LSRF9UG42292/P1-PF

LSRF9UG42292-P1-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DUAL COLOR LED LAMPS LSRF9UG42292/P1-PF DATA SHEET - 2007 A 14 - Sep. DOC. NO : QW0905- REV. : DATE : LSRF9UG42292/P1-PF

1.ANODE GREEN 2.COMMON CATHODE 3.ANODE RED 21 3 9UG SRF 1/6Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Package Dimensions LSRF9UG42292/P1-PF 60° 100%50%0 25% -60° 50%100%75% 25% 75% -30° 30° Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 5.24.2

1.5 MAX

4.0 3.0 2.0MIN 2.54TYP 2.0MIN 2.54TYP ∅0.5 TYP 18.0MIN 123 11.55±0.5

℃Topr -40 ~ +85 Operating Temperature Viewing angle 2θ 1/2 (deg) Dominant wave length λDnm Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 574 630 Green AlGaInP LSRF9UG42292/P1-PF White Diffused Red Emitted Lens 160652.61.7 1.5202.465 Min.Min.Max. 12060 Typ. Typical Electrical & Optical Characteristics (Ta=25 ℃) MATERIALPART NO COLOR Luminous intensity @20mA(mcd) Spectral halfwidth △λnm Forward voltage @20mA(V) Storage Temperature Tstg -40 ~ +100 ℃ Page 2/6 30 30 mAIF Forward Current Reverse Current @5V Electrostatic Discharge( * ) ESD Ir Peak Forward Current Duty 1/10@10KHz Power DissipationPD IFP 2000 1010 V μA 7575 9060 mW mA Absolute Maximum Ratings at Ta=25 ℃ Absolute Maximum Ratings Parameter Symbol SRF9UG UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only AlGaInP 2060 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LSRF9UG42292/P1-PFPART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Wavelength (nm) Relative Intensity@20mA 0.0 550600 0.5 Forward Voltage@20mA Normalize @25℃ 1.0 -20-40 0.8 40020 1.1 1.0 0.9 1.2 700650 Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ 0.5 -401008060 0.0 0-20 406020 1.5 1.0 2.0 2.5 3.0 80100 Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) 100 2.01.0 0.1 3.0 1.0 SRF CHIP 1000 Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA 1.04.05.0 0.0 0.5 1.0 1.5 2.0 Forward Current(mA) 10100 2.5 3.0 1000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/6PageLSRF9UG42292/P1-PFPART NO.

Normalize @20mA Forward Current(mA) 3.0 2.5 2.0 1.5 1.0 0.5 Fig.4 Relative Intensity vs. Temperature Wavelength (nm) Relative Intensity @20mA 500 0.5 1.0 550 600 650 2.0 Forward Voltage(V) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normaliz @25℃ -20-40 0.9 0.8 1.0 1.2 1.1 1.0 0.1 Relative Intensity @20mA Normalize @25℃ 806040020100 3.04.05.0 Ambient Temperature(℃) 020-40-2060100 8040 Forward Current(mA) 1.0101001000 3.0 2.5 2.0 1.5 1.0 0.5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage 1.0 100 1000 9UG CHIP 4/6Page LSRF9UG42292/P1-PFPART NO.

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

00° 10050Preheat 25° 2°/sec max 120° 150 Time(sec) 260° 5°/sec max 260°C3sec Max Temp(°C) Page 5/6 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRF9UG42292/P1-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Page 6/6 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. LSRF9UG42292/P1-PFPART NO.