LSRFSBKS42292-W111 LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb - 2013 A 04 - Jan. DOC. NO : QW0905- REV. : DATE : LSRFSBKS42292-W111 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LSRFSBKS42292-W111 Package Dimensions PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 4.2 5.2 3.0±0.5 5.0±0.5 4.0 3.0 - + - 13 2 LSRFSBKS42292/S31-PF 160±5 White Wire 4.0 3.0 15±2 Black Wire Red Wire 4.0 3.0 115±5 6.85 6.5 15±2 Black Wire White Wire Red Wire 1.CATHODE RED 2.COMMON ANODE 3.CATHODE BLUE SBKSSRF SRFSBKS 1.CATHODE RED 2.COMMON ANODE 3.CATHODE BLUE

-20 ~ +80 ℃ Operating Temperature Topr Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Storage Temperature Tstg -30 ~ +100 ℃ SBKSSRF Power DissipationPD Electrostatic Discharge( * ) Reverse Current @5V ESD Ir Peak Forward Current Duty 1/10@10KHz Forward Current IFP IF 120 mW75 10002000 V 5010 μA 10090 mA 3030 mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol UNIT Page 2/6 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LSRFSBKS42292-W111PART NO. Dominant wave length λDnm Viewing angle 2θ 1/2 (deg) 640 480 Max. LSRFSBKS42292-W111 468 Emitted AlGaInP 620 Lens Min. 153.526 4.2 50 70 Min. 2120 2.4 Typ. Max. 65 70 Typ. PART NO MATERIAL COLOR Luminous intensity @20mA(mcd) Spectral halfwidth △λnm Forward voltage @10mA(V) InGaN/SiC Red Blue White Diffused Min. 1.5 ---- ----

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Wavelength (nm) Relative Intensity@20mA 0.0 550600 0.5 Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 40020 1.1 1.0 0.9 1.2 700650 Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ 0.5 -401008060 0.0 0-20 406020 1.5 1.0 2.0 2.5 3.0 80100 Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) 100 2.01.0 0.1 3.0 1.0 SRF CHIP 1000 Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA 1.04.05.0 0.0 0.5 1.0 1.5 2.0 Forward Current(mA) 10100 2.5 3.0 1000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/6PageLSRFSBKS42292-W111PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.25 1.5 Fig.2 Relative Intensity vs. Forward Current 20101525 30 0.5 0.75 0.25 Forward Voltage(V) 50345 Forward Current(mA) Relative Intensity Normalize @20mA 1.0 SBK-S CHIP Forward Current(mA) Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage 1.0 0.5 Fig.4 Relative Intensity vs. Wavelength Wavelength (nm) 7550100 Relative Intensity@20mA 580 380 480 480 430 530 630 680 Forward Current@20mA Fig.3 Forward Current vs. Temperature Ambient Temperature(℃) 4/6LSRFSBKS42292-W111PART NO.

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

120° Preheat 25° 0° 0 2°/sec max 260° Time(sec) 100 150 5°/sec max 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(°C) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Page 5/6 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRFSBKS42292-W111PART NO.

Reliability Test: Operating Life Test Low Temperature Storage Test High Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Solderability Test Solder Resistance Test MIL-STD-883:1008 JIS C 7021: B-10 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12

Description

This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6LSRFSBKS42292-W111PART NO.