG31042-P1-PF-TBS-X LIGITEK | Alldatasheet
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DOC. NO : QW0905-LSRUG31042/P1-PF/TBS-X REV. : A DATE : - 201511 - May. BIPOLAR TYPE LED LAMPS LSRUG31042/P1-PF/TBS-X Pb Lead-Free Parts LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 發行 DCC 立碁電子
T Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Anode Green 10.8±0.5 25.0MIN Anode Green Anode Red2.54TYP 1.0MIN 3.86 2.92 1.5MIN 0.5 1.3±0.1 5.3 2.95 3.62 Anode Red SR UG LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions D P1 P F - + LW0 LSRUG31042/P1-PF/TBS-XPART NO. W3W1 Page1/9
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. White Diffused LensEmitted LSRUG31042/P1-PF/TBS-X GaAlAs Red AlGaInP Green COLOR MATERIALPART NO Min.Min.Max. Typ. 2.41.566020 506021 2.65741.7 20 6538 60 Spectral halfwidth △λnm Luminous intensity @20mA(mcd) Forward voltage @20mA(V) Viewing angle 2θ 1/2 (deg) wave length λ nmD Dominant Typical Electrical & Optical Characteristics (Ta=25 ℃) Absolute Maximum Ratings at Ta=25 ℃ Storage Temperature Tstg Ir Reverse Current @5V Operating Temperature Topr Power DissipationPD -40 ~ +100 ℃ μA10 -40 ~ +85 65 100 mW Peak Forward Current Duty 1/10@10KHz IFP Forward Current IF Parameter Symbol RedGreen 75 mA100 25 30 mA Ratings UNIT PART NO. LSRUG31042/P1-PF/TBS-X LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page2/9
Brightness Code For Standard LED Lamps Luminous Intensity(mcd) at 20 mA A11 A10 Group Bin Code SR CHIP 2821 6590 5038 5065 2838 Min.Max. PART NO. LSRUG31042/P1-PF/TBS-X LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page3/9
Min.Max. Wave length(nm) at 20 mA Color Code 3850A9 A13 A11 A12 A10 120160 6590 90120 5065 Brightness Code For Standard LED Lamps Group Bin Code UG CHIP Min.Max. Luminous Intensity(mcd) at 20 mA PART NO. LSRUG31042/P1-PF/TBS-X LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page4/9
Dimension Symbol Information• Component Lead Pitch Front-To-Rear Deflection Tape Feed Hole Diameter Feed Hole To Bottom Of Component Feed Hole To Overall Component Height Lead Length After Component Height Feed Hole Location Adhesive Tape Position Adhesive Tape Width Overall Taped Package Thickness Center Of Component Location Dimensions Symbol Information• REMARK:TBS=Tape And Box Straight Leads LSRUG31042/P1-PF/TBS-X
Description
PART NO. TBS-11 0.8721.0 22.00.83 minimumSymbol maxmum 2.4601.9750H 2500PCS 13.433013.0L340 26510.4W10.8 275 inchmminch mm Package Dimensions• Specification 14.5 17.5 8.5 0W2 0.6115.50.57 4.00 0.6919 0.16 0.75 9.750.330.38 4.4 5.1 12.4 0.235.80.17 7.70.20.3 130.490.51 18.0 20.5 TBS-13 TBS-12 0.7519.00.71 21.50.810.85 SPECIFICATIONS TBS-3 18.4 19.0 24.5 TBS-10 TBS-9 TBS-8 0.7920.00.75 19.40.72 0.76 0.96 25.5 1.0 24.0 19.9 22.5 25.5 TBS-7 TBS-6 TBS-5 0.94 25.0 0.78 20.9 0.98 0.82 23.50.89 1.026.5 0.93 1.04 21.5 17.5 2.3 TBS-2 TBS-1 0.8522.5 0.6918.5 0.89 0.73 0.093.0 0.08 0.12 Minimum 3.8 mm OPTION CODE SYMBOL inchmminch 0.154.20.17 Maximum LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/9
Relative Intensity @20mA Wavelength (nm) 75% 500550600650 100% 50%25%25%050%100% 75% -30° 0.5 -60° 1.0 60° 30° Fig.6 Directivity RadiationFig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Ambient Temperature(℃) Forward Voltage@20mA Normaliz @25℃ Relative Intensity @20mA Normalize @25℃ 1.0 0.5 1.0 0-202040 0.8 8060 0.9 60-20040 20 1.5 2.0 2.5 1.1 1.2 Forward Current(mA) Relative Intensity Normalize @20mA Fig.4 Relative Intensity vs. TemperatureFig.3 Forward Voltage vs. Temperature Forward Voltage(V) Forward Current(mA) 1.0 Typical Electro-Optical Characteristics Curve UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 2.0 PART NO. LSRUG31042/P1-PF/TBS-X LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/9
Relative Intensity@20mA Wavelength (nm) 0.0 600700 650750 0100%75%50%25%25%50%75%100% Ambient Temperature(℃) Ambient Temperature(℃) 0.5 1.0 -60° 60° -30° 30° Fig.5 Relative Intensity vs. Wavelength Fig.6 Directivity Radiation Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize @25℃ 1.0 -40-20 0.8 804020060100 0.9 0.0 -40-2002060 40100 80 0.5 1.1 1.0 1.2 1.5 2.0 2.5 3.0 1.5 Forward Current(mA) Relative Intensity Normalize @20mA Fig.3 Forward Voltage vs. Temperature Forward Voltage(V) Fig.4 Relative Intensity vs. Temperature Forward Current(mA) 2.0 0.1 1.03.04.05.0 1.0 1.010 0.0 1001000 1.0 0.5 100 1000 2.5 2.0 3.0 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage SR CHIP Fig.2 Relative Intensity vs. Forward Current LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRUG31042/P1-PF/TBS-XPART NO. Page7/9
Preheat: 120°C Max Preheat time: 120seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) 25° 2°/sec max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 00° 100Preheat 200 5°/sec max 120° 260° Temp(°C) 260°C3sec Max Time(sec) 250 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile LSRUG31042/P1-PF/TBS-X PART NO. Page 8/9
The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test MIL-STD-202:103B JIS C 7021: B-11 This test intended to see soldering well performed or not. 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solderability Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Thermal Shock Test (10min) (10min) 2.total 10 cycles MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 PART NO. PageLSRUG31042/P1-PF/TBS-X9/9 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Operating Life Test Test ItemTest Condition Description Reliability Test: Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only