LSRG2092-PF

LSRG2092-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : 11 - Jul.- 2007 A LSRG2092-PF DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS LSRG2092-PF Lead-Free Parts Pb

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions PART NO. LSRG2092-PF Page 1/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 4.2 6.7±0.55.2 2.0MIN 2.54TYP 2.0MIN 1 2 3 2.54TYP □0.5 TYP 1.5 MAX 18.0MIN 4.03.0 1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED GSR 21 3 °30 60° 100%75% °-30 -60°

℃-40 ~ +85 Operating Temperature Topr Viewing angle 2θ 1/2 (deg) Peak wave length λPnm LSRG2092-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 565GaP Green Red Emitted GaAlAs White Diffused 660 Lens 2.61.750906030 Max. 201.52.4 Min. 604.58.0 Typ.Min. Typical Electrical & Optical Characteristics (Ta=25 ℃) MATERIALPART NO COLOR Forward voltage @20mA(V) Spectral halfwidth △λnm Luminous intensity @20mA(mcd) Storage Temperature Tstg -40 ~ +100 ℃ 2/6Page 30 mA30 Forward Current IF Reverse Current @5V Ir Peak Forward Current Duty 1/10@10KHz Power DissipationPD IFP 10 μA 100100 100120 mW mA Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol GSR Ratings UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRG2092-PFPART NO.

Fig.4 Relative Intensity vs. Temperature 1.0 Relative Intensity@20mA Wavelength (nm) 600 0.0 0.5 650700750 Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ -40 0.8 -20 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ 804020060100 0.0 2.5 1.5 1.0 2.0 3.0 Ambient Temperature(℃) -40-2002060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Typical Electro-Optical Characteristics Curve PART NO. 2.0 Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) 100 Forward Current(mA) 1.0 0.1 1.0 SR CHIP 1000 Relative Intensity Normalize @20mA 3.04.05.0 3/6Page Forward Current(mA) 1.0101001000 LSRG2092-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 G CHIP PART NO. Fig.6 Directive Radiation 4/6LSRG2092-PF

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Page 5/6 260° Temp(°C) 260°C3sec Max 150 Time(sec) 2°/sec max 120° 25°

500 Preheat

60 Seconds Max

5°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) LSRG2092-PFPART NO.

MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest Item Test Condition Reliability Test: 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. LSRG2092-PFPART NO.