LSRDGM22841-S10

LSRDGM22841-S10 LIGITEK | Alldatasheet

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A - 200502 - Nov. LSRDGM22841/S10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LSRDGM22841/S10 BIPOLAR TYPE LED LAMPS DATA SHEET DOC. NO : QW0905- REV. : DATE :

30°-30° 0° Horizontal Axis 74°Vertical Axis 116° 60°-60° 4.0 1.5MAX 6.3 3.8 2.54TYP 1.0MIN □0.5 TYP 25.0MIN 1/5PageLSRDGM22841/S10PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 1 2 DGM SR

Axis74° Horizontal Axis116° LSRDGM22841/S10 COLOR Lens GaAlAs MATERIAL LSRDGM22841/S10 PART NO Red Emitted ---( * ) Luminous intensity @20mA(mcd) Typ. Spectral halfwidth △λnm --- Dominant wave length λDnm 2.4 Max. Forward voltage @20mA(V) 1.5 Min. ---( * ) Min. Viewing angle 2θ1/2 (deg) 2/4Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA V mW 100 SR Ratings --- Ir -20 ~ +80 Max 260℃ for 5 sec Max (2mm from body) -30 ~ +100 100 PART NO. Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Soldering Temperature Storage Temperature Electrostatic Discharge( * ) Reverse Current @5V Power Dissipation Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol ESD Tsol Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. DGM 100 120 150 InGaN/GaN Green Green Transparent 525 36 --- 4.0350660 Peak wave length λPnm 660 518 Typ. --- 3.5 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. SR Chip Only Electrical Cogitation and no Luminous intensity Cogitation

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-4040 20080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 SR CHIP Page 3/5 PART NO.LSRDGM22841/S10

Page4/5 PART NO. DGM CHIP 500 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 8002040-40-20 0.9 0.8 10080 5.04.03.02.0 1.0 0.5 0.0 600550450 1.2 1.1 1.0 6040200-20-40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000100101.0 1000 100 1.0 0.1 1.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Typical Electro-Optical Characteristics Curve Relative Intensity@20mA Normalize @25℃ Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Wavelength (nm) Relative Intensity@20mA Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature LSRDGM22841/S10

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hous. This test intended to see soldering well performed or not. LSRDGM22841/S10 PART NO.