LSRF3333

LSRF3333 LIGITEK | Alldatasheet

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Technical content

DOC. NO : QW0905-LSRF3333/F5-PF-08 REV. : A DATE : 19 - Aug. - 2009 SUPER BRIGHT ROUND TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET 發行 DCC 立碁電子

5.95.0 1.5MAX 8.67.6 2.54TYP + - 4.0±0.5 PART NO. LSRF3333/F5-PFPage 1/5 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 30° -30° -60° Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 100% 60°

Duty 1/10@10KHz Reverse Current @5V Storage Temperature PART NO Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LSRF3333/F5-PF Operating Temperature Spectral halfwidth △λnm COLOR Water ClearAlGaInP Red MATERIAL Emitted 630 Lens Dominant wave length λDnm 2.41.5450700 Forward voltage @20mA(V) Max.Min. Luminous intensity @20mA(mcd) Min. Typ. Viewing angle 2θ 1/2 (deg) -40 ~ +100 -40 ~ +85 Tstg Topr PD Ir IFP 75 mA mW μA Absolute Maximum Ratings at Ta=25 ℃ Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Parameter Symbol Red UNIT Page2/5 Electrostatic Discharge( * ) ESD2000 V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO. LSRF3333/F5-PF

Fig.3 Forward Voltage vs. Temperature Ambient Temperature(℃) Forward Voltage@20mA Normalize @25℃ -20 0.8 40020 1.1 1.0 0.9 1.2 Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ 0.5 8060 0.0 0-20 406020 1.5 1.0 2.0 2.5 Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) 2.01.0 3.0 SRF CHIP Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA 1.0 0.0 1.0 2.0 Forward Current(mA) 101001000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Wavelength (nm) 600550 0.0 0.5 650 1.0 700 0.501.52.5 PART NO. LSRF3333/F5-PF

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5

60 Seconds Max

0 Preheat

25° 2°/sec max 10050 150 Time(sec) Temp(°C) 120° 260° 5°/sec max 260°C3sec Max PART NO. LSRF3333/F5-PF

Description

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. High Temperature High Humidity Test Solder Resistance Test Thermal Shock Test Low Temperature Storage Test High Temperature Storage Test Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Operating Life Test Test Item MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard 5/5Page PART NO. LSRF3333/F5-PF