LSRFSBKS2062-R1 LIGITEK | Alldatasheet

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DOC. NO : QW0905-LSRFSBKS2062/R1 REV. : A DATE : 22 - May - 2007 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts BIPOLAR TYPE LED LAMPS

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3.0 4.0 SRF SBKS □0.5 TYP 1.5MAX 5.24.2 1/5PageLSRFSBKS2062/R1PART NO. Package Dimensions 1 2 1.0MIN 2.54TYP 30° -30° -60° 60° Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 25.0MIN

500 V2000 Electrostatic Discharge( * ) ESD

△λnm Dominant wave length λDnm Viewing angle 2θ 1/2 (deg) PART NO MATERIAL Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Blue InGaN/SiC AlGaInP LSRFSBKS2062/R1 Red White Diffused Emitted Lens ---- 3.5 70160904.226475 2.4 Max. 20630 1.5 ---- Typ.Min. 16035070 Min. Typ. Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Storage Temperature Operating Temperature Topr Tstg -20 ~ +85 -30 ~ +100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SBKSSRF Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Ir PD Forward Current IF IFP 120 10 10 μA mW 100 3030 mA mA Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Ratings UNIT Page 2/6 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO.LSRFSBKS2062/R1

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Wavelength (nm) Relative Intensity@20mA 0.0 550600 0.5 Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 40020 1.1 1.0 0.9 1.2 700650 Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ 0.5 -401008060 0.0 0-20 406020 1.5 1.0 2.0 2.5 3.0 80100 Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) 100 2.01.0 0.1 3.0 1.0 SRF CHIP 1000 Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA 1.04.05.0 0.0 0.5 1.0 1.5 2.0 Forward Current(mA) 10100 2.5 3.0 1000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/6PagePART NO.LSRFSBKS2062/R1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.25 1.5 Fig.2 Relative Intensity vs. Forward Current 20101525 30 0.5 0.75 0.25 Forward Voltage(V) 50345 Forward Current(mA) Relative Intensity Normalize @20mA 1.0 SBK-S CHIP Forward Current(mA) Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage 1.0 0.5 Fig.4 Relative Intensity vs. Wavelength Wavelength (nm) 7550100 Relative Intensity@20mA 580 380 480 480 430 530 630 680 Forward Current@20mA Fig.3 Forward Current vs. Temperature Ambient Temperature(℃) PART NO.LSRFSBKS2062/R1

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 120°

60 Seconds Max

0°0 25° Preheat 2°/sec max 50 100 260° Temp(°C) 260°C3sec Max 5°/sec max Time(sec) 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 5/6 Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO. LSRFSBKS2062/R1

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to see soldering well performed or not. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles Thermal Shock Test High Temperature High Humidity Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. Reference Standard JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reliability Test: Test Item Test Condition Description Page 6/6PART NO.LSRFSBKS2062/R1