LSRG42292/S11-PF

LSRG42292-S11-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS LSRG42292/S11-PF DATA SHEET - 2009 B 30 - Jun. DOC. NO : QW0905- REV. : DATE : LSRG42292/S11-PF 發行 DCC 立碁電子

60° -60° -30° 30° 1/6Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LSRG42292/S11-PF GSR 231 3.CATHODE GREEN 1.CATHODE RED 2.COMMON ANODE Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 3.0 4.0 4.2 5.2 5.87±0.5 9.8±0.5 2.54TYP2.54TYP □0.5 TYP □0.5 TYP

Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Power Dissipation Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Forward Current Absolute Maximum Ratings at Ta=25 ℃ Storage Temperature Operating Temperature mWPD Topr Tstg Ir μA Parameter Symbol IF IFP Ratings UNIT mA mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 Emitted Max.Min. Spectral halfwidth △λnm Forward voltage @20mA(V) COLOR Lens Dominant wave length λDnm Viewing angle 2θ 1/2 (deg) Typ.Min. Luminous intensity @20mA(mcd)MATERIAL LSRG42292/S11-PF PART NO LSRG42292/S11-PFPART NO. SR G 120 100100 100 -40 ~ +100 -40 ~ +85 GaAlAs GaP 30 90 501.7 2.6Green 565 660Red White Diffused 20 1.5 4.5 2.4 8.0

Relative Intensity@20mA Wavelength (nm) 700600 650 0.0 0.5 750 Relative Intensity@20mA Normalize @25℃ 0.5 Forward Voltage@20mA Normalize @25℃ Fig.5 Relative Intensity vs. Wavelength Ambient Temperature( ℃) 1.0 02 0 4 0-20-40 0.8 Ambient Temperature( ℃) 0-20-4010060 80 0.0 80 10040 6020 Fig.3 Forward Voltage vs. Temperature 1.0 0.9 1.1 1.2 2.5 1.5 1.0 2.0 Fig.4 Relative Intensity vs. Temperature 3.0 Page3/6 Relative Intensity Normalize @20mA Forward Current(mA) 100 Forward Voltage(V) 0.1 1.0 2.0 3.0 1.0 Forward Current(mA) 4.0 5.0 1.0 0.0 100 1000 0.5 1.0 1.5 2.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 1000 SR CHIP Fig.2 Relative Intensity vs. Forward Current 2.5 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRG42292/S11-PFPART NO.

Relative Intensity@20mA Wavelength (nm) 500 0.0 600550 650 0.5 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.5 Relative Intensity vs. Wavelength 1.0 -20-40 0.8 100806040200 Ambient Temperature(℃) 60 8002 0 4 0-40 -20 Ambient Temperature(℃) 0.0 100 1.0 0.9 1.1 Fig.3 Forward Voltage vs. Temperature 1.2 2.5 1.5 1.0 2.0 3.0 Fig.4 Relative Intensity vs. Temperature 4/6Page 100 Relative Intensity Normalize @20mA Forward Current(mA)0.1 1.0 Forward Voltage(V) 2.0 3.0 5.0 4.0 1.0 Forward Current(mA) 101.0 0.0 100 1000 1.5 1.0 0.5 2.0 2.5 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage 1000 G CHIP Fig.2 Relative Intensity vs. Forward Current 3.0 3.5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRG42292/S11-PFPART NO.

Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6

60 Seconds Max

0 Preheat

25° 2°C/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°C/sec max 260°C/3sec Max PART NO. LSRG42292/S11-PF

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, + 72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.

Description

JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. 1.Ta=105 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, + 72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Solder Resistance Test Solderability Test Thermal Shock Test High Temperature High Humidity Test High Temperature Storage Test Low Temperature Storage Test Operating Life Test Reliability Test: Test Item PART NO. LSRG42292/S11-PF