LSRFVG42293-R1-PF

LSRFVG42293-R1-PF LIGITEK | Alldatasheet

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LSRFVG42293/R1-PFDOC. NO : QW0905- REV. : DATE : 28 - Dec. A - 2005 DATA SHEET LSRFVG42293/R1-PF DUAL COLOR LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LSRFVG42293/R1-PF Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 18.0MIN

1.5 MAX

4.2 6.7±0.5 2.0MIN 2.54TYP 2.0MIN 2.54TYP 2 3 3.0 4.0 5.2 □0.5 TYP 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED 21 3 VG SRF

IF Forward Current 30 mA30 Power Dissipation Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Storage Temperature PART NO Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSRFVG42293/R1-PF Operating Temperature Spectral halfwidth △λnm COLOR Water Clear AlGaInP GaP Red Green MATERIAL Emitted ---- 565 ---- 630 Peak wave length λPnm Lens Dominant wave length λDnm 2.4 2.6 1.5 1.7 5.0 3.0 10.0 5.0 Forward voltage @20mA(V) Max.Min. Luminous intensity @20mA(mcd) Min. Typ. Viewing angle 2θ 1/2 (deg) -40 ~ +100 -40 ~ +85 Tstg Topr PD Ir IFP 90 mA mW μA 120 100 Absolute Maximum Ratings at Ta=25 ℃ PART NO. Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter Symbol SRF UNIT Page VG Electrostatic Discharge( * ) ESD2000 V---- Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LSRFVG42293/R1-PF

Ambient Temperature(℃) Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ -40 0.8 -2020 04060 0.9 1.0 1.2 1.1 Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ 0.0 80100-40-20 020 3.0 2.5 2.0 1.0 1.5 0.5 100604080 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage SRF CHIP Forward Current(mA) Forward Voltage(V) 0.1 1.02.0 1.0 3.04.0 100 1000 Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA 1.5 1.0 0.5 0.0 5.01.010 3.0 2.5 2.0 1001000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Wavelength (nm) 600550 0.0 0.5 650 1.0 700 PART NO. 3/6 PageLSRFVG42293/R1-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 VG CHIP 3.5 PART NO. 4/6 PageLSRFVG42293/R1-PF

60 Seconds Max

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Page 5/6LSRFVG42293/R1-PF

MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Solder Resistance Test Solderability Test Thermal Shock Test Low Temperature Storage Test High Temperature High Humidity Test High Temperature Storage Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test: Test Item PART NO. Test Condition Description Reference Standard Page 6/6LSRFVG42293/R1-PF