LSRSR3363 LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRSR3363 BIPOLAR ROUND TYPE LED LAMPS DOC. NO : QW0905-LSRSR3363-0808 REV. : A DATE : 15 - Nov. - 2007 DATA SHEET
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SR SR 25.0MIN °30 °60 100%75%50%0 25% LSRSR3363PART NO. 1.5 MAX Package Dimensions -30° Directivity Radiation °-60 50%100%75% □0.5 TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25% 2.54TYP 1.0MIN 7.6 8.6 5.0 5.9
3.01.22.41.520660RedGaAlAs PART NO. LSRSR3363 Water Clear 20 20660RedGaAlAs Typ.Max.Min. Min. Forward voltage @20mA(V) Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) Luminous intensity @10mA(mcd) 3.02.41.51.2 COLOR Lens MATERIAL Emitted PART NO LSRSR3363 Peak wave length λPnm 2/5Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA mW 100 Red Ratings 10Ir -40 ~ +85 -40 ~ +100 100 Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Storage Temperature Reverse Current @5V Power Dissipation Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 3/5LSRSR3363PART NO.
LSRSR3363PART NO.
60 Seconds Max
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 5°/sec max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 0° 0 25° 120° Preheat 50 100 2°/sec max Temp(°C) 260° 260°C3sec Max Time(sec) 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 4/5
LSRSR3363PART NO. Page 5/5 Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test ItemTest Condition Operating Life Test Reliability Test: 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
Description
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Thermal Shock Test High Temperature High Humidity Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs